-
11.发明申请公开(公告)号：US20050072972A1
公开(公告)日：2005-04-07
申请号：US10800630
申请日：2004-03-16
IPC分类号： G01R31/26 , H01L21/50 , H01L21/66 , H01L21/673 , H01L23/00 , H01L23/04 , H01L23/544 , H01L23/58
CPC分类号： H01L21/67333 , H01L21/50 , H01L22/20 , H01L23/04 , H01L23/544 , H01L25/0655 , H01L2223/54473 , H01L2924/0002 , H01L2924/014 , H01L2924/15311 , H01L2924/16153 , H01L2924/1616 , H01L2924/166 , Y10T29/49826 , H01L2924/00
摘要： A method for protecting a semiconductor device is disclosed that can improve reliability of a performance test for the semiconductor device and prevent damage to the semiconductor device during transportation or packaging for shipment. An IC cover is attached to the semiconductor device, which has height unevenness because it includes semiconductor chips and electric parts having different heights. The IC cover includes projecting portions and a base portion. After being attached to the semiconductor device, the projecting portions stand in a free area in the semiconductor device, and the base portion is supported by the projections to be separated from the semiconductor chips and electric parts in the semiconductor device. The IC cover is detachably attached to the semiconductor device.
摘要翻译： 公开了一种用于保护半导体器件的方法，其可以提高半导体器件的性能测试的可靠性，并防止在运输或包装期间对半导体器件的损坏。 由于包含半导体芯片和具有不同高度的电气部件，所以具有高度不均匀性的半导体器件附着IC盖。 IC盖包括突出部分和基部。 在安装到半导体器件之后，突出部分位于半导体器件中的自由区域中，并且基底部分由与半导体芯片和半导体器件中的电气部件分离的突起支撑。 IC盖可拆卸地附接到半导体器件。
-
公开(公告)号：US08268670B2
公开(公告)日：2012-09-18
申请号：US13240508
申请日：2011-09-22
IPC分类号： H01L21/44
CPC分类号： H01L21/67333 , H01L21/50 , H01L22/20 , H01L23/04 , H01L23/544 , H01L25/0655 , H01L2223/54473 , H01L2924/0002 , H01L2924/014 , H01L2924/15311 , H01L2924/16153 , H01L2924/1616 , H01L2924/166 , Y10T29/49826 , H01L2924/00
摘要： A method for protecting a semiconductor device is disclosed that can improve reliability of a performance test for the semiconductor device and prevent damage to the semiconductor device during transportation or packaging for shipment. An IC cover is attached to the semiconductor device, which has height unevenness because it includes semiconductor chips and electric parts having different heights. The IC cover includes projecting portions and a base portion. After being attached to the semiconductor device, the projecting portions stand in a free area in the semiconductor device, and the base portion is supported by the projections to be separated from the semiconductor chips and electric parts in the semiconductor device. The IC cover is detachably attached to the semiconductor device.
摘要翻译： 公开了一种用于保护半导体器件的方法，其可以提高半导体器件的性能测试的可靠性，并防止在运输或包装期间对半导体器件的损坏。 由于包含半导体芯片和具有不同高度的电气部件，所以具有高度不均匀性的半导体器件附着IC盖。 IC盖包括突出部分和基部。 在安装到半导体器件之后，突出部分位于半导体器件中的自由区域中，并且基底部分由与半导体芯片和半导体器件中的电气部件分离的突起支撑。 IC盖可拆卸地附接到半导体器件。
-
公开(公告)号：US08051554B2
公开(公告)日：2011-11-08
申请号：US12104038
申请日：2008-04-16
CPC分类号： B25B27/14 , H05K7/1061 , Y10T29/4913 , Y10T29/53174 , Y10T29/53178 , Y10T29/53183 , Y10T29/53187 , Y10T29/53191 , Y10T29/53943
摘要： An IC socket in which an electronic component is attached to a predetermined position of the IC socket, the IC socket including a fixed part including a contact pin which is connected to a terminal of the electronic component when a position of the electronic component is aligned to the predetermined position of the IC socket using an electronic component attaching tool, the contact pin including a pair of end portions on an upper surface of the fixed part; a movable part that is movable to the fixed part when the movable part is pushed down to apply a force to the contact pin of the fixed part so as to separate the pair of end portions of the contact pin from each other; and a standard part that is formed on the movable part and engages with the electronic component attaching tool to align a position of the electronic component attaching tool to the standard part when a position of the electronic component is aligned to the predetermined position of the IC socket using the electronic attaching tool, the standard part having a shape which does not substantially depend on an external shape of the electronic component.
