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    Small form factor transmitting device
    12.
    发明授权
    Small form factor transmitting device 有权
    小型发射装置

    公开(公告)号：US09548817B1

    公开(公告)日：2017-01-17

    申请号：US14745316

    申请日：2015-06-19

    Applicant: INPHI CORPORATION ,  Luxnet Corporation

    Inventor： Radhakrishnan L. Nagarajan ,  Peng-Chih Li ,  Pi-Cheng Law

    IPC: H04B10/50 ,  G02B6/42 ,  H01S5/00 ,  H01S5/022 ,  H01S5/024 ,  H01S5/068 ,  H01S5/0683

    CPC classification number: H01S5/0612 ,  G02B6/4204 ,  G02B6/4212 ,  G02B6/4215 ,  G02B6/4271 ,  G02B6/4287 ,  G02B6/4296 ,  H01S5/0064 ,  H01S5/0224 ,  H01S5/02248 ,  H01S5/02284 ,  H01S5/02288 ,  H01S5/02415 ,  H01S5/02438 ,  H01S5/068 ,  H01S5/125 ,  H04B10/501

    Abstract: A packaged transmitter device includes a base member comprising a planar part mounted with a thermoelectric cooler, a transmitter, and a coupling lens assembly, and an assembling part connected to one side of the planar part. The device further includes a circuit board bended to have a first end region and a second end region being raised to a higher level. The first end region disposed on a top surface of the planar part includes multiple electrical connection patches respectively connected to the thermoelectric and the transmitter. The second end region includes an electrical port for external connection. Additionally, the device includes a cover member disposed over the planar part. Furthermore, the device includes a cylindrical member installed to the assembling part for enclosing an isolator aligned to the coupling lens assembly along its axis and connected to a fiber to couple optical signal from the transmitter to the fiber.

    Abstract translation: 包装的发射机装置包括基座部件，该基部部件包括安装有热电冷却器的平面部分，发射器和耦合透镜组件，以及连接到平面部分的一侧的组装部件。 该装置还包括弯曲成具有第一端部区域和第二端部区域的电路板，该第二端部区域被升高到更高的电平。 布置在平面部分的顶表面上的第一端区包括分别连接到热电和发射器的多个电连接片。 第二端区域包括用于外部连接的电气端口。 另外，该装置包括设置在平面部分上的盖构件。 此外，该装置包括安装到组装部分的圆柱形构件，用于围绕沿其轴线对准耦合透镜组件的隔离器并且连接到光纤以将来自发射器的光信号耦合到光纤。

    Package structure for photonic transceiving device
    13.
    发明授权
    Package structure for photonic transceiving device 有权

    公开(公告)号：US10025046B2

    公开(公告)日：2018-07-17

    申请号：US15672693

    申请日：2017-08-09

    Applicant: INPHI CORPORATION

    Inventor： Radhakrishnan L. Nagarajan ,  Peng-Chih Li ,  Masaki Kato

    IPC: H04B10/00 ,  G02B6/42 ,  H04B10/40

    Abstract: A photonic transceiver apparatus in QSFP package. The apparatus includes a case having a base member, two partial side members, and a lid member to provide a spatial volume with an opening at a back end of the base member. Additionally, the apparatus includes a PCB, installed inside the spatial volume over the base member having a pluggable electrical connector at the back end. Further, the apparatus includes multiple optical transmitting devices in mini-transmit-optical-sub-assembly package, each being mounted on a common support structure and having a laser output port in reversed orientation toward the back end. Furthermore, the apparatus includes a silicon photonics chip, including a fiber-to-silicon attachment module, mounted on the PCB and coupled to a modulation driver module and a trans-impedance amplifier module. Moreover, the apparatus includes a pair of optical input/output ports being back connected to the fiber-to-silicon attachment module.

