HARD FORMATION INSERT AND PROCESS FOR MAKING THE SAME
    14.
    发明申请
    HARD FORMATION INSERT AND PROCESS FOR MAKING THE SAME 审中-公开
    硬化形成插件及其制造方法

    公开(公告)号:US20090188725A1

    公开(公告)日:2009-07-30

    申请号:US12359960

    申请日:2009-01-26

    IPC分类号: E21B10/56 E21B10/36 E21B10/46

    CPC分类号: E21B10/5673

    摘要: A drilling insert includes a cylindrical body and a top portion of the drilling insert. The top portion is on top of the cylindrical body providing a contact area, wherein the contact area provides a flat area for distributing contact stress when the drilling insert impacts the formation.

    摘要翻译: 钻探刀片包括圆柱体和钻孔刀片的顶部。 顶部位于圆柱形主体的顶部,提供接触区域,其中接触区域提供平坦区域,用于在钻孔插入件撞击地层时分布接触应力。

    Tibial sizing apparatus and method
    15.
    发明申请
    Tibial sizing apparatus and method 审中-公开
    胫骨上钉装置及方法

    公开(公告)号:US20060064108A1

    公开(公告)日:2006-03-23

    申请号:US10938979

    申请日:2004-09-09

    IPC分类号: A61B17/60

    摘要: A tibial sizing apparatus includes a tibial sizing plate. The tibial sizing plate includes a substantially planar surface and defines a peripherally positioned pin slot extending obliquely relative to the substantially planar surface. An alternative tibial sizing apparatus includes a tibial sizing plate and an angulated handle coupled to the tibial sizing plate. An alternative tibial sizing apparatus includes a tibial sizing plate and a catch member coupled to a peripheral portion of the tibial sizing plate. The catch member is movable between a first position in which the catch member extends generally inferiorly from the tibial sizing plate and a second position in which the catch member retracts generally superiorly into the tibial sizing plate. A method for fixing a tibial sizing plate to a proximal tibia includes anteriorly pinning the tibial sizing plate to the proximal tibia.

    摘要翻译: 胫骨施胶装置包括胫骨施胶板。 胫骨定型板包括基本平坦的表面并且限定相对于基本上平坦的表面倾斜延伸的周边定位的销槽。 一种替代的胫骨施胶装置包括胫骨上浆板和联接到胫骨施胶板的成角度手柄。 一种替代的胫骨施胶装置包括胫骨上浆板和联接到胫骨施胶板的周边部分的钩部件。 捕捉构件可在第一位置和第二位置之间移动,在该第一位置,捕获构件大致从胫骨施胶板下方延伸,在第二位置中,捕捉构件大致上下退回到胫骨施胶板。 用于将胫骨上钉板固定到近端胫骨的方法包括将胫骨上浆板向前钉扎到近侧胫骨。

    Mounting insert and method
    17.
    发明授权
    Mounting insert and method 有权
    安装插件和方法

    公开(公告)号:US09441660B2

    公开(公告)日:2016-09-13

    申请号:US14700903

    申请日:2015-04-30

    申请人: John Meyers

    发明人: John Meyers

    摘要: A method for Inserting and fixing a mounting insert into a lightweight sandwich panel. The panel comprises a core layer and two cover layers that are applied to opposing main surfaces of the panel. A recess extends into the depth of the core layer of the panel. The mounting insert is inserted into the recess and is adhesively bonded therein. The bottom of the recess extends to a depth of the core layer material that extends further than the longitudinal extension of the recessing section to be inserted. When adhesively bonding the mounting insert, an air gap remains between an end face of the recessing section and the bottom of the recess. No adhesive is placed into the air gap. The air gap ensures a decoupling so that any applied tensile forces are no longer transferred to the cover layer opposite and the undesired formation of dents is avoided.

    摘要翻译: 将安装插入件插入和固定到轻质夹心板中的方法。 面板包括芯层和两个覆盖层,其被施加到面板的相对的主表面。 凹部延伸到面板的芯层的深度。 将安装插入物插入到凹部中并粘合在其中。 凹部的底部延伸到芯层材料的深度,该深度比待插入的凹陷部分的纵向延伸更远。 当粘合安装嵌件时,在凹陷部分的端面和凹部的底部之间留有气隙。 气隙中没有粘合剂。 空气间隙确保了去耦合,使得任何施加的拉力不再转移到相对的覆盖层,并且避免了不期望的凹陷形成。

    Method of forming a multi-die semiconductor package
    20.
    发明申请
    Method of forming a multi-die semiconductor package 失效
    形成多管芯半导体封装的方法

    公开(公告)号:US20050233497A1

    公开(公告)日:2005-10-20

    申请号:US11167495

    申请日:2005-06-27

    申请人: John Meyers

    发明人: John Meyers

    摘要: Some embodiments of the invention relate to a method of packaging multiple dice into a semiconducting device. The method includes placing a first capsule that includes a first die onto a front side of a tape substrate, placing a second capsule that includes a second die onto the front side of the tape substrate, filling a recess in a surface of the first capsule with an adhesive and folding the tape substrate to attach the first capsule to the second capsule using the adhesive. The method may further include placing a third capsule that includes a third die onto the front side of the tape substrate such that folding the tape substrate includes positioning the third capsule against a back side of the tape substrate opposite to the second capsule.

    摘要翻译: 本发明的一些实施例涉及将多个骰子封装到半导体器件中的方法。 该方法包括将包括第一管芯的第一封壳放置在带基板的正面上,将包括第二管芯的第二封壳放置在带基板的前侧上,用第一封壳的表面填充第一封壳的表面中的凹槽, 粘合剂并折叠胶带基材,以使用粘合剂将第一胶囊附着到第二胶囊。 该方法还可以包括将包括第三裸片的第三胶囊放置在带基材的前侧,使得折叠带基材包括将第三胶囊定位在与第二胶囊相对的带基材的背面上。