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    Electronic Component Structures with Reduced Microphonic Noise
    13.
    发明申请
    Electronic Component Structures with Reduced Microphonic Noise 审中-公开
    具有降低话筒噪声的电子元件结构

    公开(公告)号：US20170025223A1

    公开(公告)日：2017-01-26

    申请号：US15285210

    申请日：2016-10-04

    Applicant: KEMET Electronics Corporation

    Inventor： John Bultitude ,  John E. McConnell ,  Galen W. Miller

    IPC: H01G4/30 ,  H01G4/228

    CPC classification number: H01G4/30 ,  B23K1/0016 ,  B23K1/0053 ,  B23K1/008 ,  B23K1/203 ,  B23K35/0227 ,  B23K35/3613 ,  B23K2101/40 ,  B23K2101/42 ,  H01G4/0085 ,  H01G4/12 ,  H01G4/232 ,  H01G4/2325 ,  H01G4/38 ,  H01L2224/83825 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/1461 ,  Y10T29/435 ,  H01L2924/00012 ,  H01L2924/00015 ,  H01L2924/00

    Abstract: An electronic device is described wherein the electronic device comprises a substrate with a first conductive metal layer and a second conductive metal layer. A first microphonic noise reduction structure is in electrical contact with the first conductive metal layer wherein the first microphonic noise reduction layer comprises at least one of the group consisting of a compliant non-metallic layer and a shock absorbing conductor comprising offset mounting tabs with a space there between coupled with at least one stress relieving portion. An electronic component comprising a first external termination of a first polarity and a second external termination of a second polarity is integral to the electronic device and the first microphonic noise reduction structure and the first external termination are adhesively bonded by a transient liquid phase sintering adhesive.

    Abstract translation: 描述了一种电子器件，其中电子器件包括具有第一导电金属层和第二导电金属层的衬底。 第一麦克风噪声降低结构与第一导电金属层电接触，其中第一麦克风噪声降低层包括柔性非金属层和减震导体中的至少一个，包括具有空间的偏移安装突片 其间耦合有至少一个应力消除部分。 包括第一极性的第一外部终端和第二极性的第二外部终端的电子部件与电子设备成一体，并且第一麦克风噪声降低结构和第一外部端接通过瞬态液相烧结粘合剂粘合。

    High Density Multi-Component Packages
    16.
    发明申请
    High Density Multi-Component Packages 审中-公开

    公开(公告)号：US20190090348A1

    公开(公告)日：2019-03-21

    申请号：US16195346

    申请日：2018-11-19

    Applicant: KEMET Electronics Corporation

    Inventor： John Bultitude ,  Galen Miller ,  John E. McConnell

    IPC: H05K1/18 ,  H01L23/498 ,  H05K3/30

    Abstract: Provided is a high density multi-component package and a method of manufacturing a high density multi-component package. The high density multi-component package comprises at least two electronic components wherein each electronic component of the electronic components comprise a first external termination and a second external termination. At least one interposer is between the adjacent electronic components and attached to the interposer by an interconnect wherein the interposer is selected from an active interposer and a mechanical interposer. Adjacent electronic components are connected serially.

    Component Stability Structure
    19.
    发明申请
    Component Stability Structure 审中-公开

    公开(公告)号：US20170367228A1

    公开(公告)日：2017-12-21

    申请号：US15187451

    申请日：2016-06-20

    Applicant: KEMET Electronics Corporation

    Inventor： John E. McConnell ,  John Bultitude

    IPC: H05K13/04 ,  H05K3/34

    Abstract: An electronic component assembly is described which comprises a stack of electronic components wherein each electronic component comprises a face and external terminations. A component stability structure is attached to at least one face. A circuit board is provided wherein the circuit board comprises circuit traces arranged for electrical engagement with the external terminations. The component stability structure mechanically engages with the circuit board and inhibits the electronic device from moving relative to the circuit board.

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