公开(公告)号：US20150369753A1

公开(公告)日：2015-12-24

申请号：US14838194

申请日：2015-08-27

Applicant: KLA-Tencor Corporation

Inventor： Anatoly Romanovsky ,  Ivan Maleev ,  Daniel Kavaldjiev ,  Yury Yuditsky ,  Dirk Woll ,  Stephen Biellak ,  Mehdi Vaez-Iravani ,  Guoheng Zhao

IPC: G01N21/88 ,  G01N21/95

CPC classification number: G01N21/9501 ,  G01N21/47 ,  G01N21/8806 ,  G01N21/8851 ,  G01N21/956

Abstract: Systems configured to inspect a wafer are provided. One system includes an illumination subsystem configured to direct pulses of light to an area on a wafer; a scanning subsystem configured to scan the pulses of light across the wafer; a collection subsystem configured to image pulses of light scattered from the area on the wafer to a sensor, wherein the sensor is configured to integrate a number of the pulses of scattered light that is fewer than a number of the pulses of scattered light that can be imaged on the entire area of the sensor, and wherein the sensor is configured to generate output responsive to the integrated pulses of scattered light; and a computer subsystem configured to detect defects on the wafer using the output generated by the sensor.

Abstract translation: 提供了配置用于检查晶片的系统。 一个系统包括被配置为将光脉冲引导到晶片上的区域的照明子系统; 扫描子系统，被配置为扫描穿过所述晶片的光脉冲; 配置为将从晶片上的区域散射的光脉冲成像到传感器的集合子系统，其中，所述传感器被配置为将少数散射光的脉冲的数量积分成散射光的脉冲数， 在传感器的整个区域成像，并且其中传感器被配置为响应于散射光的积分脉冲产生输出; 以及计算机子系统，被配置为使用由所述传感器产生的输出来检测所述晶片上的缺陷。

公开(公告)号：US09086389B2

公开(公告)日：2015-07-21

申请号：US14062832

申请日：2013-10-24

Applicant: KLA-Tencor Corporation

Inventor： Daniel Ivanov Kavaldjiev ,  Stephen Biellak ,  Guoheng Zhao ,  Mehdi Vaez-Iravani

IPC: G01N21/00 ,  G01N21/95 ,  H01L27/144

CPC classification number: G01N21/9501 ,  H01L27/1446

Abstract: Methods and systems for enhancing the dynamic range of a high sensitivity inspection system are presented. The dynamic range of a high sensitivity inspection system is increased by directing a portion of the light collected from each pixel of the wafer inspection area toward an array of avalanche photodiodes (APDs) operating in Geiger mode and directing another portion of the light collected from each pixel of the wafer inspection area toward another array of photodetectors having a larger range. The array of APDs operating in Geiger mode is useful for inspection of surfaces that generate extremely low photon counts, while other photodetectors are useful for inspection of larger defects that generate larger numbers of scattered photons. In some embodiments, the detected optical field is split between two different detectors. In some other embodiments, a single detector includes both APDs operating in Geiger mode and other photodetectors having a larger range.

Abstract translation: 介绍了提高高灵敏度检测系统动态范围的方法和系统。 高灵敏度检测系统的动态范围通过将从晶片检查区域的每个像素收集的光的一部分引导到以盖革模式操作的雪崩光电二极管（APD）阵列并且引导从每个 晶片检查区域的像素朝向具有较大范围的另一个光电检测器阵列。 以Geiger模式操作的APD阵列对于检查产生极低光子数的表面是有用的，而其他光电探测器可用于检查产生更大数量的散射光子的较大缺陷。 在一些实施例中，检测到的光场在两个不同的检测器之间被分开。 在一些其他实施例中，单个检测器包括以盖革模式操作的APD和具有较大范围的其它光电探测器。

公开(公告)号：US09052190B2

公开(公告)日：2015-06-09

申请号：US13797901

申请日：2013-03-12

Applicant: KLA-Tencor Corporation

Inventor： Ali Salehpour ,  Jaydeep Sinha ,  Kurt Lindsay Haller ,  Pradeep Vukkadala ,  George Kren ,  Jiayao Zhang ,  Mehdi Vaez-Iravani

IPC: G01B11/02 ,  G01B11/30

CPC classification number: G01B11/303 ,  G01B11/306 ,  G01B2210/56

Abstract: A method of providing high accuracy inspection or metrology in a bright-field differential interference contrast (BF-DIC) system is described. This method can include creating first and second beams from a first light beam. The first and second beams have round cross-sections, and form first partially overlapping scanning spots radially displaced on a substrate. Third and fourth beams are created from the first light beam or a second light beam. The third and fourth beams have elliptical cross-sections, and form second partially overlapping scanning spots tangentially displaced on the substrate. At least one portion of the substrate can be scanned using the first and second partially overlapping scanning spots as the substrate is rotated. Radial and tangential slopes can be determined using measurements obtained from the scanning using the first and second partially overlapping scanning spots. These slopes can be used to determine wafer shape or any localized topography feature.

