公开(公告)号：US20210082689A1

公开(公告)日：2021-03-18

申请号：US17018169

申请日：2020-09-11

Applicant: JSR CORPORATION

Inventor： Hiroyuki KOMATSU ,  Motohiro SHIRATANI

IPC: H01L21/027 ,  H01L21/02 ,  C08F8/00 ,  H01L21/321

Abstract: A pattern-forming method includes applying a first composition on a surface layer of a substrate to form a first coating film. The surface layer includes a first region which includes a metal atom, and a second region which includes a silicon atom. The first coating film is heated. A portion other than a portion formed on the first region or a portion other than a portion formed on the second region of the first coating film heated is removed, thereby forming a first lamination portion. A second composition is applied on the substrate on which the first lamination portion is formed to form a second coating film. The second coating film is heated or exposed. A portion other than a portion formed on the first lamination portion of the second coating film heated or exposed is removed, thereby forming a second lamination portion.

公开(公告)号：US20190310551A1

公开(公告)日：2019-10-10

申请号：US16449720

申请日：2019-06-24

Applicant: JSR CORPORATION

Inventor： Shinya MINEGISHI ,  Motohiro SHIRATANI ,  Yusuke ASANO ,  Hisashi NAKAGAWA ,  Takehiko NARUOKA

IPC: G03F7/004 ,  G03F7/038 ,  G03F7/32

Abstract: Provided is a radiation-sensitive composition superior in sensitivity. A radiation-sensitive composition incudes a metal oxide having a structural unit represented by formula (1), and a solvent. In the formula (1), M represents germanium, tin or lead; R1 represents a monovalent organic group having no greater than 30 carbon atoms which includes at least one of an electron attractive group and an unsaturated bond-containing group, and bonds to M via a carbon atom.

公开(公告)号：US20190146340A1

公开(公告)日：2019-05-16

申请号：US16244151

申请日：2019-01-10

Applicant: JSR CORPORATION

Inventor： Motohiro SHIRATANI ,  Hiromu MIYATA ,  Takehiko NARUOKA

IPC: G03F7/038 ,  G03F7/039 ,  G03F7/16 ,  G03F7/20 ,  G03F7/32 ,  C08F220/28 ,  G03F7/38

Abstract: A radiation-sensitive resin composition includes a polymer; a radiation-sensitive acid generator; and a solvent. The polymer includes a first structural unit and a second structural unit. The first structural unit includes: a first acid-labile group represented by formula (A); and an oxoacid group protected by the first acid-labile group, or a phenolic hydroxyl group protected by the first acid-labile group. The second structural unit includes: a second acid-labile group other than the first acid-labile group; and an oxoacid group protected by the second acid-labile group, or a phenolic hydroxyl group protected by the second acid-labile group.

公开(公告)号：US20190094689A1

公开(公告)日：2019-03-28

申请号：US16197909

申请日：2018-11-21

Applicant: JSR CORPORATION

Inventor： Motohiro SHIRATANI

IPC: G03F7/004 ,  G03F7/16 ,  G03F7/32 ,  G03F7/20 ,  G03F7/038 ,  G03F7/039

Abstract: A radiation-sensitive composition includes: particles including a metal oxide as a principal component; an aggregation inhibiting agent for inhibiting aggregation of the particles; and an organic solvent. The aggregation inhibiting agent is preferably a compound having dehydration ability. The compound having dehydration ability is preferably a carboxylic anhydride, an orthocarboxylic acid ester, a carboxylic acid halide or a combination thereof. As the aggregation inhibiting agent, a compound that is capable of coordinating to a metal atom is also preferred. The compound is preferably represented by formula (1). In the formula (1), R1 represents an organic group having a valency of n; X represents —OH, —COOH, —NCO, —NHRa, —COORA or —CO—C(RL)2—CO—RA; and n is an integer of 1 to 4. The content of the aggregation inhibiting agent with respect to 100 parts by mass of the particles is preferably no less than 0.001 parts by mass. R1X)n  (1)

公开(公告)号：US20220145113A1

公开(公告)日：2022-05-12

申请号：US17583270

申请日：2022-01-25

Applicant: JSR CORPORATION

Inventor： Hiroyuki KOMATSU ,  Motohiro SHIRATANI

IPC: C09D125/08 ,  C08F12/08 ,  H01L21/027

Abstract: A pattern-forming method includes applying a first composition on a surface layer of a substrate to form a first coating film. The surface layer includes a first region which includes a metal atom, and a second region which includes a silicon atom. The first coating film is heated. A portion other than a portion formed on the first region or a portion other than a portion formed on the second region of the first coating film heated is removed, thereby forming a first lamination portion. A second composition is applied on the substrate on which the first lamination portion is formed to form a second coating film. The second coating film is heated or exposed. A portion other than a portion formed on the first lamination portion of the second coating film heated or exposed is removed, thereby forming a second lamination portion.