摘要翻译： 一种IC插座，其中电子部件附接到IC插座的预定位置，IC插座包括固定部分，该固定部分包括接触销，当电子部件的位置与电子部件的位置对准时，该接触销连接到电子部件的端子 所述IC插座的预定位置使用电子部件安装工具，所述接触销包括在所述固定部的上表面上的一对端部; 可移动部分，当可移动部分被向下推动时，可移动到固定部分，以向固定部分的接触销施加力，以将接触销的一对端部彼此分离; 以及形成在可动部上并与电子部件安装工具接合的标准部分，当电子部件的位置与IC插座的预定位置对准时，将电子部件安装工具的位置对准标准部件 使用电子连接工具，标准部件具有基本上不依赖于电子部件的外部形状的形状。
-
14.发明申请Semiconductor substrate, manufacturing method of a semiconductor device and testing method of a semiconductor device 审中-公开半导体衬底，半导体器件的制造方法和半导体器件的测试方法公开(公告)号：US20080227226A1
公开(公告)日：2008-09-18
申请号：US12153481
申请日：2008-05-20
IPC分类号： H01L21/66 , H01L21/304
CPC分类号： H01L21/78 , H01L23/544 , H01L2223/54453 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor substrate eliminates a restriction caused by a width of scribe lines so as to increase a number of semiconductor elements formed on the semiconductor substrate. A plurality of semiconductor element areas are formed by forming a plurality of unit exposed and printed areas, each of which contains the semiconductor element areas. A first scribe line extends between the semiconductor element areas formed within the unit exposed and printed area. A second scribe line extends between the unit exposed and printed areas. A width of the first scribe line is different from a width of the second scribe line.
摘要翻译： 半导体衬底消除了由划线的宽度引起的限制，从而增加形成在半导体衬底上的半导体元件的数量。 多个半导体元件区域通过形成多个单位曝光和印刷区域而形成，每个单元暴露和印刷区域都包含半导体元件区域。 第一刻划线在形成在单元曝光和印刷区域内的半导体元件区域之间延伸。 第二划线在单元曝光和打印区域之间延伸。 第一划线的宽度与第二划线的宽度不同。
-
公开(公告)号：US07129726B2
公开(公告)日：2006-10-31
申请号：US11211094
申请日：2005-08-25
IPC分类号： G01R31/02
CPC分类号： G01R31/2887
摘要： A testing device can perform a test on an arbitrary one of a plurality of semiconductor devices by pressing the semiconductor devices onto a contactor from a back side of the semiconductor device. A test circuit board has a contactor provided with contact pieces corresponding to external connection terminals of semiconductor devices to be tested. A support board is capable of mounting the semiconductor devices thereon in an aligned state. A stage supports the support board. A press head presses the semiconductor devices to be tested mounted on the support board so as to cause external connection terminals of the semiconductor devices to be tested to contact with the contact pieces of the contactor. The stage is movable to a position at which at least one of the semiconductor devices to be tested, which are mounted on the support board, faces the contactor.
摘要翻译： 测试装置可以通过将半导体器件从半导体器件的背面按压到接触器上来对多个半导体器件中的任意一个进行测试。 测试电路板具有接触器，该接触器具有与待测试的半导体器件的外部连接端子相对应的接触片。 支撑板能够以对准状态将半导体器件安装在其上。 舞台支持支持板。 压头按压待安装在支撑板上的待测试的半导体器件，以便使半导体器件的外部连接端子被测试以与接触器的接触片接触。 舞台可移动到安装在支撑板上的要测试的半导体器件中的至少一个面向接触器的位置。
-
公开(公告)号：US06927343B2
公开(公告)日：2005-08-09
申请号：US10266866
申请日：2002-10-09
申请人： Naoyuki Watanabe , Shigeyuki Maruyama , Kazuhiro Tashiro , Daisuke Koizumi , Takafumi Hashitani
发明人： Naoyuki Watanabe , Shigeyuki Maruyama , Kazuhiro Tashiro , Daisuke Koizumi , Takafumi Hashitani
CPC分类号： G01R1/07314 , G01R1/06716 , H01R12/52 , H01R12/714 , H01R13/24
摘要： A contactor has a film substrate of an insulating material and plural wiring patterns on the substrate. A first end of each wiring pattern extends out from a first edge of the substrate as a first contact terminal and a second end of each wiring pattern extends out from a second edge of the substrate as a second contact terminal, and a part of the contactor located between the first end and second end can be deformed resiliently.
摘要翻译： 接触器具有绝缘材料的薄膜基板和基板上的多个布线图案。 每个布线图案的第一端作为第一接触端子从基板的第一边缘延伸出来，并且每个布线图案的第二端作为第二接触端子从基板的第二边缘延伸出来，并且接触器的一部分 位于第一端部和第二端部之间的弹性体可以弹性变形。
-
公开(公告)号：US06882169B2
公开(公告)日：2005-04-19
申请号：US10685542
申请日：2003-10-16
IPC分类号： G01R31/302 , G01R31/308 , H05K3/32 , G01R31/02 , H01R9/00
CPC分类号： G01R31/308 , G01R31/302 , H01L2924/0002 , H05K3/326 , H01L2924/00
摘要： A semiconductor testing device is used for testing a semiconductor device which has at least one spherical connection terminal. The testing device includes an insulating substrate having an opening formed there in at a position corresponding to the position of the spherical connection terminal, and a contact member, formed on the insulating substrate, including a connection portion which is connected with the spherical connection terminal, at least the connection portion being deformable and extending into the opening.
