公开(公告)号：US06805616B2

公开(公告)日：2004-10-19

申请号：US10066679

申请日：2002-02-06

Applicant: Isamu Kawashima

Inventor： Isamu Kawashima

IPC: B24B722

CPC classification number: B24B37/345 ,  B25B11/005 ,  H01L21/6838

Abstract: Wafers are prevented from getting damaged on delivery thereof from a sucking and carrying device to a table. A wafer before planarization sucked and held by a sucking board is positioned above a table. Next, wafer is vacuum-attracted by the table, and the table is moved upward by that attraction power in a direction to suck the wafer so as to vacuum-suck it on the table. Subsequently, the wafer is sucked and held only by the table by releasing the sucking and holding thereof by the sucking board.

Abstract translation: 防止了从输送装置到桌子的输送而损坏晶片。 由吸盘吸引并保持的平坦化前的晶片位于工作台的上方。 接下来，通过桌子对晶片进行真空吸引，并且通过该吸引力将工作台沿着吸引晶片的方向向上移动，以将其真空吸附到工作台上。 随后，通过释放吸引板的吸附和保持，将晶片吸引并保持在桌子上。

公开(公告)号：US07490650B2

公开(公告)日：2009-02-17

申请号：US11752146

申请日：2007-05-22

Applicant: Isamu Kawashima ,  Hideshi Sato ,  Hideo Kino ,  Minoru Ametani

Inventor： Isamu Kawashima ,  Hideshi Sato ,  Hideo Kino ,  Minoru Ametani

IPC: H01L21/67 ,  H01L21/673 ,  H01L21/677 ,  H01L21/68

CPC classification number: H01L21/67132 ,  H01L21/67294 ,  Y10S414/135 ,  Y10S438/976 ,  Y10T156/1105 ,  Y10T156/17 ,  Y10T156/1906 ,  Y10T156/1978

Abstract: A workpiece processing device (10) for processing a workpiece (60; 20, 36) comprises: a surface protection film peeling means (50) for peeling a surface protection film (110), which is adhered to a front surface (21) of a workpiece, with a peeling tape (4); a bar code adhering means (11) for adhering a bar code (65) corresponding to the workpiece to the workpiece; and a movable support table (72) for supporting the workpiece. A peeling operation for peeling the surface protection film conducted by the surface protection film peeling means and a adhering operation for adhering a bar code conducted by the bar code adhering means are given to the workpiece while the workpiece is being supported by the support table. Due to the foregoing, it is possible to avoid failures when adhering the bar code to the workpiece, such as a wafer. The bar code adhering means may adhere the bar code, which corresponds to character information of the workpiece read out by an optical reading means, to the workpiece.

Abstract translation: 一种用于加工工件（60; 20,36）的工件加工装置（10）包括：表面保护膜剥离装置（50），其用于剥离表面保护膜（110），所述表面保护膜剥离装置 具有剥离胶带（4）的工件; 用于将对应于工件的条形码（65）粘附到工件上的条形码粘合装置（11） 和用于支撑工件的活动支撑台（72）。 当工件被支撑台支撑时，用于剥离由表面保护膜剥离装置传导的表面保护膜的剥离操作和用于粘附由条形码粘附装置传导的条形码的粘合操作。 由于上述原因，可以避免在将条形码粘贴到诸如晶片的工件时发生故障。 条形码粘贴装置可以将对应于由光学读取装置读出的工件的字符信息的条形码粘附到工件。

公开(公告)号：US20070277934A1

公开(公告)日：2007-12-06

申请号：US11752146

申请日：2007-05-22

Applicant: Isamu Kawashima ,  Hideshi Sato ,  Hideo Kino ,  Minoru Ametani

Inventor： Isamu Kawashima ,  Hideshi Sato ,  Hideo Kino ,  Minoru Ametani

IPC: B32B37/00

CPC classification number: H01L21/67132 ,  H01L21/67294 ,  Y10S414/135 ,  Y10S438/976 ,  Y10T156/1105 ,  Y10T156/17 ,  Y10T156/1906 ,  Y10T156/1978

