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    Asymmetrical detector design and methodology
    1.
    发明授权
    Asymmetrical detector design and methodology 有权
    不对称探测器的设计和方法

    公开(公告)号：US09418819B2

    公开(公告)日：2016-08-16

    申请号：US14476537

    申请日：2014-09-03

    Applicant: KLA-Tencor Corporation

    Inventor： John Gerling ,  Tomas Plettner ,  Mehran Nasser-Ghodsi

    IPC: G21K5/04 ,  H01J37/28 ,  H01J37/244

    CPC classification number: H01J37/28 ,  H01J37/244 ,  H01J2237/2446 ,  H01J2237/28

    Abstract: A charged particle detection device has an active portion for configured to produce a signal in response secondary charged particles emitted from a sample landing on the active portion. The active portion is shaped to accommodate an expected asymmetric pattern of the secondary charged particles at a detector. This abstract is provided to comply with rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.

    Abstract translation: 带电粒子检测装置具有有源部分，用于配置为产生响应从活性部分上的样品着陆点发射的二次带电粒子的信号。 活性部分被成形为在检测器处适应预期的二次带电粒子的非对称图案。 提供该摘要以符合要求抽象的规则，允许搜索者或其他读者快速确定技术公开内容的主题。 提交它的理解是，它不会用于解释或限制权利要求的范围或含义。

    DUMMY BARRIER LAYER FEATURES FOR PATTERNING OF SPARSELY DISTRIBUTED METAL FEATURES ON THE BARRIER WITH CMP
    2.
    发明申请
    DUMMY BARRIER LAYER FEATURES FOR PATTERNING OF SPARSELY DISTRIBUTED METAL FEATURES ON THE BARRIER WITH CMP 审中-公开
    用于在具有CMP的障碍物上分布分布的金属特征的DUMMY BARRIER层特征

    公开(公告)号：US20150076697A1

    公开(公告)日：2015-03-19

    申请号：US14485574

    申请日：2014-09-12

    Applicant: KLA-Tencor Corporation

    Inventor： Tomas Plettner ,  Mehran Nasser-Ghodsi ,  John Gerling

    IPC: H01L21/768 ,  H01L23/532 ,  H01L23/522

    CPC classification number: H01L21/76865 ,  H01J9/025 ,  H01L23/522 ,  H01L2221/1094 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A semiconductor device comprises a plurality of device features formed on a substrate and a plurality of dummy features formed on the substrate and across an open region between the device features. Adjacent device features are spaced apart by a distance of 100 microns or more. Each device feature includes a barrier island and a metal layer on top of the barrier island. Each dummy feature has a structure that corresponds to the structure of the barrier island. This abstract is provided to comply with rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.

    Abstract translation: 半导体器件包括形成在衬底上的多个器件特征以及形成在衬底上并穿过器件特征之间的开放区域的多个虚拟特征。 相邻的设备特征间隔开100微米或更大的距离。 每个设备特征包括屏障岛和在屏障岛顶部的金属层。 每个虚拟特征具有对应于屏障岛的结构的结构。 提供该摘要以符合要求抽象的规则，允许搜索者或其他读者快速确定技术公开内容的主题。 提交它的理解是，它不会用于解释或限制权利要求的范围或含义。

    Apparatus and methods for inspecting extreme ultra violet reticles
    3.
    发明授权
    Apparatus and methods for inspecting extreme ultra violet reticles 有权
    用于检查极端紫外线掩模版的装置和方法

