公开(公告)号：US10229352B2

公开(公告)日：2019-03-12

申请号：US14549578

申请日：2014-11-21

Applicant: Infineon Technologies AG

Inventor： Martin Klimke ,  Berndt Gammel ,  Frank Pueschner ,  Peter Stampka

IPC: G06K19/06 ,  H01L29/18 ,  H01L33/00 ,  G06K19/073 ,  G06K19/077

Abstract: One embodiment describes a chip arrangement having a chip carrier; a chip which is arranged in or on the chip carrier; a light sensor arrangement; a transparent layer which covers the light sensor arrangement, the light sensor arrangement being set up to determine a light pattern of light received by the light sensor arrangement from outside the chip arrangement through the transparent layer; and a test circuit which is set up to check whether the light pattern matches a reference light pattern and to output a signal on the basis of the result of the check.

公开(公告)号：US09672459B2

公开(公告)日：2017-06-06

申请号：US14771240

申请日：2014-02-27

Applicant: Infineon Technologies AG ,  Bundesdruckerei GmbH

Inventor： Frank Pueschner ,  Joerg Fischer ,  Juergen Hoegerl ,  Peter Stampka ,  Markus Tietke ,  Stefan Troelenberg

IPC: G06K19/00 ,  G06K19/077 ,  G06K19/073

CPC classification number: G06K19/07705 ,  G06K19/07309 ,  G06K19/07722 ,  G06K19/07749 ,  G06K19/07754

Abstract: In various embodiments, a chip card module is provided that can have: a chip card module support; a wiring structure that is arranged on the chip card module support; an integrated circuit that is arranged on the chip card module support and is electrically coupled to the wiring structure; a chip card module antenna that is arranged on the chip card module support and is electrically coupled to the wiring structure, and a lighting device that is arranged on the chip card module support and is electrically coupled to the wiring structure.

公开(公告)号：US20160111787A1

公开(公告)日：2016-04-21

申请号：US14519166

申请日：2014-10-21

Applicant: Infineon Technologies AG

Inventor： Petteri Palm ,  Martin Buchsbaum ,  Josef Gruber ,  Juergen Hoelzl ,  Frank Pueschner ,  Peter Stampka

IPC: H01Q7/08

CPC classification number: H01Q7/08 ,  H01Q1/243 ,  H01Q21/24

Abstract: According to one embodiment, a hybrid antenna is described comprising a plurality of windings wherein each winding comprises a loop antenna portion arranged in a plane and a ferrite antenna portion arranged at least partially outside of the plane.

Abstract translation: 根据一个实施例，描述了包括多个绕组的混合天线，其中每个绕组包括布置在平面中的环形天线部分和至少部分地布置在平面外部的铁氧体天线部分。

公开(公告)号：US09135549B2

公开(公告)日：2015-09-15

申请号：US14287265

申请日：2014-05-27

Applicant: Infineon Technologies AG

Inventor： Juergen Hoegerl ,  Frank Pueschner ,  Peter Stampka

IPC: G06K19/00 ,  G06K19/06 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  G06K19/077 ,  H01L23/538

CPC classification number: G06K19/07707 ,  G06K19/07749 ,  G06K19/07775 ,  H01L23/5386 ,  H01L23/5388 ,  H01L2224/16225 ,  H01L2924/12044 ,  H01L2924/00

Abstract: A smart card module includes a carrier; a chip arrangement arranged over a first side of the carrier; and an antenna arranged over a second side of the carrier, wherein the second side of the carrier is opposite the first side of the carrier. The antenna is electrically conductively connected to the chip arrangement in order to transmit electrical signals. The smart card module further includes a display module arranged over the first side of the carrier; and at least one electrical line structure arranged on the first side of the carrier, which electrical line structure electrically conductively connects the chip arrangement and the display module to one another.

Abstract translation: 智能卡模块包括载体; 布置在所述载体的第一侧上的芯片布置; 以及布置在所述载体的第二侧上的天线，其中所述载体的第二侧与所述载体的第一侧相对。 天线导电地连接到芯片布置，以便传输电信号。 智能卡模块还包括布置在载体的第一侧上的显示模块; 以及布置在所述载体的第一侧上的至少一个电线结构，所述电线结构将所述芯片布置和所述显示模块彼此导电地连接。

公开(公告)号：US20140084070A1

公开(公告)日：2014-03-27

申请号：US13625888

申请日：2012-09-25

Applicant: INFINEON TECHNOLOGIES AG

Inventor： Frank Pueschner ,  Siegfried Hoffner ,  Peter Stampka ,  Wolfgang Schindler ,  Stephan Rampetzreiter

IPC: G06K19/02 ,  H05K13/00 ,  G06K19/077

CPC classification number: G06K7/10178 ,  Y10T29/49018

Abstract: According to one embodiment, a chip card is provided comprising a booster antenna wherein the booster antenna comprises a material having an electrical resistivity of at least 0.05 Ohm*mm2/m.

