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    CHASSIS EMBEDDED HEAT PIPE
    11.
    发明申请
    CHASSIS EMBEDDED HEAT PIPE 审中-公开

    公开(公告)号：US20190324507A1

    公开(公告)日：2019-10-24

    申请号：US16455323

    申请日：2019-06-27

    Applicant: Intel Corporation

    Inventor： Mark Carbone ,  Juha Tapani Paavola ,  Nicholas R. Weber

    IPC: G06F1/20 ,  H05K7/20 ,  G06F1/16

    Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include one or more heat sources, a heat pipe embedded in a chassis of the electronic device, where the heat pipe is thermally coupled to the one or more heat sources to collect heat from the one or more heat sources, and a thermal cooling device, where the thermal cooling device is thermally coupled to the heat pipe and can dissipate heat collected from the heat pipe using air from outside the chassis. In an example, the heat pipe is an oscillating heat pipe and has a thickness between about two (2) millimeters to about twelve (12) millimeters.

    Heat pipe for improved thermal performance at cold plate interface
    13.
    发明授权
    Heat pipe for improved thermal performance at cold plate interface 有权

    公开(公告)号：US12262508B2

    公开(公告)日：2025-03-25

    申请号：US17127355

    申请日：2020-12-18

    Applicant: Intel Corporation

    Inventor： Juha Paavola ,  Columbia Mishra ,  Justin Huttula ,  Mark Carbone

    IPC: H05K7/20 ,  B23P15/26 ,  G06F1/20

    Abstract: Disclosed embodiments are relate to heat transfer devices or heat exchangers for computing systems, and in particular, to heat pipes for improved thermal performance at a cold plate interface. A thermal exchange assembly includes a heat pipe (HP) directly coupled to a cold plate. The HP includes a window, which is a recessed or depressed portion of the HP. The window is attached to the cold plate at a window section of the cold plate. The cold plate is configured to be placed on a semiconductor device that generates heat during operation. The cold plate transfers the heat to the HP with less thermal resistance than existing HP solutions. Other embodiments may be described and/or claimed.

    Computer
    14.
    外观设计
    Computer 有权

    公开(公告)号：USD1001797S1

    公开(公告)日：2023-10-17

    申请号：US29724751

    申请日：2020-02-19

    Applicant: Intel Corporation

    Designer： Jeff Ku ,  Juha Paavola ,  Mark Carbone ,  Shantanu Kulkarni ,  Mikko Makinen ,  Gustavo Fricke

    Abstract: FIG. 1 is a bottom, front, right, perspective view of a computer;
    FIG. 2 is a bottom, front, right, perspective view thereof in a first alternate configuration of use; and,
    FIG. 3 is a bottom, right, front perspective view thereof in a second alternate configuration of use.
    The even dashed broken lines in the drawings represent portions of the computer that form no part of the claimed design. The dot-dash broken lines represent boundaries that separate the unclaimed center portion of the screen from the rest of the computer. The keyboard shown in even dash broken lines in FIGS. 1-2 represents environment. None of the broken lines form part of the claimed design.

    Chassis embedded heat pipe
    15.
    发明授权
    Chassis embedded heat pipe 有权

    公开(公告)号：US10921869B2

    公开(公告)日：2021-02-16

    申请号：US16455323

    申请日：2019-06-27

    Applicant: Intel Corporation

    Inventor： Mark Carbone ,  Juha Tapani Paavola ,  Nicholas R. Weber

    IPC: G06F1/20 ,  H05K7/20 ,  G06F1/16

    Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include one or more heat sources, a heat pipe embedded in a chassis of the electronic device, where the heat pipe is thermally coupled to the one or more heat sources to collect heat from the one or more heat sources, and a thermal cooling device, where the thermal cooling device is thermally coupled to the heat pipe and can dissipate heat collected from the heat pipe using air from outside the chassis. In an example, the heat pipe is an oscillating heat pipe and has a thickness between about two (2) millimeters to about twelve (12) millimeters.

    VAPOR CHAMBER WITH IONIZED FLUID
    18.
    发明申请
    VAPOR CHAMBER WITH IONIZED FLUID 有权

    公开(公告)号：US20220095484A1

    公开(公告)日：2022-03-24

    申请号：US17541663

    申请日：2021-12-03

    Applicant: Intel Corporation

    Inventor： Twan Sing Loo ,  Jeff Ku ,  Min Suet Lim ,  Khai Ern Ke See ,  Mark Carbone

    IPC: H05K7/20 ,  F28F13/18 ,  G06F1/20

    Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a vapor chamber that includes ionized fluid and an adjustable polarization layer coupled to the vapor chamber. The adjustable polarization layer can be used to direct a flow of the ionized fluid in the vapor chamber towards one or more heat sources. In some examples, the ionized fluid is ionized water and the adjustable polarization layer is polyester (PET) film that includes a plurality of electrode stripes.

    Torsional heat pipe
    20.
    发明授权
    Torsional heat pipe 有权

    公开(公告)号：US10932393B2

    公开(公告)日：2021-02-23

    申请号：US16370918

    申请日：2019-03-30

    Applicant: Intel Corporation

    Inventor： Juha Tapani Paavola ,  Mikko Antero Makinen ,  Columbia Mishra ,  Mark Carbone

    IPC: H05K7/20 ,  F28D15/02 ,  G06F1/20

    Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a torsional heat pipe. The torsional heat pipe can include a first housing static portion located in a first housing of an electronic device, where the first housing static portion is coupled to a heat source, a second housing static portion located in a second housing of the electronic device, where the second housing static portion is coupled to a heat spreader, and a torsion portion located in a hinge of the electronic device, where the hinge rotatably couples the first housing to the second housing and the torsion portion rotates as the second housing rotates relative to the first housing and the torsion portion couples the first housing static portion to the second housing static portion.

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