Abstract: A workpiece processing device (10) for processing a workpiece (60; 20, 36) comprises: a surface protection film peeling means (50) for peeling a surface protection film (110), which is adhered to a front surface (21) of a workpiece, with a peeling tape (4); a bar code adhering means (11) for adhering a bar code (65) corresponding to the workpiece to the workpiece; and a movable support table (72) for supporting the workpiece. A peeling operation for peeling the surface protection film conducted by the surface protection film peeling means and a adhering operation for adhering a bar code conducted by the bar code adhering means are given to the workpiece while the workpiece is being supported by the support table. Due to the foregoing, it is possible to avoid failures when adhering the bar code to the workpiece, such as a wafer. The bar code adhering means may adhere the bar code, which corresponds to character information of the workpiece read out by an optical reading means, to the workpiece.

Abstract translation: 一种用于加工工件（60; 20,36）的工件加工装置（10）包括：表面保护膜剥离装置（50），其用于剥离表面保护膜（110），所述表面保护膜剥离装置 具有剥离胶带（4）的工件; 用于将对应于工件的条形码（65）粘附到工件上的条形码粘合装置（11） 和用于支撑工件的活动支撑台（72）。 当工件被支撑台支撑时，用于剥离由表面保护膜剥离装置传导的表面保护膜的剥离操作和用于粘附由条形码粘附装置传导的条形码的粘合操作。 由于上述原因，可以避免在将条形码粘贴到诸如晶片的工件时发生故障。 条形码粘贴装置可以将对应于由光学读取装置读出的工件的字符信息的条形码粘附到工件。

公开(公告)号：US20070269962A1

公开(公告)日：2007-11-22

申请号：US11750302

申请日：2007-05-17

Applicant: Isamu Kawashima ,  Hideshi Sato ,  Hideo Kino ,  Minoru Ametani

Inventor： Isamu Kawashima ,  Hideshi Sato ,  Hideo Kino ,  Minoru Ametani

IPC: H01L21/00

CPC classification number: H01L21/67132 ,  B29C63/0013 ,  Y10T156/1168 ,  Y10T156/1978

Abstract: A film peeling device for peeling a film (11) adhered to a front surface of a wafer (20), on the back surface of which a dicing tape (3) is adhered, the wafer is integrated with a mount frame (36) into one body, comprises: a movable table (31), which can be moved horizontally to support the wafer and the mount frame while the surface protection film is being directed upward; a covering means (80) for covering an adhesive face (3a) of the dicing tape, which is exposed between the mount frame and the wafer at one end (28) of the wafer; and a adhering means (46) for adhering a peeling tape (4) to the film at the end of the wafer. The film is peeled from the front surface of the wafer by moving the movable table from the other end (29) of the wafer to one end after the peeling tape has adhered. Due to the foregoing, while the peeling tape is being prevented from adhering to the dicing tape, the film can be peeled from the front surface of the wafer in a shorter period of time.

Abstract translation: 一种膜剥离装置，用于剥离附着在晶片（20）前表面上的膜（11），在其背面上粘附有切割胶带（3），所述晶片与安装框架（36）集成成 一个主体包括：可移动台（31），其可以在表面保护膜向上指向的同时水平移动以支撑晶片和安装框架; 覆盖装置（80），用于覆盖在晶片的一端（28）处露出在安装框架和晶片之间的切割带的粘合面（3a）; 以及用于将剥离带（4）粘附到晶片末端的膜的粘合装置（46）。 在剥离带粘附之后，通过将可移动台从晶片的另一端（29）移动到一端，从而从晶片的前表面剥离膜。 由于上述原因，当剥离胶带被防止粘附到切割胶带上时，可以在更短的时间内从胶片的前表面剥离胶片。

