公开(公告)号：US20160254097A1

公开(公告)日：2016-09-01

申请号：US15149309

申请日：2016-05-09

Applicant: Kemet Electronics Corporation

Inventor： John E. McConnell ,  Garry L. Renner ,  John Bultitude

IPC: H01G9/00 ,  H01G9/07 ,  H01G9/008 ,  H01G9/045

CPC classification number: H01G9/0032 ,  B23K1/0016 ,  B23K1/0053 ,  B23K1/008 ,  B23K1/203 ,  B23K35/0227 ,  B23K35/286 ,  B23K35/3613 ,  B23K2101/42 ,  H01G4/005 ,  H01G4/2325 ,  H01G4/30 ,  H01G9/0029 ,  H01G9/008 ,  H01G9/045 ,  H01G9/07 ,  H01L2224/83825 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/10253 ,  H01L2924/1461 ,  Y10T29/435 ,  H01L2924/00

Abstract: An improved method for forming a capacitor is provided as is a capacitor, or electrical component, formed by the method. The method includes providing an aluminum containing anode with an aluminum oxide dielectric thereon; forming a cathode on a first portion of the aluminum oxide dielectric; bonding an anode lead to the aluminum anode on a second portion of the aluminum oxide by a transient liquid phase sintered conductive material thereby metallurgical bonding the aluminum anode to the anode lead; and bonding a cathode lead to said cathode.

Abstract translation: 提供了一种用于形成电容器的改进方法，如通过该方法形成的电容器或电气部件。 该方法包括在其上提供含铝阳极的氧化铝电介质; 在所述氧化铝电介质的第一部分上形成阴极; 通过瞬态液相烧结导电材料将阳极引线连接到氧化铝的第二部分上的铝阳极，从而将铝阳极冶金地结合到阳极引线; 以及将阴极引线接合到所述阴极。

公开(公告)号：US20160071650A1

公开(公告)日：2016-03-10

申请号：US14925056

申请日：2015-10-28

Applicant: Kemet Electronics Corporation

Inventor： John E. McConnell ,  Garry L. Renner ,  John Bultitude ,  Allen Hill

IPC: H01G4/228 ,  H01G4/008 ,  H01G4/12 ,  H01G4/38 ,  H01G4/30

CPC classification number: H01G4/228 ,  B23K1/0016 ,  B23K1/0053 ,  B23K1/008 ,  B23K1/203 ,  B23K35/0227 ,  B23K35/3613 ,  B23K2101/40 ,  B23K2101/42 ,  H01G4/0085 ,  H01G4/12 ,  H01G4/2325 ,  H01G4/30 ,  H01G4/38 ,  H01L2224/83825 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/1461 ,  Y10T29/435 ,  H01L2924/00012 ,  H01L2924/00015 ,  H01L2924/00

Abstract: A stacked MLCC capacitor is provided wherein the capacitor stack comprises multilayered ceramic capacitors wherein each multilayered ceramic capacitor comprises first electrodes and second electrodes in an alternating stack with a dielectric between each first electrode and each adjacent second electrode. The first electrodes terminate at a first side and the second electrodes second side. A first transient liquid phase sintering conductive layer is the first side and in electrical contact with each first electrode; and a second transient liquid phase sintering conductive layer is on the second side and in electrical contact with each second electrode.

Abstract translation: 提供堆叠的MLCC电容器，其中电容器堆叠包括多层陶瓷电容器，其中每个多层陶瓷电容器包括第一电极和交替堆叠的第二电极，每个第一电极和每个相邻的第二电极之间具有电介质。 第一电极在第一侧和第二电极的第二侧终止。 第一瞬态液相烧结导电层是第一侧并与每个第一电极电接触; 并且第二瞬态液相烧结导电层位于第二侧上并与每个第二电极电接触。

公开(公告)号：US20250022661A1

公开(公告)日：2025-01-16

申请号：US18221091

申请日：2023-07-12

Applicant: KEMET Electronics Corporation

Inventor： Miles T. Ingram ,  John Bultitude ,  Randal J. Vaughan ,  Lonnie G. Jones ,  James T. Davis

IPC: H01G4/38 ,  H01G4/30 ,  H05K1/18

Abstract: Provided is a monolithic multilayered ceramic capacitor comprising multiple capacitive couples encased in a continuous ceramic. The continuous ceramic further comprises a ceramic separator between adjacent capacitive couples. Each capacitive couple comprises active electrodes wherein first active electrodes of adjacent active electrodes of each capacitive couple are in electrical contact with a first external termination and second active electrodes of adjacent active electrodes of each capacitive couple are in electrical contact with a second external termination.

公开(公告)号：US12040135B2

公开(公告)日：2024-07-16

申请号：US18107154

申请日：2023-02-08

Applicant: KEMET Electronics Corporation

Inventor： John Bultitude ,  Nathan A. Reed ,  Allen Templeton ,  James R. Magee ,  James Davis ,  Abhijit Gurav ,  Hunter Hayes ,  Hanzheng Guo

IPC: H01G4/12 ,  C04B35/465 ,  C04B35/495 ,  C04B35/50 ,  H01G4/30 ,  H01G4/40

CPC classification number: H01G4/1245 ,  C04B35/465 ,  C04B35/495 ,  C04B35/50 ,  H01G4/1227 ,  H01G4/30 ,  H01G4/306 ,  H01G4/40 ,  C04B2235/66

Abstract: Provided is an improved multilayered ceramic capacitor and an electronic device comprising the multilayered ceramic capacitor. The multilayer ceramic capacitor comprises first conductive plates electrically connected to first external terminations and second conductive plates electrically connected to second external terminations. The first conductive plates and second conductive plates form a capacitive couple. A ceramic portion is between the first conductive plates and said second conductive plates wherein the ceramic portion comprises paraelectric ceramic dielectric. The multilayer ceramic capacitor has a rated DC voltage and a rated AC VPP wherein the rated AC VPP is higher than the rated DC voltage.