    公开(公告)号：US08953869B2

    公开(公告)日：2015-02-10

    申请号：US13905448

    申请日：2013-05-30

    Applicant: KLA-Tencor Corporation

    Inventor： Mehran Nasser-Ghodsi ,  Stanley E. Stokowski ,  Mehdi Vaez-Iravani

    IPC: G06K9/00 ,  G06T7/00

    CPC classification number: G06T7/001 ,  G06T2207/10061 ,  G06T2207/30148

    Abstract: Disclosed are methods and apparatus for inspecting an extreme ultraviolet (EUV) reticle is disclosed. An optical inspection tool is used to obtain a phase defect map for the EUV reticle before a pattern is formed on the EUV reticle, and the phase defect map identifies a position of each phase defect on the EUV reticle. After the pattern is formed on the EUV reticle, a charged particle tool is used to obtain an image of each reticle portion that is proximate to each position of each phase defect as identified in the phase defect map. The phase defect map and one or images of each reticle portion that is proximate to each position of each phase defect are displayed or stored so as to facilitate analysis of whether to repair or discard the EUV reticle.

    Abstract translation: 公开了用于检查极紫外（EUV）掩模版的方法和装置。 在EUV掩模版上形成图案之前，使用光学检查工具获得EUV掩模版的相位缺陷图，并且相位缺陷图识别EUV掩模版上每个相位缺陷的位置。 在EUV掩模版上形成图案之后，使用带电粒子工具来获得在相位缺陷图中所识别的每个相缺陷的每个位置附近的每个掩模版部分的图像。 显示或存储相位缺陷图以及接近每个相位缺陷的每个位置的每个标线片部分的一个或多个图像，以便于分析是否修复或丢弃EUV掩模版。

    MULTI-LAYER CERAMIC VACUUM TO ATMOSPHERE ELECTRIC FEED THROUGH
    4.
    发明申请
    MULTI-LAYER CERAMIC VACUUM TO ATMOSPHERE ELECTRIC FEED THROUGH 有权
    多层陶瓷真空通过大气电力进料

    公开(公告)号：US20140318855A1

    公开(公告)日：2014-10-30

    申请号：US14256828

    申请日：2014-04-18

    Applicant: KLA-Tencor Corporation

    Inventor： Robert Haynes ,  Mehran Nasser-Ghodsi

    IPC: H02G3/22 ,  H05K3/40 ,  H02G1/14

    CPC classification number: H05K3/4046 ,  H05K1/147 ,  H05K3/365 ,  H05K3/4061 ,  H05K3/4629 ,  H05K2201/10265 ,  H05K2201/10378 ,  H05K2201/10545 ,  Y10T29/49155 ,  Y10T29/49165

    Abstract: Embodiments of this invention use multi-layer ceramic substrate with one or more hermetically sealed and filled metal vias with smaller pitch and size in combination with flexible printed circuit cables and interposers to provide a custom electric feed through for vacuum to atmosphere chambers. This abstract is provided to comply with rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.

    Abstract translation: 本发明的实施例使用具有一个或多个具有较小节距和尺寸的密封和填充的金属通孔的多层陶瓷基板，与柔性印刷电路电缆和插入件组合，以提供用于真空到大气室的定制电加料。 提供该摘要以符合要求抽象的规则，允许搜索者或其他读者快速确定技术公开内容的主题。 提交它的理解是，它不会用于解释或限制权利要求的范围或含义。

    Multi-column scanning electron microscopy system
    5.
    发明授权
    Multi-column scanning electron microscopy system 有权

    公开(公告)号：US10354832B2

    公开(公告)日：2019-07-16

    申请号：US15616749

    申请日：2017-06-07

    Applicant: KLA-Tencor Corporation

    Inventor： Robert Haynes ,  John Gerling ,  Aron Welk ,  Christopher Sears ,  Felipe Fuks ,  Mehran Nasser-Ghodsi ,  Tomas Plettner

    IPC: H01J37/147 ,  H01J37/14 ,  H01J37/285 ,  H01J37/18

    Abstract: A multi-column scanning electron microscopy (SEM) system is disclosed. The SEM system includes a source assembly. The source assembly includes two or more electron beam sources configured to generate a plurality of electron beams. The source assembly also includes two or more sets of positioners configured to actuate the two or more electron beam sources. The SEM system also includes a column assembly. The column assembly includes a plurality of substrate arrays. The column assembly also includes two or more electron-optical columns formed by a set of column electron-optical elements bonded to the plurality of substrate arrays. The SEM system also includes a stage configured to secure a sample that at least one of emits or scatters electrons in response to the plurality of electron beams directed by the two or more electron-optical columns to the sample.