公开(公告)号：US07158910B2

公开(公告)日：2007-01-02

申请号：US10889673

申请日：2004-07-12

Applicant: Isamu Kawashima

Inventor： Isamu Kawashima

IPC: G01D1/00 ,  H01L21/00 ,  H01L21/66 ,  B32B41/00

CPC classification number: H01L21/67253 ,  G01J1/429 ,  G01J1/48 ,  H01L21/67092 ,  H01L21/67132

Abstract: A method of calculating a quantity of light by measuring, by using an adhering force measuring unit (71), the adhering force of an ultraviolet light-curable tape (11 or 21) relying upon the quantity of ultraviolet light with which the ultraviolet light-curable tape is irradiated from an ultraviolet light irradiation unit (61), and calculating, by using a calculation unit, the quantity of ultraviolet light corresponding to a predetermined adhering force, from the measured adhering force of the ultraviolet light-curable tape, and a device therefor. The predetermined adhering force may have been stored in advance in the storage unit or the predetermined adhering force may be determined in advance relying upon at least either one of the kind of the ultraviolet light-curable tape or the elapsed time of the ultraviolet light-curable tape. Then, the quantity of light necessary for the ultraviolet light-curable tape that is used is automatically calculated to avoid a problem caused by an insufficient quantity of light or an excess quantity of light.

Abstract translation: 一种通过使用粘附力测量单元（71）测量紫外线光固化带（11或21）的粘附力的方法来计算光量，该紫外光固化带依赖于紫外光的量， 从紫外光照射单元（61）照射固化胶带，并且通过使用计算单元，根据所测量的紫外光固化胶带的粘附力，计算与预定粘合力相对应的紫外光量，以及 设备。 可以预先将预定的附着力存储在存储单元中，或者可以预先根据紫外线固化胶带的种类或紫外光固化胶带的经过时间来预先确定预定粘合力 胶带。 然后，自动计算所使用的紫外光固化带所需的光量，以避免由于光量不足或过多的光量引起的问题。

公开(公告)号：US20050118823A1

公开(公告)日：2005-06-02

申请号：US10981081

申请日：2004-11-03

Applicant: Isamu Kawashima

Inventor： Isamu Kawashima

IPC: H01L21/304 ,  H01L21/301 ,  H01L21/306 ,  H01L21/3065 ,  H01L21/316 ,  H01L21/302 ,  H01L21/461

CPC classification number: H01L21/0209 ,  H01L21/31662

Abstract: There are provided a wafer processing method comprising the steps of grinding an underside (21) of a wafer which is provided, on its front surface (29), with a plurality of semiconductor devices (10); polishing a ground surface (22) formed by the grinding operation; and carrying out a plasma-processing for a polished surface (23) formed by the polishing operation under a predetermined gaseous atmosphere in a plasma chamber, to form an oxide layer on the polished surface, and a wafer processing method comprising the steps of carrying out a first plasma-processing for a polished surface formed by the polishing operation under a first gaseous atmosphere (CF4 or SF6) in a plasma chamber, to clean the polished surface; and carrying out a second plasma-processing for the polished surface after the cleaning operation under a second gaseous atmosphere (O2) in the plasma chamber, to form an oxide layer on the polished surface, and a wafer processing apparatus for carrying out these methods. Thus, the wafer can be processed while the occurrence of an electrical failure in a thin wafer is restricted.

Abstract translation: 提供了一种晶片处理方法，包括以下步骤：研磨在其前表面（29）上设置有多个半导体器件（10）的晶片的下侧（21）; 研磨通过研磨操作形成的地面（22）; 对等离子体室内的规定气氛下的研磨作业形成的研磨面（23）进行等离子体处理，在研磨面上形成氧化物层，以及晶片处理方法，其特征在于， 通过在等离子体室中的第一气态气氛（CF 4 S或SF 6）下通过研磨操作形成的抛光表面的第一等离子体处理，以清洁抛光表面 ; 并且在等离子体室中的第二气态气氛（O 2 N 2）下进行清洁操作之后的抛光表面的第二等离子体处理，以在抛光表面上形成氧化物层， 用于执行这些方法的处理装置。 因此，可以在薄晶片中出现电气故障的同时对晶片进行加工。