    Package structure for photonic transceiving device
    14.
    发明授权
    Package structure for photonic transceiving device 有权

    公开(公告)号：US09759877B2

    公开(公告)日：2017-09-12

    申请号：US15375042

    申请日：2016-12-09

    Applicant: INPHI CORPORATION

    Inventor： Radhakrishnan L. Nagarajan ,  Peng-Chih Li ,  Masaki Kato

    IPC: H04B10/00 ,  G02B6/42 ,  H04B10/40

    CPC classification number: G02B6/4246 ,  G02B6/421 ,  G02B6/4215 ,  G02B6/4249 ,  G02B6/4256 ,  G02B6/4278 ,  G02B6/428 ,  G02B6/4292 ,  H04B10/40 ,  H04B10/516

    Abstract: A photonic transceiver apparatus in Quad Small Form-factor Pluggable (QSFP) package. The apparatus includes a case having a base member, two partial side members, and a lid member to provide a spatial volume with an opening at a back end of the base member. Additionally, the apparatus includes a printed circuit board (PCB), installed inside the spatial volume over the base member having a pluggable electrical connector at the back end. Further, the apparatus includes multiple optical transmitting devices in mini-transmit-optical-sub-assembly package, each being mounted on a common support structure and having a laser output port in reversed orientation toward the back end. Furthermore, the apparatus includes a silicon photonics chip, including a fiber-to-silicon attachment module, mounted on the PCB and coupled to a modulation driver module and a trans-impedance amplifier module. Moreover, the apparatus includes a pair of optical input/output ports being back connected to the fiber-to-silicon attachment module.

    Photonic transceiving device package structure
    15.
    发明授权
    Photonic transceiving device package structure 有权
    光子收发器封装结构

    公开(公告)号：US09496959B1

    公开(公告)日：2016-11-15

    申请号：US14789290

    申请日：2015-07-01

    Applicant: Inphi Corporation

    Inventor： Radhakrishnan L. Nagarajan ,  Peng-Chih Li ,  Masaki Kato

    IPC: H04B10/00 ,  G02B6/12 ,  H04B10/40 ,  H04J14/02 ,  H04B10/516

    CPC classification number: G02B6/4257 ,  G02B6/30 ,  G02B6/421 ,  G02B6/4243 ,  G02B6/4246 ,  G02B6/4251 ,  G02B6/4271 ,  G02B6/428 ,  G02B6/4284 ,  G02B6/4286 ,  G02B6/4292 ,  G02F1/2255 ,  G02F2001/212 ,  H04B10/40 ,  H04B10/516 ,  H04J14/02

    Abstract: The apparatus includes a case having a base member, two partial side members, and a lid member to provide a spatial volume with an opening at a back end of the base member. Additionally, the apparatus includes a PCB installed inside the spatial volume over the base member with a pluggable connector at the back end. The apparatus includes one or more optical transmitting devices in transmit-optical-sub-assembly package, each being mounted upside-down on the PCB and including a built-in TEC module in contact with the lid member and a laser output port aiming toward the back end. Furthermore, the apparatus includes a silicon photonics chip including a fiber-to-silicon attachment module, mounted on the PCB and coupled to a modulation driver module and a trans-impedance-amplifier module. Moreover, the apparatus includes an optical input port and output port being back connected to the fiber-to-silicon attachment module.

    Abstract translation: 该装置包括具有底座构件，两个部分侧构件和盖构件的壳体，以在基座构件的后端提供具有开口的空间体积。 此外，该设备包括安装在基座部件上方的空间体积内的PCB，后端具有可插拔连接器。 该装置包括一个或多个透射 - 光学 - 组件封装中的光学传输装置，它们分别安装在PCB上，并且包括与盖构件接触的内置TEC模块和朝向 后端 此外，该装置包括硅光子芯片，其包括安装在PCB上的光纤至硅附着模块，并耦合到调制驱动器模块和跨阻抗放大器模块。 此外，该装置包括光输入端口和输出端口，其被连接到光纤到硅附接模块。

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