公开(公告)号：US20200013617A1

公开(公告)日：2020-01-09

申请号：US16504581

申请日：2019-07-08

Applicant: JSR CORPORATION

Inventor： Hiroyuki KOMATSU ,  Miki TAMADA ,  Hitoshi OSAKI ,  Motohiro SHIRATANI ,  Tomoki NAGAI

IPC: H01L21/02 ,  C23C16/40 ,  C23C16/455 ,  C07C255/09 ,  C07C255/34 ,  C07C255/31

Abstract: A substrate treatment method includes: overlaying a film on a surface of a substrate which includes a first region including a metal atom in a surface layer thereof, using a directed self-assembling material which contains a compound having no less than 6 carbon atoms and including at least one cyano group. After the overlaying, the film on a region other than the first region is removed. After the removing, a pattern principally containing a metal oxide is formed by an Atomic Layer Deposition process or a Chemical Vapor Deposition process on the region other than the first region, of the surface of the substrate.

公开(公告)号：US20200012194A1

公开(公告)日：2020-01-09

申请号：US16445267

申请日：2019-06-19

Applicant: JSR CORPORATION

Inventor： Motohiro SHIRATANI ,  Natsuko Kinoshita ,  Ken Maruyama

IPC: G03F7/039 ,  G03F7/004 ,  G03F7/20 ,  C08L33/14 ,  C08L25/18

Abstract: Provided are a radiation-sensitive resin composition, a resist pattern-forming method and a polymer component. The radiation-sensitive resin composition contains: a polymer component having a first structural unit that includes a phenolic hydroxyl group and a second structural unit that includes an acid-labile group; and a radiation-sensitive acid generator, wherein, the polymer component satisfies inequality (A), wherein, in the inequality (A), X1 represents a proportion (mol %) of the first structural unit comprised with respect to total structural units constituting the polymer component included in a fraction eluted until a retention time at which a cumulative area accounts for 1% of a total area on a gel permeation chromatography (GPC) elution curve of the polymer component detected by a differential refractometer; and X2 represents a proportion (mol %) of the first structural unit comprised with respect to total structural units constituting the polymer component. X1

公开(公告)号：US20190354010A1

公开(公告)日：2019-11-21

申请号：US16519420

申请日：2019-07-23

Applicant: JSR CORPORATION

Inventor： Shinya MINEGISHI ,  Motohiro SHIRATANI ,  Hisashi NAKAGAWA

IPC: G03F7/004 ,  G03F7/32 ,  G03F7/30 ,  G03F7/031

Abstract: A radiation-sensitive composition contains: a metal oxide having a first structural unit represented by formula (1), formula (2) or a combination thereof, and a second structural unit represented by formula (3); and a solvent. In the formulae (1) to (3), M1, M2 and M3 each independently represent germanium, tin or lead; and R1, R2 and R3 each independently represent a monovalent organic group having 1 to 40 carbon atoms which bonds to M1 or M2 via a carbon atom. A proportion of the first structural unit with respect to total structural units constituting the metal oxide is preferably no less than 50 mol %.

公开(公告)号：US20170269476A1

公开(公告)日：2017-09-21

申请号：US15611039

申请日：2017-06-01

Applicant: JSR CORPORATION

Inventor： Hisashi NAKAGAWA ,  Motohiro SHIRATANI ,  Takehiko NARUOKA ,  Tomoki NAGAI

IPC: G03F7/004 ,  G03F7/039 ,  G03F7/16 ,  C08F212/14 ,  G03F7/38 ,  G03F7/32 ,  G03F7/40 ,  C08F220/18 ,  G03F7/038 ,  G03F7/20

CPC classification number: G03F7/0045 ,  C08F212/14 ,  C08F220/18 ,  G03F7/0046 ,  G03F7/0047 ,  G03F7/0048 ,  G03F7/038 ,  G03F7/039 ,  G03F7/0395 ,  G03F7/0397 ,  G03F7/162 ,  G03F7/168 ,  G03F7/2037 ,  G03F7/322 ,  G03F7/325 ,  G03F7/38 ,  G03F7/40

Abstract: A photoresist composition includes a radiation-sensitive acid generator, particles, and a first solvent. The radiation-sensitive acid generator is capable of generating an acid upon irradiation with a radioactive ray, an action of the acid allowing a solubility of a film made from the photoresist composition in a developer solution to be altered. The particles include a metal element and have a hydrodynamic radius as determined by a dynamic light scattering analysis of no greater than 20 nm. The photoresist composition may include an acid-labile compound including an acid-labile group. The radiation-sensitive acid generator may be the acid-labile compound including a group that is capable of generating an acid upon exposure to a radioactive ray.