    Multi-layer ceramic vacuum to atmosphere electric feed through
    8.
    发明授权
    Multi-layer ceramic vacuum to atmosphere electric feed through 有权
    多层陶瓷真空至大气电动进料通过

    公开(公告)号：US09591770B2

    公开(公告)日：2017-03-07

    申请号：US14256828

    申请日：2014-04-18

    Applicant: KLA-Tencor Corporation

    Inventor： Robert Haynes ,  Mehran Nasser-Ghodsi

    IPC: H02G3/22 ,  H02G1/14 ,  H05K3/40 ,  H05K1/14 ,  H05K3/36 ,  H05K3/46

    CPC classification number: H05K3/4046 ,  H05K1/147 ,  H05K3/365 ,  H05K3/4061 ,  H05K3/4629 ,  H05K2201/10265 ,  H05K2201/10378 ,  H05K2201/10545 ,  Y10T29/49155 ,  Y10T29/49165

    Abstract: Embodiments of this invention use multi-layer ceramic substrate with one or more hermetically sealed and filled metal vias with smaller pitch and size in combination with flexible printed circuit cables and interposers to provide a custom electric feed through for vacuum to atmosphere chambers. This abstract is provided to comply with rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.

    Abstract translation: 本发明的实施例使用具有一个或多个具有较小节距和尺寸的密封和填充的金属通孔的多层陶瓷基板，与柔性印刷电路电缆和插入件组合，以提供用于真空到大气室的定制电加料。 提供该摘要以符合要求抽象的规则，允许搜索者或其他读者快速确定技术公开内容的主题。 提交它的理解是，它不会用于解释或限制权利要求的范围或含义。

    APPARATUS AND METHODS FOR INSPECTING EXTREME ULTRA VIOLET RETICLES
    10.
    发明申请
    APPARATUS AND METHODS FOR INSPECTING EXTREME ULTRA VIOLET RETICLES 有权
    检测超极紫外线反应物的装置和方法

    公开(公告)号：US20150117754A1

    公开(公告)日：2015-04-30

    申请号：US14591181

    申请日：2015-01-07

    Applicant: KLA-Tencor Corporation

    Inventor： Mehran Nasser-Ghodsi ,  Stanley E. Stokowski ,  Mehdi Vaez-Iravani

    IPC: G06T7/00

    CPC classification number: G06T7/001 ,  G06T2207/10061 ,  G06T2207/30148

    Abstract: Disclosed are methods and apparatus for inspecting an extreme ultraviolet (EUV) reticle is disclosed. An inspection tool for detecting electromagnetic waveforms is used to obtain a phase defect map for the EUV reticle before a pattern is formed on the EUV reticle, and the phase defect map identifies a position of each phase defect on the EUV reticle. After the pattern is formed on the EUV reticle, a charged particle tool is used to obtain an image of each reticle portion that is proximate to each position of each phase defect as identified in the phase defect map. The phase defect map and one or images of each reticle portion that is proximate to each position of each phase defect are displayed or stored so as to facilitate analysis of whether to repair or discard the EUV reticle.

    Abstract translation: 公开了用于检查极紫外（EUV）掩模版的方法和装置。 在EUV掩模版上形成图案之前，使用用于检测电磁波的检查工具来获得EUV掩模版的相位缺陷图，并且相位缺陷图识别EUV掩模版上每个相位缺陷的位置。 在EUV掩模版上形成图案之后，使用带电粒子工具来获得在相位缺陷图中所识别的每个相缺陷的每个位置附近的每个掩模版部分的图像。 显示或存储相位缺陷图以及接近每个相位缺陷的每个位置的每个标线片部分的一个或多个图像，以便于分析是否修复或丢弃EUV标线片。

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