公开(公告)号：US08423266B2

公开(公告)日：2013-04-16

申请号：US12921746

申请日：2009-03-02

Applicant: Takao Kawabe ,  Takashi Miyamoto ,  Kazuhiro Yamada ,  Tetsuo Sakaki ,  Isamu Kawashima

Inventor： Takao Kawabe ,  Takashi Miyamoto ,  Kazuhiro Yamada ,  Tetsuo Sakaki ,  Isamu Kawashima

IPC: F02D41/30

CPC classification number: F02D41/0007 ,  F02B37/12 ,  F02D23/02 ,  F02D41/2467 ,  F02D41/40 ,  Y02T10/144 ,  Y02T10/44

Abstract: An engine in which a fluctuation in the amount of fuel injection is reduced in the entire operating tolerance of the engine. The engine (1) has an engine body (5) provided with a turbocharger (7), an engine speed sensor (21), a turbo sensor (22), a boost sensor (23), and an ECU (20) for correcting the amount of fuel injection. A control means recognizes an engine speed, a supercharging pressure, a supercharger speed, a fuel injection amount and corrects the fuel injection amount.

Abstract translation: 在发动机的整个运行公差中，燃料喷射量的波动减小的发动机。 发动机（1）具有设置有涡轮增压器（7），发动机转速传感器（21），涡轮传感器（22），升压传感器（23）和用于校正的ECU（20）的发动机主体（5） 燃油喷射量。 控制装置识别发动机速度，增压压力，增压器速度，燃料喷射量，并校正燃料喷射量。

公开(公告)号：US08191370B2

公开(公告)日：2012-06-05

申请号：US12304090

申请日：2007-04-19

Applicant: Kouji Shimizu ,  Takashi Miyamoto ,  Takao Kawabe ,  Tetsuo Sakaki ,  Isamu Kawashima ,  Toshiro Itatsu

Inventor： Kouji Shimizu ,  Takashi Miyamoto ,  Takao Kawabe ,  Tetsuo Sakaki ,  Isamu Kawashima ,  Toshiro Itatsu

IPC: F02B33/00

CPC classification number: F02D23/02 ,  F02B29/0406 ,  F02B39/16 ,  F02D41/0007 ,  F02D41/0072 ,  F02D41/0097 ,  F02M26/05 ,  F02M26/06 ,  F02M26/10 ,  F02M26/15 ,  F02M26/16 ,  F02M26/21 ,  F02M26/23 ,  Y02T10/144 ,  Y02T10/47

Abstract: In an engine equipped with a supercharger consisting of a compressor having a plurality of blades on a turbine shaft and a turbine, at least one index means provided on the turbine shaft or the plurality of blades, and a turbo angular velocity sensor, which detects a rotation of the index means and a rotation of the plurality of blades respectively and connected to an ECU. In the engine, also, a turbo angular velocity computing means, which calculates an angular velocity by obtaining a plurality of pulses per one rotation of the turbine shaft, is provided.

Abstract translation: 在配备有增压器的发动机中，所述增压器包括在涡轮轴和涡轮机上具有多个叶片的压缩机，设置在所述涡轮轴或所述多个叶片上的至少一个指示装置，以及涡轮角速度传感器，其检测 指示装置的旋转和多个叶片的旋转分别连接到ECU。 在发动机中，还提供了一种涡轮角速度计算装置，其通过获得涡轮机轴的每一个旋转的多个脉冲来计算角速度。