摘要翻译： 半导体测试装置用于测试具有至少一个球形连接端子的半导体器件。 该测试装置包括：绝缘基板，其在与球形连接端子的位置相对应的位置处形成有开口;以及接触部件，形成在绝缘基板上，包括与球形连接端子连接的连接部， 至少所述连接部分可变形并延伸到所述开口中。
-
18.发明授权Tray in combination with electronic component attaching tool attached to the tray 失效托盘与附在托盘上的电子元件连接工具组合公开(公告)号：US08671557B2
公开(公告)日：2014-03-18
申请号：US13242647
申请日：2011-09-23
IPC分类号： B23P19/00
CPC分类号： B25B27/14 , H05K7/1061 , Y10T29/4913 , Y10T29/53174 , Y10T29/53178 , Y10T29/53183 , Y10T29/53187 , Y10T29/53191 , Y10T29/53943
摘要： A tray is provided in combination with an electronic component attaching tool attached to the tray and includes an attachment depression part that includes an inner wall and to which an electronic component is attached, wherein forming of the inner wall of the attachment depression part does not substantially depend on an external shape of the electronic component, and a standard part formed in the inner wall of the attachment depression part and engaging with a first structure part of the electronic component attaching tool to align a position of the electronic component attaching tool to the standard part when a position of the electronic component is aligned to a first position of the tray using the electronic component attaching tool, the standard part having a shape which does not substantially depend on the external shape of the electronic component.
摘要翻译： 托盘与附接到托盘上的电子部件连接工具组合地提供，并且包括附接凹陷部分，该附件凹陷部分包括内壁并且附接有电子部件，其中，附接凹陷部分的内壁的形成基本上不 取决于电子部件的外部形状，以及形成在安装凹部的内壁中的标准部分，并与电子部件安装工具的第一结构部分接合，以将电子部件安装工具的位置对准到标准 当使用电子部件安装工具将电子部件的位置与托盘的第一位置对准时，标准部件具有基本上不依赖于电子部件的外形的形状。
-
公开(公告)号：US07161370B2
公开(公告)日：2007-01-09
申请号：US11046883
申请日：2005-02-01
IPC分类号： G01R31/26
CPC分类号： G01R31/308 , G01R31/302 , H01L2924/0002 , H05K3/326 , H01L2924/00
摘要： A semiconductor testing device is used for testing a semiconductor device which has at least one spherical connection terminal. The testing device includes an insulating substrate having an opening formed therein at a position corresponding to the position of the spherical connection terminal, and a contact member, formed on the insulating substrate, including a connection portion which is connected with the spherical connection terminal, at least the connection portion being deformable and extending into the opening.
摘要翻译： 半导体测试装置用于测试具有至少一个球形连接端子的半导体器件。 该测试装置包括：绝缘基板，其在与球形连接端子的位置对应的位置处形成有开口;以及接触部件，形成在绝缘基板上，包括与球形连接端子连接的连接部， 所述连接部分至少可变形并延伸到所述开口中。
-
20.发明申请Semiconductor substrate, manufacturing method of a semiconductor device and testing method of a semiconductor device 审中-公开半导体衬底，半导体器件的制造方法和半导体器件的测试方法公开(公告)号：US20060097356A1
公开(公告)日：2006-05-11
申请号：US11062488
申请日：2005-02-23
IPC分类号： H01L23/544
CPC分类号： H01L21/78 , H01L23/544 , H01L2223/54453 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor substrate eliminates a restriction caused by a width of scribe lines so as to increase a number of semiconductor elements formed on the semiconductor substrate. A plurality of semiconductor element areas are formed by forming a plurality of unit exposed and printed areas, each of which contains the semiconductor element areas. A first scribe line extends between the semiconductor element areas formed within the unit exposed and printed area. A second scribe line extends between the unit exposed and printed areas. A width of the first scribe line is different from a width of the second scribe line.
摘要翻译： 半导体衬底消除了由划线的宽度引起的限制，从而增加形成在半导体衬底上的半导体元件的数量。 多个半导体元件区域通过形成多个单位曝光和印刷区域而形成，每个单元暴露和印刷区域都包含半导体元件区域。 第一刻划线在形成在单元曝光和印刷区域内的半导体元件区域之间延伸。 第二划线在单元曝光和打印区域之间延伸。 第一划线的宽度与第二划线的宽度不同。
-
-
-
-
-
-
-
-
-
搜索结果
91 条记录 (耗时 0.035 秒)