Abstract translation: 描述了在亮场差分干涉对比（BF-DIC）系统中提供高精度检测或计量的方法。 该方法可以包括从第一光束产生第一和第二光束。 第一和第二光束具有圆形横截面，并形成在衬底上径向位移的第一部分重叠的扫描点。 从第一光束或第二光束产生第三和第四光束。 第三和第四光束具有椭圆形横截面，并形成在衬底上切向位移的第二部分重叠的扫描点。 当衬底旋转时，可以使用第一和第二部分重叠的扫描点来扫描衬底的至少一部分。 可以使用从使用第一和第二部分重叠的扫描点的扫描获得的测量来确定径向和切向斜率。 这些斜面可用于确定晶片形状或任何局部地形特征。

公开(公告)号：US08953869B2

公开(公告)日：2015-02-10

申请号：US13905448

申请日：2013-05-30

Applicant: KLA-Tencor Corporation

Inventor： Mehran Nasser-Ghodsi ,  Stanley E. Stokowski ,  Mehdi Vaez-Iravani

IPC: G06K9/00 ,  G06T7/00

CPC classification number: G06T7/001 ,  G06T2207/10061 ,  G06T2207/30148

Abstract: Disclosed are methods and apparatus for inspecting an extreme ultraviolet (EUV) reticle is disclosed. An optical inspection tool is used to obtain a phase defect map for the EUV reticle before a pattern is formed on the EUV reticle, and the phase defect map identifies a position of each phase defect on the EUV reticle. After the pattern is formed on the EUV reticle, a charged particle tool is used to obtain an image of each reticle portion that is proximate to each position of each phase defect as identified in the phase defect map. The phase defect map and one or images of each reticle portion that is proximate to each position of each phase defect are displayed or stored so as to facilitate analysis of whether to repair or discard the EUV reticle.

Abstract translation: 公开了用于检查极紫外（EUV）掩模版的方法和装置。 在EUV掩模版上形成图案之前，使用光学检查工具获得EUV掩模版的相位缺陷图，并且相位缺陷图识别EUV掩模版上每个相位缺陷的位置。 在EUV掩模版上形成图案之后，使用带电粒子工具来获得在相位缺陷图中所识别的每个相缺陷的每个位置附近的每个掩模版部分的图像。 显示或存储相位缺陷图以及接近每个相位缺陷的每个位置的每个标线片部分的一个或多个图像，以便于分析是否修复或丢弃EUV掩模版。

公开(公告)号：US20170205358A1

公开(公告)日：2017-07-20

申请号：US15393658

申请日：2016-12-29

Applicant: KLA-Tencor Corporation

Inventor： Mehdi Vaez-Iravani ,  Lawrence Robert Miller

IPC: G01N21/88 ,  G01N21/95

CPC classification number: G01N21/8806 ,  G01N21/9501 ,  G01N21/95623 ,  G01N2021/8822 ,  G01N2021/8845 ,  G01N2201/12

Abstract: A compact and versatile multi-spot inspection imaging system employs an objective for focusing an array of radiation beams to a surface and a second reflective or refractive objective having a large numerical aperture for collecting scattered radiation from the array of illuminated spots. The scattered radiation from each illuminated spot is focused to a corresponding optical fiber channel so that information about a scattering may be conveyed to a corresponding detector in a remote detector array for processing. In one embodiment, a one-dimensional array of illumination beams is directed at an oblique angle to the surface to illuminate a line of illuminated spots at an angle to the plane of incidence. Radiation scattered from the spots are collected along directions perpendicular to the line of spots or in a double dark field configuration.

公开(公告)号：US09568435B2

公开(公告)日：2017-02-14

申请号：US14465656

申请日：2014-08-21

Applicant: KLA-Tencor Corporation

Inventor： Mehdi Vaez-Iravani ,  Lawrence Robert Miller

IPC: G01N21/00 ,  G01N21/88 ,  G01N21/956 ,  G01N21/95

CPC classification number: G01N21/8806 ,  G01N21/9501 ,  G01N21/95623 ,  G01N2021/8822 ,  G01N2021/8845 ,  G01N2201/12

Abstract: A compact and versatile multi-spot inspection imaging system employs an objective for focusing an array of radiation beams to a surface and a second reflective or refractive objective having a large numerical aperture for collecting scattered radiation from the array of illuminated spots. The scattered radiation from each illuminated spot is focused to a corresponding optical fiber channel so that information about a scattering may be conveyed to a corresponding detector in a remote detector array for processing. In one embodiment, a one-dimensional array of illumination beams is directed at an oblique angle to the surface to illuminate a line of illuminated spots at an angle to the plane of incidence. Radiation scattered from the spots are collected along directions perpendicular to the line of spots or in a double dark field configuration.