公开(公告)号：US08151856B2

公开(公告)日：2012-04-10

申请号：US11750302

申请日：2007-05-17

Applicant: Isamu Kawashima ,  Hideshi Sato ,  Hideo Kino ,  Minoru Ametani

Inventor： Isamu Kawashima ,  Hideshi Sato ,  Hideo Kino ,  Minoru Ametani

IPC: B32B38/10

CPC classification number: H01L21/67132 ,  B29C63/0013 ,  Y10T156/1168 ,  Y10T156/1978

Abstract: A film peeling device for peeling a film (11) adhered to a front surface of a wafer (20), on the back surface of which a dicing tape (3) is adhered, the wafer is integrated with a mount frame (36) into one body, comprises: a movable table (31), which can be moved horizontally to support the wafer and the mount frame while the surface protection film is being directed upward; a covering means (80) for covering an adhesive face (3a) of the dicing tape, which is exposed between the mount frame and the wafer at one end (28) of the wafer; and a adhering means (46) for adhering a peeling tape (4) to the film at the end of the wafer. The film is peeled from the front surface of the wafer by moving the movable table from the other end (29) of the wafer to one end after the peeling tape has adhered. Due to the foregoing, while the peeling tape is being prevented from adhering to the dicing tape, the film can be peeled from the front surface of the wafer in a shorter period of time.

Abstract translation: 一种膜剥离装置，用于剥离附着在晶片（20）前表面上的膜（11），在其背面上粘附有切割胶带（3），所述晶片与安装框架（36）集成成 一个主体包括：可移动台（31），其可以在表面保护膜向上指向的同时水平移动以支撑晶片和安装框架; 覆盖装置（80），用于覆盖在晶片的一端（28）处露出在安装框架和晶片之间的切割带的粘合面（3a）; 以及用于将剥离带（4）粘附到晶片末端的膜的粘合装置（46）。 在剥离带粘附之后，通过将可移动台从晶片的另一端（29）移动到一端，从而从晶片的前表面剥离膜。 由于上述原因，当剥离胶带被防止粘附到切割胶带上时，可以在更短的时间内从胶片的前表面剥离胶片。

公开(公告)号：US20110024020A1

公开(公告)日：2011-02-03

申请号：US12898568

申请日：2010-10-05

Applicant: Isamu Kawashima ,  Hideshi Sato ,  Hideo Kino ,  Minoru Ametani

Inventor： Isamu Kawashima ,  Hideshi Sato ,  Hideo Kino ,  Minoru Ametani

IPC: B29C65/50

CPC classification number: B29C63/02 ,  B29C63/0004 ,  B29L2031/3425 ,  B65H37/002 ,  Y10T156/10 ,  Y10T156/1705 ,  Y10T156/1712 ,  Y10T156/1734

Abstract: A tape adhering device (10) comprises: a drawing roller (42) for drawing out a tape (3); a tape fixing means (47) for fixing one portion of the tape drawn out from the drawing roller; a tape drawing means (62) for drawing out a predetermined amount of tape, which is fixed by the tape fixing means, from the drawing roller between the tape fixing means and the drawing roller; and a tape adhering means (49, 31, 37) for adhering the tape, which is located in the downstream of the tape fixing means, onto an object to be adhered (20, 36) under the condition that fixing operation of the tape by the tape fixing means is released. It is preferable that the length of the tape drawn out by the tape drawing means is not less than the diameter of the object to be adhered. Due to the foregoing, it is possible to prevent wrinkles from being form on the tape at the time of adhering the tape.

Abstract translation: 胶带粘接装置（10）包括：用于拉出带（3）的拉丝辊（42）; 用于固定从牵引辊引出的一部分带的胶带固定装置（47）; 用于从带固定装置和牵引辊之间的拉丝辊中抽出预定量的由带固定装置固定的胶带的胶带拉伸装置（62）; 以及用于将位于带固定装置的下游的胶带粘附到待粘合物体（20,36）上的带粘合装置（49,31,37），条带是通过 磁带固定装置被释放。 由带拉伸装置引出的带的长度最好不小于被粘物的直径。 由于上述原因，可以防止在胶带粘附时在带上形成褶皱。