摘要:
An object of the present invention is to provide a method for preparing a sulfuric acid base copper electrolytic solution used for formation of an electro-deposited copper film comprising a surface excellent in smoothness and gloss when formed by using the solution just after preparation and is prepared by using mono-sulfides. To achieve the object, a sulfuric acid base copper electrolytic solution is made to contain a sulfonated active sulfur compound, the bis(3-sulfopropyl)disulfide which is recommended for formation of a glossy electro-deposited copper film. And the bis(3-sulfopropyl)disulfide contained is obtained by converting a 3-mercapto-1-propanesulfonic acid into the bis(3-sulfopropyl)disulfide in an aqueous solution of the 3-mercapto-1-propanesulfonic acid by an oxidation reaction. In the oxidation reaction, an air bubbling method is preferably used to prevent oxidative decomposition of the 3-mercapto-1-propanesulfonic acid.
摘要:
An object of the present invention is to reduce and to stabilize peel strength of a carrier foil in an electrodeposited copper foil with carrier employing an organic adhesive interface, thereby facilitating peeling of the carrier foil. The electrodeposited copper foil with carrier of the present invention contains a carrier foil layer, an organic adhesive interface layer formed on the carrier foil layer, and an electrodeposited copper foil layer formed on the organic adhesive interface layer, wherein the difference between the coefficient of thermal expansion of material forming the carrier foil layer at a certain temperature and that of material forming the electrodeposited copper foil at the same temperature is 4×10−7/deg.C or more.
摘要:
It is an object of the present invention to provide an electrodeposited copper foil which has a lower profile and a higher gloss than low-profile electrodeposited copper foil conventionally supplied in markets. For achieving this object, the present invention employs an electrodeposited copper foil which has a super low profile, the surface roughness (Rzjis) of the deposit side of lower than 1.0-micron meter, and the gloss [Gs(60-deg.)] thereof of not lower than 400 irrespective to its thickness. The present invention also provides a manufacturing method of an electrodeposited copper foil obtained by electrodeposition using a sulfuric acid base copper electrolytic solution obtained by adding 3-mercapto-1-propanesulfonic acid and/or bis(3-sulfopropyl)disulfide, a quaternary ammonium salt polymer having a cyclic structure, and chlorine.
摘要:
A negative electrode for a non-aqueous electrolyte secondary cell includes a current collector an, formed on a surface or both surfaces thereof, an active material structure containing an electroconductive material with a low capability of forming a compound with lithium, and the active material structure includes 5% to 80% by weight of active material particles containing a material having a high capability for forming a compound with lithium. The active material structure can include an active material layer containing the active material particles and a surface-covering layer on the active material layer.
摘要:
A copper foil having improved resistance to abrasion damage during the manufacture of printed circuit boards has a uniform deposit of benzotriazole (BTA) or BTA derivative, optionally a mixture thereof, of at least about 5 mg/m2.
摘要翻译:在制造印刷电路板期间具有改善的抗磨损损伤的铜箔具有至少约5mg / m 2的苯并三唑(BTA)或BTA衍生物(任选其混合物)的均匀沉积。
摘要:
Disclosed is a negative electrode for a nonaqueous secondary battery included of a current collector and an active material structure containing an electro-conductive material having low capability of forming a lithium compound on at least one side of the current collector, the active material structure containing 5 to 80% by weight of active material particles containing a material having high capability of forming a lithium compound. The active material structure preferably has an active material layer containing the active material particles and a surface coating layer formed on the active material layer.
摘要:
An object of the invention is to provide a method for continuously producing electrodeposited copper foil while thiourea-decomposed products remaining in copper electrolyte are removed through activated carbon treatment. Another object is to provide high-resistivity copper foil obtained through the method. The present invention further provides an electrodeposition apparatus including a path for circulating a copper sulfate solution, whereby in said path is provided a filtration means for removal of thiourea-decomposed products remaining in copper electrolyte.
摘要:
To provide a dielectric-layer-provided copper foil or the like for extremely improving the product yield while making the most use of the increase effect of an electric capacity of a thin dielectric layer using the sputtering vapor deposition method. In the case of dielectric-layer-provided copper foils respectively having a dielectric layer on one side of a copper foil, the dielectric layer 6 is an inorganic-oxide sputter film having a thickness of 1.0 μm or less and formed on the one side of the copper foil in accordance with the sputtering vapor deposition method and the dielectric-layer-provided copper foils for respectively forming a capacitor layer, characterized in that a pit-like defective portion generated on the inorganic-oxide sputter film is sealed by polyimide resin are used.
摘要:
Disclosed is a negative electrode for a nonaqueous secondary battery comprised of a current collector and an active material structure containing an electro-conductive material having low capability of forming a lithium compound on at least one side of the current collector, the active material structure containing 5 to 80% by weight of active material particles containing a material having high capability of forming a lithium compound. The active material structure preferably has an active material layer containing the active material particles and a surface coating layer formed on the active material layer.
摘要:
An anode for a nonaqueous secondary battery comprising a current collector having formed thereon a first covering layer containing tin, a tin alloy, aluminum or an aluminum alloy and a second covering layer containing a metal having low capability of forming a lithium compound in that order. The anode may have an additional first covering layer formed on the second covering layer. A covering layer containing a copper etc. may be formed as an uppermost layer. Each layer can be formed by heat treating to get desired property. As heat treatment can be done in a short time, it has a great cost merit.