公开(公告)号：US06882169B2

公开(公告)日：2005-04-19

申请号：US10685542

申请日：2003-10-16

申请人： Shigeyuki Maruyama ,  Kazuhiro Tashiro ,  Makoto Haseyama

发明人： Shigeyuki Maruyama ,  Kazuhiro Tashiro ,  Makoto Haseyama

IPC分类号： G01R31/302 ,  G01R31/308 ,  H05K3/32 ,  G01R31/02 ,  H01R9/00

CPC分类号： G01R31/308 ,  G01R31/302 ,  H01L2924/0002 ,  H05K3/326 ,  H01L2924/00

摘要： A semiconductor testing device is used for testing a semiconductor device which has at least one spherical connection terminal. The testing device includes an insulating substrate having an opening formed there in at a position corresponding to the position of the spherical connection terminal, and a contact member, formed on the insulating substrate, including a connection portion which is connected with the spherical connection terminal, at least the connection portion being deformable and extending into the opening.

摘要翻译： 半导体测试装置用于测试具有至少一个球形连接端子的半导体器件。 该测试装置包括：绝缘基板，其在与球形连接端子的位置相对应的位置处形成有开口;以及接触部件，形成在绝缘基板上，包括与球形连接端子连接的连接部， 至少所述连接部分可变形并延伸到所述开口中。

公开(公告)号：US07112889B1

公开(公告)日：2006-09-26

申请号：US09577932

申请日：2000-05-25

申请人： Shigeyuki Maruyama ,  Yasuyuki Itoh ,  Tetsurou Honda ,  Kazuhiro Tashiro ,  Makoto Haseyama ,  Kenichi Nagashige ,  Yoshiyuki Yoneda ,  Hirohisa Matsuki

发明人： Shigeyuki Maruyama ,  Yasuyuki Itoh ,  Tetsurou Honda ,  Kazuhiro Tashiro ,  Makoto Haseyama ,  Kenichi Nagashige ,  Yoshiyuki Yoneda ,  Hirohisa Matsuki

IPC分类号： H01L23/544

CPC分类号： H01L22/12 ,  G01R31/2891 ,  H01L21/67282 ,  H01L21/6838 ,  H01L22/32 ,  H01L23/544 ,  H01L24/97 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2223/54453 ,  H01L2223/5448 ,  H01L2223/54493 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05647 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  Y10T29/49998 ,  Y10T279/11 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A semiconductor device has an alignment mark which can be recognized by a conventional wafer prober. A redistribution layer connects electrodes of the semiconductor device to electrode pads located in predetermined positions of the redistribution layer. Metal posts configured to be provided with external connection electrodes are formed on the electrode pads of the redistribution layer. A mark member made of the same material as the metal posts is formed on the redistribution layer. The mark member serves as an alignment mark located in a predetermined positional relationship with the metal posts.

公开(公告)号：US20050162180A1

公开(公告)日：2005-07-28

申请号：US11046883

申请日：2005-02-01

申请人： Shigeyuki Maruyama ,  Kazuhiro Tashiro ,  Makoto Haseyama ,  Futoshi Fukaya

发明人： Shigeyuki Maruyama ,  Kazuhiro Tashiro ,  Makoto Haseyama ,  Futoshi Fukaya

IPC分类号： G01R31/302 ,  G01R31/308 ,  H05K3/32 ,  G01R31/02

CPC分类号： G01R31/308 ,  G01R31/302 ,  H01L2924/0002 ,  H05K3/326 ,  H01L2924/00

摘要： A semiconductor testing device is used for testing a semiconductor device which has at least one spherical connection terminal. The testing device includes an insulating substrate having an opening formed therein at a position corresponding to the position of the spherical connection terminal, and a contact member, formed on the insulating substrate, including a connection portion which is connected with the spherical connection terminal, at least the connection portion being deformable and extending into the opening.

摘要翻译： 半导体测试装置用于测试具有至少一个球形连接端子的半导体器件。 该测试装置包括：绝缘基板，其在与球形连接端子的位置对应的位置处形成有开口;以及接触部件，形成在绝缘基板上，包括与球形连接端子连接的连接部， 所述连接部分至少可变形并延伸到所述开口中。

公开(公告)号：US06661247B2

公开(公告)日：2003-12-09

申请号：US09828221

申请日：2001-04-09

申请人： Shigeyuki Maruyama ,  Kazuhiro Tashiro ,  Makoto Haseyama ,  Futoshi Fukaya

发明人： Shigeyuki Maruyama ,  Kazuhiro Tashiro ,  Makoto Haseyama ,  Futoshi Fukaya

IPC分类号： G01R3126

CPC分类号： G01R31/308 ,  G01R31/302 ,  H01L2924/0002 ,  H05K3/326 ,  H01L2924/00

摘要： A semiconductor testing device is used for testing a semiconductor device which has at least one spherical connection terminal. The testing device includes an insulating substrate having an opening formed therein at a position corresponding to the position of the spherical connection terminal, and a contact member, formed on the insulating substrate, including a connection portion which is connected with the spherical connection terminal, at least the connection portion being deformable and extending into the opening.