公开(公告)号：US11178800B2

公开(公告)日：2021-11-16

申请号：US16517066

申请日：2019-07-19

Applicant: KEMET Electronics Corporation

Inventor： Lonnie G. Jones ,  Iain D. Kinnon ,  John Bultitude ,  Nathan A. Reed ,  Jeffrey W. Bell ,  George Michael Theis

IPC: H05K9/00 ,  H01G2/14 ,  H01G4/005 ,  H01C7/12 ,  H01C1/14

Abstract: Provided is an improved overvoltage protection element. The overvoltage protection device comprises at least one ESD protection couple comprising discharge electrodes in a plane, a gap insulator between the discharge electrodes, an overvoltage protection element parallel to the planar discharge electrodes wherein the overvoltage protection element comprises a conductor and an secondary material. The overvoltage protection element also comprises a primary insulator layer between the discharge electrodes and overvoltage protection element.

公开(公告)号：US20210327646A1

公开(公告)日：2021-10-21

申请号：US17233796

申请日：2021-04-19

Applicant: KEMET Electronics Corporation

Inventor： Mark R. Laps ,  John Bultitude ,  Philip M. Lessner ,  Lonnie G. Jones ,  Allen Templeton ,  Nathan A. Reed

IPC: H01G4/258 ,  H01G4/30 ,  H01G4/38 ,  H01G4/012 ,  H01G4/232

Abstract: Provided is a heat dissipating capacitor comprising internal electrodes of opposing polarity forming a capacitive couple between external terminations. A dielectric is between the internal electrodes. The heat dissipating capacitor comprises at least one thermal dissipation layer and at least one thermal conductive termination wherein the thermal dissipation layer is in thermally conductive contact with the thermal conductive termination.

公开(公告)号：US10984955B2

公开(公告)日：2021-04-20

申请号：US16439237

申请日：2019-06-12

Applicant: KEMET Electronics Corporation

Inventor： John Bultitude ,  John E. McConnell ,  Galen W. Miller

IPC: H01G4/30 ,  B23K1/00 ,  B23K1/005 ,  B23K1/008 ,  B23K1/20 ,  B23K35/36 ,  B23K35/02 ,  H01G4/38 ,  H01G4/232 ,  H01G4/008 ,  H01G4/12 ,  B23K101/40 ,  B23K101/42

Abstract: An electronic device is described wherein the electronic device comprises a substrate with a first conductive metal layer and a second conductive metal layer. A first microphonic noise reduction structure is in electrical contact with the first conductive metal layer wherein the first microphonic noise reduction layer comprises at least one of the group consisting of a compliant non-metallic layer and a shock absorbing conductor comprising offset mounting tabs with a space there between coupled with at least one stress relieving portion. An electronic component comprising a first external termination of a first polarity and a second external termination of a second polarity is integral to the electronic device and the first microphonic noise reduction structure and the first external termination are adhesively bonded by a transient liquid phase sintering adhesive.

公开(公告)号：US20200273791A1

公开(公告)日：2020-08-27

申请号：US16553395

申请日：2019-08-28

Applicant: KEMET Electronics Corporation

Inventor： Allen Templeton ,  John Bultitude ,  Lonnie G. Jones ,  Philip M. Lessner

IPC: H01L23/498 ,  H01L23/522 ,  H01L23/367 ,  H01L29/778

Abstract: An improved electronic assembly is provided. The electronic assembly comprises a ceramic interposer comprising multiple layers. The active layers of the multiple layers form an embedded capacitor comprising parallel electrodes with a dielectric between adjacent electrodes wherein adjacent electrodes have opposite polarity. A wide band gap device is also on the multilayered ceramic interposer.

公开(公告)号：US20200260618A1

公开(公告)日：2020-08-13

申请号：US16859261

申请日：2020-04-27

Applicant: KEMET Electronics Corporation

Inventor： Lonnie G. Jones ,  Iain D. Kinnon ,  John Bultitude ,  Nathan A. Reed ,  Jeffrey W. Bell ,  George Michael Theis

IPC: H05K9/00 ,  H01G4/005 ,  H01C7/12 ,  H01C1/14 ,  H01G2/14

Abstract: Provided is an improved overvoltage protection element. The overvoltage protection device comprises at least one ESD protection couple comprising discharge electrodes in a plane, a gap insulator between the discharge electrodes, an overvoltage protection element parallel to the planar discharge electrodes wherein the overvoltage protection element comprises a conductor and an secondary material. The overvoltage protection element also comprises a primary insulator layer between the discharge electrodes and overvoltage protection element.

公开(公告)号：US20200163260A1

公开(公告)日：2020-05-21

申请号：US16517066

申请日：2019-07-19

Applicant: KEMET Electronics Corporation

Inventor： Lonnie G. Jones ,  Iain D. Kinnon ,  John Bultitude ,  Nathan A. Reed ,  Jeffrey W. Bell ,  George Michael Theis

IPC: H05K9/00 ,  H01G2/14 ,  H01C1/14 ,  H01C7/12 ,  H01G4/005

Abstract: Provided is an improved overvoltage protection element. The overvoltage protection device comprises at least one ESD protection couple comprising discharge electrodes in a plane, a gap insulator between the discharge electrodes, an overvoltage protection element parallel to the planar discharge electrodes wherein the overvoltage protection element comprises a conductor and an secondary material. The overvoltage protection element also comprises a primary insulator layer between the discharge electrodes and overvoltage protection element.