Electrodeposition apparatus for producing electrodeposited copper foil and electrodeposited copper foil produced by the apparatus
    8.
    发明授权
    Electrodeposition apparatus for producing electrodeposited copper foil and electrodeposited copper foil produced by the apparatus 失效
    用于制造电沉积铜箔的电沉积装置和由该装置制造的电沉积铜箔

    公开(公告)号:US06652725B2

    公开(公告)日:2003-11-25

    申请号:US09838322

    申请日:2001-04-20

    IPC分类号: C25C112

    摘要: An object of the invention is to provide a method for continuously producing electrodeposited copper foil while thiourea-decomposed products remaining in copper electrolyte are removed through activated carbon treatment. Another object is to provide high-resistivity copper foil obtained through the method. The present invention further provides an electrodeposition apparatus including a path for circulating a copper sulfate solution, whereby in said path is provided a filtration means for removal of thiourea-decomposed products remaining in copper electrolyte.

    摘要翻译: 本发明的目的是提供一种连续生产电沉积铜箔的方法,同时通过活性炭处理除去留在铜电解液中的硫脲分解产物。 另一个目的是提供通过该方法获得的高电阻率铜箔。 本发明还提供了一种电沉积装置,其包括用于使硫酸铜溶液循环的路径,由此在所述路径中设置有用于除去残留在铜电解质中的硫脲分解产物的过滤装置。

    Capacitor layer forming material, method of manufacturing a composite foil used where manufacturing the same, and print wiring board having a circuit where a capacitor is embedded, obtained by using the same
    9.
    发明申请
    Capacitor layer forming material, method of manufacturing a composite foil used where manufacturing the same, and print wiring board having a circuit where a capacitor is embedded, obtained by using the same 审中-公开
    电容器层形成材料,制造其中使用的复合箔的制造方法以及具有嵌入电容器的电路的印刷电路板通过使用它们获得

    公开(公告)号:US20060087794A1

    公开(公告)日:2006-04-27

    申请号:US11259354

    申请日:2005-10-27

    IPC分类号: H01G4/005

    摘要: It is an object to provide a capacitor layer forming material useful for a printed wiring board with a substrate of fluorine resin, liquid-crystal polymer or the like, which is fabricated by hot-pressing at 300 to 400° C., and showing no deterioration in strength after the hot-pressing. In order to achieve the object, the capacitor layer forming material, comprising a first electroconductive layer used for forming an upper electrode and second electroconductive layer used for forming a lower electrode with a dielectric layer in-between for a printed wiring board, has the second electroconductive layer made of a composite foil comprising a copper layer coated with one or more layers of, plated hard nickel, plated cobalt and plated nickel/cobalt alloy.

    摘要翻译: 本发明的目的是提供一种用于印刷线路板的电容器层形成材料,其具有氟树脂,液晶聚合物等的基材,其通过在300-400℃下热压而制成,并且不显示 热压后的强度变差。 为了实现该目的,电容器层形成材料包括用于形成上电极的第一导电层和用于形成用于印刷电路板的介电层之间的下电极的第二导电层,具有第二导电层 导电层由复合箔制成,包括涂覆有一层或多层电镀硬镍,镀钴和镀镍/钴合金的铜层。