Abstract translation: 根据一个实施例，提供了包括增强天线的芯片卡，其中所述增强天线包括具有至少0.05欧姆* mm 2 / m的电阻率的材料。

公开(公告)号：US20130082112A1

公开(公告)日：2013-04-04

申请号：US13631929

申请日：2012-09-29

Applicant: INFINEON TECHNOLOGIES AG

Inventor： Frank Pueschner ,  Kristof Bothe ,  Juergen Hoegerl ,  Andreas Karl ,  Andreas Mueller-Hipper ,  Peter Scherl ,  Peter Stampka ,  Uwe Wagner

IPC: G06K19/077 ,  B32B37/12

CPC classification number: G06K19/07747

Abstract: The present invention describes a smart card module for a smart card, comprising a first laminate layer, a chip having electric contacts, a first conductive layer, wherein the electrical contacts of the chip are connected to the conductive layer and the first conductive layer is arranged between the chip and the first laminate layer, and wherein the smart card module furthermore comprises an adhesive means, wherein the adhesive means is arranged between the chip and the first conductive layer and/or the first laminate layer.

Abstract translation: 本发明描述了一种用于智能卡的智能卡模块，包括第一层压层，具有电触点的芯片，第一导电层，其中芯片的电触点连接到导电层，第一导电层被布置 在所述芯片和所述第一层压层之间，并且其中所述智能卡模块还包括粘合剂装置，其中所述粘合剂装置布置在所述芯片和所述第一导电层和/或所述第一层压层之间。

公开(公告)号：US20220225684A1

公开(公告)日：2022-07-21

申请号：US17574105

申请日：2022-01-12

Applicant: Infineon Technologies AG

Inventor： Frank Pueschner ,  Thomas Lehmann ,  Jens Pohl ,  Thomas Spoettl ,  Peter Stampka

IPC: A24F40/53 ,  A24F40/20 ,  A24D1/20 ,  A24D1/02 ,  B65D85/20 ,  B65D25/00

Abstract: A set of devices is provided for an electronic cigarette. The set of devices has a first device and a second device, wherein the first device has an authentication device which is configured to authenticate the first device and the second device in relation to a control element of the electronic cigarette. The set of devices further has an identifier which indicates that the first device has the authentication device for authenticating the first device and the second device, wherein the second device is without an identifier which indicates that the second device has the authentication device for authenticating the first device and the second device.

公开(公告)号：US20210303962A1

公开(公告)日：2021-09-30

申请号：US17217643

申请日：2021-03-30

Applicant: Infineon Technologies AG

Inventor： Frank Pueschner ,  Michael Huber ,  Thomas Spoettl ,  Peter Stampka

IPC: G06K19/077

Abstract: A chip card having a chip card body with a first recess, and a chip module arranged in the recess, wherein the chip module is arranged with a distance of at most 20 μm between the chip module surface facing the bottom of the recess and the bottom of the recess, wherein the chip card body has a layer thickness from the bottom of the recess up to a surface of the chip card body facing away from the bottom of the recess of at least 200 μm.

公开(公告)号：US10223629B2

公开(公告)日：2019-03-05

申请号：US15726417

申请日：2017-10-06

Applicant: Infineon Technologies AG

Inventor： Thomas Spoettl ,  Frank Pueschner ,  Peter Stampka ,  Mathias Belzner ,  Ralph Domnick ,  Daniel Weiss

IPC: G06K19/06 ,  G06K19/07 ,  G06K19/077 ,  H01L23/498

Abstract: In various embodiments, a smart card module is provided. The smart card module may include an electronic circuit in or on a carrier, a smart card module contact layer, which is coupled to the electronic circuit and provides a plurality of smart card module contacts, a mirror layer on the smart card module contact layer, said mirror layer at least partly covering the smart card module contacts, and an optically translucent, electrically conductive oxide layer, which covers the mirror layer. The optically translucent, electrically conductive oxide layer includes a plurality of regions of different layer thicknesses for providing different color components.

公开(公告)号：US20190033206A1

公开(公告)日：2019-01-31

申请号：US16043824

申请日：2018-07-24

Applicant: Infineon Technologies AG

Inventor： Thomas Spoettl ,  Mathias Belzner ,  Ralph Domnick ,  Jens Pohl ,  Frank Pueschner ,  Peter Stampka ,  Daniel Weiss

IPC: G01N21/25 ,  G02B5/08 ,  G06K19/06 ,  G06K19/07

CPC classification number: G01N21/255 ,  B42D25/305 ,  B42D25/324 ,  B42D25/351 ,  B42D25/36 ,  B42D25/373 ,  G01N21/251 ,  G02B5/0875 ,  G06K19/06009 ,  G06K19/06028 ,  G06K19/06037 ,  G06K19/07 ,  G06K19/0723

Abstract: In various exemplary embodiments, a smart card module is provided. The smart card module includes a carrier and a layer stack at least partly covering the carrier. The layer stack includes a reflection layer, a light-transmissive layer arranged above the reflection layer, and a partly light-transmissive silver layer arranged above the light-transmissive layer. The partly light-transmissive silver layer is configured for reflecting part of light impinging on the partly light-transmissive silver layer.