Abstract translation: 紧凑且通用的多点检查成像系统采用将辐射束阵列聚焦到表面的目标和具有大数值孔径的第二反射或折射物镜，用于收集来自照明点阵列的散射辐射。 来自每个照明点的散射辐射被聚焦到相应的光纤通道，使得关于散射的信息可以被传送到用于处理的远程检测器阵列中的相应检测器。 在一个实施例中，照明光束的一维阵列以与入射平面成一角度的一定角度照射到该表面上的倾斜角度。 从斑点散射的辐射沿垂直于斑点线的方向或双暗场构型收集。

公开(公告)号：US09404873B2

公开(公告)日：2016-08-02

申请号：US13783290

申请日：2013-03-02

Applicant: KLA-Tencor Corporation

Inventor： Stephen Biellak ,  Mehdi Vaez-Iravani

IPC: G01N21/88 ,  G01N21/95

CPC classification number: G01N21/8806 ,  G01N21/9501

Abstract: Systems configured to inspect a wafer are provided. One system includes an illumination subsystem configured to illuminate a set of spots on a wafer and a collection subsystem configured to collect light from the set of spots. The collection subsystem separately images the light collected from each of the individual spots onto only a corresponding first detector of a first detection subsystem. The collection subsystem also images the light collected from at least some of the individual spots onto a number of second detectors of a second detection subsystem that is less than a number of spots in the set. Output produced by the first and second detectors can be used to detect defects on the wafer.

Abstract translation: 提供了配置用于检查晶片的系统。 一个系统包括被配置为照亮晶片上的一组斑点的照明子系统和被配置为收集该组斑点的光的收集子系统。 收集子系统将从每个单个斑点收集的光分别成像到第一检测子系统的对应的第一检测器上。 收集子系统还将从至少一些单个点收集的光成像到第二检测子系统的多个第二检测器，该第二检测子系统小于集合中的多个点。 由第一和第二检测器产生的输出可用于检测晶片上的缺陷。

公开(公告)号：US09182358B2

公开(公告)日：2015-11-10

申请号：US13834662

申请日：2013-03-15

Applicant: KLA-Tencor Corporation

Inventor： Zhiwei Xu ,  Christian Wolters ,  Juergen Reich ,  Bret Whiteside ,  Guoheng Zhao ,  Jijen Vazhaeparambil ,  Stephen Biellak ,  Sam Shamouilian ,  Mehdi Vaez-Iravani

IPC: G01N21/00 ,  G01N21/95 ,  G01N21/956

CPC classification number: G01N21/9501 ,  G01N21/956

Abstract: The disclosure is directed to a system and method for inspecting a spinning sample by substantially simultaneously scanning multiple spots on a surface of the sample utilizing a plurality of illumination beams. Portions of illumination reflected, scattered, or radiated from respective spots on the surface of the sample are collected by at least one detector array. Information associated with at least one defect of the sample is determined by at least one computing system in communication with the detector array. According to various embodiments, at least one of scan pitch, spot size, spot separation, and spin rate is controlled to compensate pitch error due to tangential spot separation.

Abstract translation: 本公开涉及一种用于通过基本上同时使用多个照明光束扫描样品表面上的多个点来检查纺丝样品的系统和方法。 通过至少一个检测器阵列收集从样品表面上的各个点反射，散射或辐射的照射部分。 与样品的至少一个缺陷相关联的信息由与检测器阵列通信的至少一个计算系统确定。 根据各种实施例，控制扫描间距，光斑尺寸，光点分离和旋转速率中的至少一个以补偿由于切点分离引起的俯仰误差。

公开(公告)号：US09679372B2

公开(公告)日：2017-06-13

申请号：US14591181

申请日：2015-01-07

Applicant: KLA-Tencor Corporation

Inventor： Mehran Nasser-Ghodsi ,  Stanley E. Stokowski ,  Mehdi Vaez-Iravani

IPC: G06K9/00 ,  G06T7/00

CPC classification number: G06T7/001 ,  G06T2207/10061 ,  G06T2207/30148

Abstract: Disclosed are methods and apparatus for inspecting an extreme ultraviolet (EUV) reticle is disclosed. An inspection tool for detecting electromagnetic waveforms is used to obtain a phase defect map for the EUV reticle before a pattern is formed on the EUV reticle, and the phase defect map identifies a position of each phase defect on the EUV reticle. After the pattern is formed on the EUV reticle, a charged particle tool is used to obtain an image of each reticle portion that is proximate to each position of each phase defect as identified in the phase defect map. The phase defect map and one or images of each reticle portion that is proximate to each position of each phase defect are displayed or stored so as to facilitate analysis of whether to repair or discard the EUV reticle.

公开(公告)号：US09619878B2

公开(公告)日：2017-04-11

申请号：US14251312

申请日：2014-04-11

Applicant: KLA-Tencor Corporation

Inventor： Fred Stanke ,  Ilya Toytman ,  David Alles ,  Gregg Anthony Inderhees ,  Stanley E. Stokowski ,  Mehdi Vaez-Iravani

IPC: G06K9/00 ,  G06T7/00 ,  G01N21/956

CPC classification number: G06T7/001 ,  G01N21/956 ,  G01N2021/95676 ,  G06K9/00 ,  G06T2207/10056 ,  G06T2207/30148

Abstract: Optical inspection methods and apparatus for high-resolution photomasks using only a test image. A filter is applied to an image signal received from radiation that is transmitted by or reflected from a photomask having a test image. The filter may be implemented using programmed control to adjust and control filter conditions, illumination conditions, and magnification conditions.