摘要翻译： 半导体测试装置用于测试具有至少一个球形连接端子的半导体器件。 该测试装置包括：绝缘基板，其在与球形连接端子的位置对应的位置处形成有开口;以及接触部件，形成在绝缘基板上，包括与球形连接端子连接的连接部， 所述连接部分至少可变形并延伸到所述开口中。

公开(公告)号：US07161370B2

公开(公告)日：2007-01-09

申请号：US11046883

申请日：2005-02-01

申请人： Shigeyuki Maruyama ,  Kazuhiro Tashiro ,  Makoto Haseyama

发明人： Shigeyuki Maruyama ,  Kazuhiro Tashiro ,  Makoto Haseyama

IPC分类号： G01R31/26

CPC分类号： G01R31/308 ,  G01R31/302 ,  H01L2924/0002 ,  H05K3/326 ,  H01L2924/00

摘要： A semiconductor testing device is used for testing a semiconductor device which has at least one spherical connection terminal. The testing device includes an insulating substrate having an opening formed therein at a position corresponding to the position of the spherical connection terminal, and a contact member, formed on the insulating substrate, including a connection portion which is connected with the spherical connection terminal, at least the connection portion being deformable and extending into the opening.

摘要翻译： 半导体测试装置用于测试具有至少一个球形连接端子的半导体器件。 该测试装置包括：绝缘基板，其在与球形连接端子的位置对应的位置处形成有开口;以及接触部件，形成在绝缘基板上，包括与球形连接端子连接的连接部， 所述连接部分至少可变形并延伸到所述开口中。

公开(公告)号：US20060279003A1

公开(公告)日：2006-12-14

申请号：US11439119

申请日：2006-05-24

申请人： Shigeyuki Maruyama ,  Yasuyuki Itoh ,  Tetsurou Honda ,  Kazuhiro Tashiro ,  Makoto Haseyama ,  Kenichi Nagashige ,  Yoshiyuki Yoneda ,  Hirohisa Matsuki

发明人： Shigeyuki Maruyama ,  Yasuyuki Itoh ,  Tetsurou Honda ,  Kazuhiro Tashiro ,  Makoto Haseyama ,  Kenichi Nagashige ,  Yoshiyuki Yoneda ,  Hirohisa Matsuki

IPC分类号： H01L23/544

CPC分类号： H01L22/12 ,  G01R31/2891 ,  H01L21/67282 ,  H01L21/6838 ,  H01L22/32 ,  H01L23/544 ,  H01L24/97 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2223/54453 ,  H01L2223/5448 ,  H01L2223/54493 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05647 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  Y10T29/49998 ,  Y10T279/11 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A semiconductor device has an alignment mark which can be recognized by a conventional wafer prober. A redistribution layer connects electrodes of the semiconductor device to electrode pads located in predetermined positions of the redistribution layer. Metal posts configured to be provided with external connection electrodes are formed on the electrode pads of the redistribution layer. A mark member made of the same material as the metal posts is formed on the redistribution layer. The mark member serves as an alignment mark located in a predetermined positional relationship with the metal posts.

摘要翻译： 半导体器件具有可以被常规晶片探测器识别的对准标记。 再分布层将半导体器件的电极连接到位于再分布层的预定位置的电极焊盘。 在再分配层的电极焊盘上形成配置有外部连接电极的金属柱。 在再分布层上形成由与金属柱相同的材料制成的标记构件。 标记构件用作与金属柱形成预定位置关系的对准标记。

公开(公告)号：US06249135B1

公开(公告)日：2001-06-19

申请号：US09268338

申请日：1999-03-16

申请人： Shigeyuki Maruyama ,  Kazuhiro Tashiro ,  Makoto Haseyama ,  Futoshi Fukaya

发明人： Shigeyuki Maruyama ,  Kazuhiro Tashiro ,  Makoto Haseyama ,  Futoshi Fukaya

IPC分类号： G01R3126

CPC分类号： G01R31/308 ,  G01R31/302 ,  H01L2924/0002 ,  H05K3/326 ,  H01L2924/00

摘要： A semiconductor testing device is used for testing a semiconductor device which has at least one spherical connection terminal. The testing device includes an insulating substrate having an opening formed therein at a position corresponding to the position of the spherical connection terminal, and a contact member, formed on the insulating substrate, including a connection portion which is connected with the spherical connection terminal, at least the connection portion being deformable and extending into the opening.

