摘要:
During read operations of a column of RAM cells, a bitline is electrically broken into two sections. This reduces the capacitance that needs to be discharged by the RAM cell itself. A buffer is used during the read operation to relay data from one part of the split bitline to the other. A weak pullup path is also provided to hold the non-driven end of the line in a stable condition. During non-read operations, the two sections of bitline are electrically connected.
摘要:
A method for recovering failed bit cells in an integrated circuit memory is disclosed. In one embodiment, the method includes stress testing an integrated circuit having a memory, wherein the memory includes a plurality of bit cells. The method further includes holding at least one internal node of the selected one of the plurality of bit cells at a first predetermined state for a period sufficient to cause a shift in a threshold voltage of a transistor in the selected one of the plurality of bit cells.
摘要:
An error correction module is disclosed whereby two bit cells are used to store a bit of information in a redundant manner so that a redundant error correction module can correct a sporadic data error at one of the two bits.
摘要:
A content addressable memory includes a first plurality of search lines, a second plurality of search lines, a first match line, and a storage location. Each search line of the first plurality of search lines receives a corresponding high voltage level or low voltage level during a match detect operation, and each search line of the second plurality of search lines to receive a corresponding high voltage level or low voltage level during the match detect operation. The storage location of the content addressable memory includes a plurality of CAM cells, each CAM cell a first thyristor and second thyristor.
摘要:
The present invention employs a bias voltage having a selectable magnitude to bias a weak write pull-down transistor in a write driver of a static random access memory (SRAM) array. A programmable weak write test mode (PWWTM) bias generator includes an output signal that is a logic high in a default mode when a WWTM is not active. When the WWTM is active, the generator output signal is the bias voltage having the selectable magnitude. The default mode logic high is actively maintained when the generator output is connected to a load, such as the write driver of the SRAM array. A WWTM-enabled SRAM system includes the PWWTM bias generator. A method of driving a WWTM-equipped SRAM includes generating and applying the output signal to a gate of a weak write pull-down transistor of the SRAM array write driver in the default mode and the WWTM.
摘要:
A static random access memory (SRAM) cell is provided that optimizes the density of memory cells in an array with the maximum speed possible in addressing the memory cells for reading and writing operations. The SRAM cell is divided into groups of SRAM arrays of cells with a centrally located distributed global decoder to address any individual memory cell in the SRAM array. The global decoder accepts an addressing input and outputs a signal for selecting an individual column of memory cells in the SRAM array. The global decoder also outputs a signal selecting an individual row of memory cells contained in the SRAM array. The global decoder may include logic to decode addressing bits to produce a group select signal. Thus, the global decoder is able to select any single memory cell in the SRAM cell for reading or writing specific logical states.
摘要:
A static random-access memory (SRAM) comprises multi-port storage cells with built-in column-interleave selection circuitry which allow a storage cell to be written to via a plurality of different write paths. Column selects are built into each storage cell by adding an additional isolating switch between the storage node of the storage cell and the bitline of a particular write path in order to prevent a cell write from affecting other storage cells connected to the same wordline in the same interleaved array. The write data bus corresponding to each write path for all interleaved cells are shared by all storage cells in a common interleave group, and each adjacent pair of storage cells in a common row share bitlines coupled to the common data bus, resulting in smaller number of required bitlines.
摘要:
A static random access memory (SRAM) cell is provided that optimizes the density of memory cells in an array with the maximum speed possible in addressing the memory cells for reading and writing operations. The SRAM cell is divided into groups of SRAM arrays of cells with a centrally located distributed global decoder to address any individual memory cell in the SRAM array. The global decoder includes a first logic block that accepts addressing input and outputs a signal for selecting an individual column of memory cells in the SRAM array. The global decoder includes a second logic block that accepts addressing input and outputs a signal selecting an individual row of memory cells contained in the SRAM array. The global decoder may include a third logic block to decode addressing bits to produce a group select signal. Thus, the global decoder is able to select any signal memory cell in the SRAM cell for reading or writing specific logical states.
摘要:
The present invention integrates a WWTM circuit with the write driver circuitry, which is an inherent part of any conventional SRAM design. Thus, a circuit for writing data into and weak write testing a memory cell is provided. In one embodiment, the circuit comprises a write driver that has an output for applying a write or a weak write output signal at the memory cell. The write driver has first and second selectable operating modes. In the first mode, the write driver is set to apply a weak write output signal from the output for performing a weak write test on the cell. In the second mode, the write driver is set to apply a normal write output signal that is sufficiently strong for writing a data value into the cell when it is healthy.
摘要:
Various semiconductor chip devices with stacked chips are disclosed. In one aspect, a semiconductor chip device is provided. The semiconductor chip device includes a first semiconductor chip that has a floor plan with a high heat producing area and a low heat producing area. At least one second semiconductor chip is stacked on the low heat producing area. The semiconductor chip device also includes means for transferring heat from the high heat producing area.