METHOD OF PREPARING ELECTROLYTIC COPPER SOLUTION ACIDIFIED WITH SULFURIC ACID, SULFURIC-ACID-ACIDIFIED ELECTROLYTIC COPPER SOLUTION PREPARED BY THE PREPARATION METHOD, AND ELECTRODEPOSITED COPPER FILM
    11.
    发明申请
    METHOD OF PREPARING ELECTROLYTIC COPPER SOLUTION ACIDIFIED WITH SULFURIC ACID, SULFURIC-ACID-ACIDIFIED ELECTROLYTIC COPPER SOLUTION PREPARED BY THE PREPARATION METHOD, AND ELECTRODEPOSITED COPPER FILM 有权
    制备用硫酸制备的电解铜溶液的方法,由制备方法制备的硫酸 - 酸化电解铜溶液和电沉积铜膜

    公开(公告)号:US20100089758A1

    公开(公告)日:2010-04-15

    申请号:US12444020

    申请日:2007-10-02

    IPC分类号: C25D3/38 C25D7/00

    CPC分类号: C25D3/38

    摘要: An object of the present invention is to provide a method for preparing a sulfuric acid base copper electrolytic solution used for formation of an electro-deposited copper film comprising a surface excellent in smoothness and gloss when formed by using the solution just after preparation and is prepared by using mono-sulfides. To achieve the object, a sulfuric acid base copper electrolytic solution is made to contain a sulfonated active sulfur compound, the bis(3-sulfopropyl)disulfide which is recommended for formation of a glossy electro-deposited copper film. And the bis(3-sulfopropyl)disulfide contained is obtained by converting a 3-mercapto-1-propanesulfonic acid into the bis(3-sulfopropyl)disulfide in an aqueous solution of the 3-mercapto-1-propanesulfonic acid by an oxidation reaction. In the oxidation reaction, an air bubbling method is preferably used to prevent oxidative decomposition of the 3-mercapto-1-propanesulfonic acid.

    摘要翻译: 本发明的目的是提供一种制备用于形成电沉积铜膜的硫酸基铜电解液的方法,该方法包括当刚制备后使用溶液形成时制备的平滑度和光泽度优异的表面,并且被制备 通过使用单硫化物。 为了实现该目的,制备硫酸基铜电解液以含有磺化活性硫化合物,推荐用于形成光滑电沉积铜膜的双(3-磺丙基)二硫化物。 通过氧化反应在3-巯基-1-丙磺酸的水溶液中将3-巯基-1-丙磺酸转化成双(3-磺丙基)二硫化物,得到所含的双(3-磺丙基)二硫化物 。 在氧化反应中,优选使用空气鼓泡法来防止3-巯基-1-丙磺酸的氧化分解。

    Electrolytic copper foil with carrier foil and copper-clad laminate using the electrolytic copper foil with carrier foil
    12.
    发明授权
    Electrolytic copper foil with carrier foil and copper-clad laminate using the electrolytic copper foil with carrier foil 失效
    具有载体箔的电解铜箔和使用具有载体箔的电解铜箔的覆铜层压板

    公开(公告)号:US06649274B1

    公开(公告)日:2003-11-18

    申请号:US10031280

    申请日:2001-11-07

    IPC分类号: B32B1508

    摘要: An object of the present invention is to reduce and to stabilize peel strength of a carrier foil in an electrodeposited copper foil with carrier employing an organic adhesive interface, thereby facilitating peeling of the carrier foil. The electrodeposited copper foil with carrier of the present invention contains a carrier foil layer, an organic adhesive interface layer formed on the carrier foil layer, and an electrodeposited copper foil layer formed on the organic adhesive interface layer, wherein the difference between the coefficient of thermal expansion of material forming the carrier foil layer at a certain temperature and that of material forming the electrodeposited copper foil at the same temperature is 4×10−7/deg.C or more.

    摘要翻译: 本发明的目的是减少并稳定电沉积铜箔中载体箔的剥离强度,其中载体采用有机粘合剂界面,从而有利于载体箔的剥离。 本发明的带有载体的电沉积铜箔包含载体箔层,形成在载体箔层上的有机粘合界面层和形成在有机粘合界面层上的电沉积铜箔层,其中热系数 在一定温度下形成载体箔层的材料的膨胀和在相同温度下形成电沉积铜箔的材料的膨胀为4×10 -7或更高。

    Electrodeposition apparatus for producing electrodeposited copper foil and electrodeposited copper foil produced by the apparatus
    17.
    发明授权
    Electrodeposition apparatus for producing electrodeposited copper foil and electrodeposited copper foil produced by the apparatus 失效
    用于制造电沉积铜箔的电沉积装置和由该装置制造的电沉积铜箔

    公开(公告)号:US06652725B2

    公开(公告)日:2003-11-25

    申请号:US09838322

    申请日:2001-04-20

    IPC分类号: C25C112

    摘要: An object of the invention is to provide a method for continuously producing electrodeposited copper foil while thiourea-decomposed products remaining in copper electrolyte are removed through activated carbon treatment. Another object is to provide high-resistivity copper foil obtained through the method. The present invention further provides an electrodeposition apparatus including a path for circulating a copper sulfate solution, whereby in said path is provided a filtration means for removal of thiourea-decomposed products remaining in copper electrolyte.

    摘要翻译: 本发明的目的是提供一种连续生产电沉积铜箔的方法,同时通过活性炭处理除去留在铜电解液中的硫脲分解产物。 另一个目的是提供通过该方法获得的高电阻率铜箔。 本发明还提供了一种电沉积装置,其包括用于使硫酸铜溶液循环的路径,由此在所述路径中设置有用于除去残留在铜电解质中的硫脲分解产物的过滤装置。