摘要翻译： 半导体测试装置用于测试具有至少一个球形连接端子的半导体器件。 该测试装置包括：绝缘基板，其在与球形连接端子的位置对应的位置处形成有开口;以及接触部件，形成在绝缘基板上，包括与球形连接端子连接的连接部， 所述连接部分至少可变形并延伸到所述开口中。

公开(公告)号：US08404496B2

公开(公告)日：2013-03-26

申请号：US11439119

申请日：2006-05-24

申请人： Shigeyuki Maruyama ,  Yasuyuki Itoh ,  Tetsurou Honda ,  Kazuhiro Tashiro ,  Makoto Haseyama ,  Kenichi Nagashige ,  Yoshiyuki Yoneda ,  Hirohisa Matsuki

发明人： Shigeyuki Maruyama ,  Yasuyuki Itoh ,  Tetsurou Honda ,  Kazuhiro Tashiro ,  Makoto Haseyama ,  Kenichi Nagashige ,  Yoshiyuki Yoneda ,  Hirohisa Matsuki

IPC分类号： G01R31/26

CPC分类号： H01L22/12 ,  G01R31/2891 ,  H01L21/67282 ,  H01L21/6838 ,  H01L22/32 ,  H01L23/544 ,  H01L24/97 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2223/54453 ,  H01L2223/5448 ,  H01L2223/54493 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05647 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  Y10T29/49998 ,  Y10T279/11 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A semiconductor device has an alignment mark which can be recognized by a conventional wafer prober. A redistribution layer connects electrodes of the semiconductor device to electrode pads located in predetermined positions of the redistribution layer. Metal posts configured to be provided with external connection electrodes are formed on the electrode pads of the redistribution layer. A mark member made of the same material as the metal posts is formed on the redistribution layer. The mark member serves as an alignment mark located in a predetermined positional relationship with the metal posts.

摘要翻译： 半导体器件具有可以被常规晶片探测器识别的对准标记。 再分布层将半导体器件的电极连接到位于再分布层的预定位置的电极焊盘。 在再分配层的电极焊盘上形成配置有外部连接电极的金属柱。 在再分布层上形成由与金属柱相同的材料制成的标记构件。 标记构件用作与金属柱形成预定位置关系的对准标记。

公开(公告)号：US07028398B2

公开(公告)日：2006-04-18

申请号：US10629800

申请日：2003-07-30

申请人： Makoto Haseyama ,  Shigeyuki Maruyama

发明人： Makoto Haseyama ,  Shigeyuki Maruyama

IPC分类号： H01R9/00

CPC分类号： G01R1/06761 ,  G01R1/0735 ,  G01R3/00 ,  H05K3/244 ,  H05K3/4007 ,  H05K3/423 ,  H05K2201/0367 ,  H05K2201/0382 ,  H05K2201/0394 ,  H05K2201/09481 ,  H05K2201/09563 ,  Y10T29/49147 ,  Y10T29/49151

摘要： A contactor is used for testing an integrated circuit electronic component provided with a plurality of electrodes. The contactor includes an insulating base material provided with holes formed at positions corresponding to the electrodes, a first conductive layer having contacts which are plastically deformed portions of the first conductive layer, and reinforcement members provided on the contacts on a first surface of the contacts. The first surface of the contacts is facing towards the holes. The contacts are provided at positions corresponding to the electrodes for enabling an electrical connection to the electronic component and are protruded from the insulating base material.

公开(公告)号：US06630839B1

公开(公告)日：2003-10-07

申请号：US09531686

申请日：2000-03-20

申请人： Makoto Haseyama ,  Shigeyuki Maruyama

发明人： Makoto Haseyama ,  Shigeyuki Maruyama

IPC分类号： G01R3126

CPC分类号： G01R1/06761 ,  G01R1/0735 ,  G01R3/00 ,  H05K3/244 ,  H05K3/4007 ,  H05K3/423 ,  H05K2201/0367 ,  H05K2201/0382 ,  H05K2201/0394 ,  H05K2201/09481 ,  H05K2201/09563 ,  Y10T29/49147 ,  Y10T29/49151

摘要： A contactor is used for testing an integrated circuit electronic component provided with a plurality of electrodes. The contactor includes an insulating base material provided with holes formed at positions corresponding to the electrodes, a first conductive layer having contacts which are plastically deformed portions of the first conductive layer, and reinforcement members provided on the contacts on a first surface of the contacts. The first surface of the contacts is facing towards the holes. The contacts are provided at positions corresponding to the electrodes for enabling an electrical connection to the electronic component and are protruded from the insulating base material.

摘要翻译： 接触器用于测试设置有多个电极的集成电路电子部件。 接触器包括：绝缘基材，在与电极对应的位置形成有孔，第一导电层具有第一导电层的塑性变形部分的触点，以及设置在触点的第一表面上的触点上的加强部件。 触点的第一表面朝向孔。 触点设置在与电极对应的位置处，用于能够与电子部件电连接并从绝缘基材突出。