Abstract:
A radiation-sensitive resin composition includes an acid generating agent to generate a compound represented by a following formula (1) by irradiation with a radioactive ray. In the formula (1), R1 represents a monovalent organic group having 1 to 20 carbon atoms. R2 represents a hydrogen atom or a monovalent organic group having 1 to 20 carbon atoms. The compound represented by the formula (1) is preferably a compound represented by a following formula (1-1). In the formula (1-1), R2 is as defined in the above formula (1). X represents an electron attractive group. R3 represents a monovalent organic group having 1 to 20 carbon atoms.
Abstract:
A resist pattern-forming method includes providing a resist film having a surface free energy of 30 to 40 mN/m on a substrate using a radiation-sensitive resin composition. The resist film is exposed by applying radiation via a mask. The exposed resist film is developed. It is preferable that the exposing of the resist film includes exposing the resist film via an immersion liquid that is provided over the resist film
Abstract:
A radiation-sensitive composition is to be used in exposure with an extreme ultraviolet ray or an electron beam, and includes a first polymer and a solvent, wherein the first polymer includes a first structural unit including: at least one metal atom; and at least one carbon atom that each bonds to the metal atom by a chemical bond and does not constitute an unsaturated bond, and at least one chemical bond is a covalent bond. Every chemical bond is preferably a covalent bond. The metal atom is preferably tin, germanium, lead or a combination thereof.
Abstract:
The present invention provides a radiation-sensitive resin composition that contains a polymer having a structural unit that includes an acid-labile group; and an acid generator, wherein the acid generator includes a compound including a sulfonate anion having SO3−, wherein a hydrogen atom or an electron-donating group bonds to an α carbon atom with respect to SO3−, and an electron-withdrawing group bonds to a β carbon atom with respect to SO3−; and a radiation-degradable onium cation. The compound preferably has a group represented by the following formula (1-1) or (1-2). In the following formulae (1-1) and (1-2), R1 and R2 each independently represent a hydrogen atom or a monovalent electron-donating group. R3 represent a monovalent electron-withdrawing group. R4 represents a hydrogen atom or a monovalent hydrocarbon group.
Abstract:
The present invention provides a radiation-sensitive resin composition that contains a polymer having a structural unit that includes an acid-labile group; and an acid generator, wherein the acid generator includes a compound including a sulfonate anion having SO3−, wherein a hydrogen atom or an electron-donating group bonds to an α carbon atom with respect to SO3−, and an electron-withdrawing group bonds to a β carbon atom with respect to SO3−; and a radiation-degradable onium cation. The compound preferably has a group represented by the following formula (1-1) or (1-2). In the following formulae (1-1) and (1-2), R1 and R2 each independently represent a hydrogen atom or a monovalent electron-donating group. R3 represent a monovalent electron-withdrawing group. R4 represents a hydrogen atom or a monovalent hydrocarbon group.
Abstract:
A radiation-sensitive composition includes particles and a solvent. The particles include a first component and a second component. The first component is a hydrolyzation product or a hydrolytic condensation product of a metal compound including a hydrolyzable group, or a combination thereof; and the second component is an organic acid, an anion of the organic acid, a first compound represented by formula (1), or a combination thereof. The organic acid and the first compound each have a molecular weight of no less than 120. In the formula (1), R1 represents an organic group having a valency of n; X represents an alcoholic hydroxyl group, —NCO or —NHRa, wherein Ra represents a hydrogen atom or a monovalent organic group; and n is an integer of 2 to 4.
Abstract:
Provided is a radiation-sensitive composition superior in sensitivity. A radiation-sensitive composition incudes a metal oxide having a structural unit represented by formula (1), and a solvent. In the formula (1), M represents germanium, tin or lead; R1 represents a monovalent organic group having no greater than 30 carbon atoms which includes at least one of an electron attractive group and an unsaturated bond-containing group, and bonds to M via a carbon atom.
Abstract:
A resist composition includes a polymer that includes an acid-labile group-containing structural unit, a photoacid generator, and a solvent. The solvent includes a compound that includes a ketonic carbonyl group and an alcoholic hydroxyl group. The alcoholic hydroxyl group is preferably a tertiary alcoholic hydroxyl group. The solvent preferably further includes an alkylene glycol monoalkyl ether carboxylate.
Abstract:
A photoresist composition includes a first polymer, a second polymer and a third polymer. The first polymer has a fluorine atom and a first structural unit that includes a hydrophilic group. The second polymer has a fluorine atom a second structural unit that includes an alkali-dissociable group. The third polymer has an acid-dissociable group. The first polymer, the second polymer and the third polymer are different with one another. It is preferred that the first structural unit is represented by a following formula, and the second structural unit is represented by a following formula (2).