摘要:
Techniques are disclosed for trimming a capacitance associated with a capacitor bank for use in a voltage-controlled oscillator (VCO). In an embodiment, each capacitance is sub-divided into a plurality of constituent capacitances. The constituent capacitances may be selectively enabled or disabled to trim the step sizes of the capacitor bank. Further techniques are disclosed for calibrating the trimmable capacitance to minimize step size error for the capacitor bank.
摘要:
A method for fabricating a semiconductor device includes etching a semiconductor substrate using a hard mask layer as a barrier to form a trench defining a plurality of active regions, forming a gap-fill layer to gap-fill a portion of the inside of the trench so that the hard mask layer becomes a protrusion, forming spacers covering both sides of the protrusion, removing one of the spacers using a doped etch barrier as an etch barrier, and etching the gap-fill layer using a remaining spacer as an etch barrier to form a side trench exposing one side of the active region.
摘要:
Techniques for improving the linearity of a cascode amplifier. In an exemplary embodiment, an auxiliary common-gate amplifier is provided in parallel with the principal cascode branch. The auxiliary common-gate amplifier samples a cascoded node in the principal cascode branch. The auxiliary common-gate amplifier generates a current which, when combined with the current generated by the principal cascode branch, cancels a distortion component to generate an output current with improved linearity characteristics. In an exemplary embodiment, a phase shifting network couples the cascoded node to the auxiliary common-gate amplifier, and may include, e.g., a capacitor coupled to an inductor.
摘要:
A method for fabricating a semiconductor device includes forming an etching target layer over a substrate including a first region and a second region; forming a hard mask layer over the etching target layer; forming a first etch mask over the hard mask layer, wherein the first etch mask includes a plurality of line patterns and a sacrificial spacer layer formed over the line patterns; forming a second etch mask over the first etch mask, wherein the second etch mask includes a mesh type pattern and a blocking pattern covering the second region; removing the sacrificial spacer layer; forming hard mask layer patterns having a plurality of holes by etching the hard mask layer using the second etch mask and the first etch mask; and forming a plurality of hole patterns in the first region by etching the etching target layer using the hard mask layer patterns.
摘要:
Techniques for improving the linearity of a cascode amplifier. In an exemplary embodiment, an auxiliary common-gate amplifier is provided in parallel with the principal cascode branch. The auxiliary common-gate amplifier samples a cascoded node in the principal cascode branch. The auxiliary common-gate amplifier generates a current which, when combined with the current generated by the principal cascode branch, cancels a distortion component to generate an output current with improved linearity characteristics. In an exemplary embodiment, a phase shifting network couples the cascoded node to the auxiliary common-gate amplifier, and may include, e.g., a capacitor coupled to an inductor.
摘要:
A method for fabricating a semiconductor device includes forming a first dielectric structure over a second region of a substrate to expose a first region of the substrate, forming a barrier layer over an entire surface including the first dielectric structure, forming a second dielectric structure over the barrier layer in the first region, forming first open parts and second open parts in the first region and the second region, respectively, by etching the second dielectric structure, the barrier layer and the first dielectric structure, forming first conductive patterns filled in the first open parts and second conductive patterns filled in the second open parts, forming a protective layer to cover the second region, and removing the second dielectric structure.
摘要:
A method for fabricating a capacitor in a semiconductor device includes forming a stack structure providing a plurality of open regions, the stack structure including an insulation layer and a hard mask pattern, forming a conductive layer over the stack structure and in the open regions, etching a portion of the conductive layer formed outside the open regions to form bottom electrodes in the open regions, removing the hard mask pattern, and etching upper portions of the bottom electrodes that are exposed after the hard mask pattern is removed.
摘要:
A method for forming a contact hole of a semiconductor device includes: forming a lower pattern over a substrate; forming a spin-on-glass (SOG) layer over the lower pattern; performing a first curing process on the SOG layer; forming an opening exposing a portion of the SOG layer; performing a second curing process on the SOG layer corresponding to a lower portion of the opening; and forming a contact hole exposing the lower pattern.
摘要:
A method for fabricating a capacitor in a semiconductor device includes forming a stack structure providing a plurality of open regions, the stack structure including an insulation layer and a hard mask pattern, forming a conductive layer over the stack structure and in the open regions, etching a portion of the conductive layer formed outside the open regions to form bottom electrodes in the open regions, removing the hard mask pattern, and etching upper portions of the bottom electrodes that are exposed after the hard mask pattern is removed.
摘要:
A fractional-N frequency synthesizer includes a voltage-controlled oscillator, a dual-modulus divider which divides an output frequency of the voltage-controlled oscillator according to a fractional control input, and a phase comparator which compares a phase of an output of the dual-modulus divider with a phase of a reference frequency, where an output of the phase comparator controls an input of the voltage-controlled oscillator. The synthesizer further includes a sigma-delta modulator which has a single-bit output, and a bit converter which converts the single-bit output of the sigma-delta modulator to the fractional control input applied to the dual-modulus divider.