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    ELECTRONIC IDENTIFICATION DOCUMENT
    12.
    发明申请
    ELECTRONIC IDENTIFICATION DOCUMENT 审中-公开

    公开(公告)号：US20180025192A1

    公开(公告)日：2018-01-25

    申请号：US15644863

    申请日：2017-07-10

    Applicant: Infineon Technologies AG

    Inventor： Frank Pueschner ,  Jens Pohl ,  Thomas Spoettl ,  Peter Stampka

    IPC: G06K7/10

    CPC classification number: G06K7/10366

    Abstract: An electronic identification document is provided. The electronic identification document may include a carrier, an identification element, a microwave interaction structure configured to interact with microwave radiation, and an alteration element, wherein the alteration element may be part of or in contact with the microwave interaction structure and may be configured to alter, upon interaction of the interaction structure with microwaves, its state from an initial state to a permanent altered state, wherein the permanent altered state may differ from the initial state by a change of the alteration element in color, brightness, saturation, and/or transparency.

    CHIP CARD AND METHOD FOR PRODUCING A CHIP CARD
    15.
    发明申请
    CHIP CARD AND METHOD FOR PRODUCING A CHIP CARD 有权

    公开(公告)号：US20210303962A1

    公开(公告)日：2021-09-30

    申请号：US17217643

    申请日：2021-03-30

    Applicant: Infineon Technologies AG

    Inventor： Frank Pueschner ,  Michael Huber ,  Thomas Spoettl ,  Peter Stampka

    IPC: G06K19/077

    Abstract: A chip card having a chip card body with a first recess, and a chip module arranged in the recess, wherein the chip module is arranged with a distance of at most 20 μm between the chip module surface facing the bottom of the recess and the bottom of the recess, wherein the chip card body has a layer thickness from the bottom of the recess up to a surface of the chip card body facing away from the bottom of the recess of at least 200 μm.

    Multicolored logo on smart card modules
    16.
    发明授权
    Multicolored logo on smart card modules 有权

    公开(公告)号：US10223629B2

    公开(公告)日：2019-03-05

    申请号：US15726417

    申请日：2017-10-06

    Applicant: Infineon Technologies AG

    Inventor： Thomas Spoettl ,  Frank Pueschner ,  Peter Stampka ,  Mathias Belzner ,  Ralph Domnick ,  Daniel Weiss

    IPC: G06K19/06 ,  G06K19/07 ,  G06K19/077 ,  H01L23/498

    Abstract: In various embodiments, a smart card module is provided. The smart card module may include an electronic circuit in or on a carrier, a smart card module contact layer, which is coupled to the electronic circuit and provides a plurality of smart card module contacts, a mirror layer on the smart card module contact layer, said mirror layer at least partly covering the smart card module contacts, and an optically translucent, electrically conductive oxide layer, which covers the mirror layer. The optically translucent, electrically conductive oxide layer includes a plurality of regions of different layer thicknesses for providing different color components.

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