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公开(公告)号:US10663286B2
公开(公告)日:2020-05-26
申请号:US15800877
申请日:2017-11-01
Applicant: KLA-Tencor Corporation
Inventor: Houssam Chouaib , Zhengquan Tan
Abstract: Methods and systems disclosed herein can measure thin film stacks, such as film on grating and bandgap on grating in semiconductors. For example, the thin film stack may be a 1D film stack, a 2D film on grating, or a 3D film on grating. One or more effective medium dispersion models are created for the film stack. Each effective medium dispersion model can substitute for one or more layers. A thickness of one or more layers can be determined using the effective medium dispersion based scatterometry model. In an instance, three effective medium dispersion based scatterometry models are developed and used to determine thickness of three layers in a film stack.
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12.
公开(公告)号:US20190286787A1
公开(公告)日:2019-09-19
申请号:US16352776
申请日:2019-03-13
Applicant: KLA-Tencor Corporation
Inventor: Houssam Chouaib , Alexander Kuznetsov
IPC: G06F17/50 , G01R31/309
Abstract: Methods and systems for generating measurement models of nanowire based semiconductor structures based on re-useable, parametric models are presented herein. Metrology systems employing these models are configured to measure structural and material characteristics (e.g., material composition, dimensional characteristics of structures and films, etc.) associated with nanowire semiconductor fabrication processes. The re-useable, parametric models of nanowire based semiconductor structures enable measurement model generation that is substantially simpler, less error prone, and more accurate. As a result, time to useful measurement results is significantly reduced, particularly when modelling complex, nanowire based structures. The re-useable, parametric models of nanowire based semiconductor structures are useful for generating measurement models for both optical metrology and x-ray metrology, including soft x-ray metrology and hard x-ray metrology.
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公开(公告)号:US20190178788A1
公开(公告)日:2019-06-13
申请号:US15938270
申请日:2018-03-28
Applicant: KLA-TENCOR CORPORATION
Inventor: Manh Nguyen , Phillip Atkins , Alexander Kuznetsov , Liequan Lee , Natalia Malkova , Paul Aoyagi , Mikhail Sushchik , Dawei Hu , Houssam Chouaib
Abstract: A parameterized geometric model of a structure can be determined based on spectra from a wafer metrology tool. The structure can have geometry-induced anisotropic effects. Dispersion parameters of the structure can be determined from the parameterized geometric model. This can enable metrology techniques to measure nanostructures that have geometries and relative positions with surrounding structures that induce non-negligible anisotropic effects. These techniques can be used to characterize process steps involving metal and semiconductor targets in semiconductor manufacturing of, for example, FinFETs or and gate-all-around field-effect transistors.
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公开(公告)号:US20190041266A1
公开(公告)日:2019-02-07
申请号:US15672120
申请日:2017-08-08
Applicant: KLA-Tencor Corporation
Inventor: Tianhan Wang , Aaron Rosenberg , Dawei Hu , Alexander Kuznetsov , Manh Dang Nguyen , Stilian Pandev , John Lesoine , Qiang Zhao , Liequan Lee , Houssam Chouaib , Ming Di , Torsten R. Kaack , Andrei V. Shchegrov , Zhengquan Tan
Abstract: A spectroscopic metrology system includes a spectroscopic metrology tool and a controller. The controller generates a model of a multilayer grating including two or more layers, the model including geometric parameters indicative of a geometry of a test layer of the multilayer grating and dispersion parameters indicative of a dispersion of the test layer. The controller further receives a spectroscopic signal of a fabricated multilayer grating corresponding to the modeled multilayer grating from the spectroscopic metrology tool. The controller further determines values of the one or more parameters of the modeled multilayer grating providing a simulated spectroscopic signal corresponding to the measured spectroscopic signal within a selected tolerance. The controller further predicts a bandgap of the test layer of the fabricated multilayer grating based on the determined values of the one or more parameters of the test layer of the fabricated structure.
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