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71 条记录 (耗时 0.031 秒)

    Coil component
    13.
    发明授权
    Coil component 有权
    线圈组件

    公开(公告)号：US08643455B2

    公开(公告)日：2014-02-04

    申请号：US13295774

    申请日：2011-11-14

    申请人： Hideki Ogawa ,  Toshiyuki Yagasaki ,  Hiroya Shigemoto ,  Tsuyoshi Matsumoto ,  Hiroyuki Higuchi ,  Kiyoshi Tanaka

    发明人： Hideki Ogawa ,  Toshiyuki Yagasaki ,  Hiroya Shigemoto ,  Tsuyoshi Matsumoto ,  Hiroyuki Higuchi ,  Kiyoshi Tanaka

    IPC分类号： H01F27/02 ,  H01F38/12 ,  H01F27/29 ,  H01F27/30 ,  H01F17/04 ,  H01F27/24

    CPC分类号： H01F27/027 ,  H01F27/266 ,  H01F27/292

    摘要： As an embodiment, a pair of first conductive films 12, 13 are formed from the side face to the bottom face of the sheet part 11a of a magnetic core 11, and one end 14b of the conductive wire of the coil 14 and the other end 14c of the conductive wire are joined to the side faces 12a, 13a of the first conductive films 12, 13, respectively. Also, as an embodiment, the joined parts 14b1, 14c1 are sandwiched by the side faces 12a, 13a of the first conductive films 12, 13 and the part 15a of the magnetic sheath 15 covering the side face of the sheet part 11a of the magnetic core 11, wherein the parts of the magnetic sheath 15 covering the joined parts 14b1, 14c1 are sandwiched by the side faces 12a, 13a of the first conductive films 12, 13 and the side faces 16a, 17a of second conductive films 16, 17 as well as the side faces 18a, 19a of third conductive films 18, 19.

    摘要翻译： 作为实施例，从磁芯11的片部11a的侧面到底面形成一对第一导电膜12,13，线圈14的导线的一端14b，另一端 14c分别与第一导电膜12,13的侧面12a，13a接合。 此外，作为实施例，接合部分14b1,14c1被第一导电膜12,13的侧面12a，13a和磁性护套15的覆盖磁体的片状部分11a的侧面的部分15a夹着 芯11，其中覆盖接合部分14b1,14c1的磁性护套15的部分被第一导电膜12,13的侧面12a，13a和第二导电膜16,17的侧面16a，17a夹在中间 以及第三导电膜18,19的侧面18a，19a。

    Radio communication receiving device detecting a frequency modulation preamble signal
    16.
    发明授权
    Radio communication receiving device detecting a frequency modulation preamble signal 失效
    无线通信接收装置检测频率调制前导码信号

    公开(公告)号：US5452472A

    公开(公告)日：1995-09-19

    申请号：US86857

    申请日：1993-07-07

    申请人： Kiyoshi Tanaka

    发明人： Kiyoshi Tanaka

    IPC分类号： H04B1/16 ,  H04L25/06 ,  H04L27/14 ,  H04W88/02

    CPC分类号： H04W88/026 ,  H04B1/16 ,  H04L25/061

    摘要： A radio communication receiving device performs prescribed operations upon detecting a frequency modulation preamble signal consisting of a series of alternating logical values. The device includes a low-pass filter that is connected to an output of a receiver that detects the frequency modulation signal and outputs an analog base band signal, and which has a numerical cutoff frequency value that does not exceed half the bit rate of the preamble, a comparison circuit that is connected to the output of the low-pass filter and compares an output voltage of the low-pass filter with prescribed threshold values, and a determining circuit that determines a preamble has been detected when the comparison by the comparison circuit indicates that an absolute value the low-pass filter output voltage does not exceed a prescribed threshold value for a prescribed time period.

    摘要翻译： 无线电通信接收装置在检测由一系列交替逻辑值组成的频率调制前导信号时执行规定的操作。 该装置包括低通滤波器，该低通滤波器连接到接收机的输出，该接收机的输出检测频率调制信号并输出​​模拟基带信号，并且具有数字截止频率值不超过前导码比特率的一半 ，与低通滤波器的输出端连接的比较电路，将低通滤波器的输出电压与规定的阈值进行比较，当比较电路进行比较时，检测出确定前置码的判定电路 表示规定时间段内低通滤波器输出电压的绝对值不超过规定的阈值。

    Three-dimensional optical-electronic integrated circuit device with raised sections
    17.
    发明授权
    Three-dimensional optical-electronic integrated circuit device with raised sections 失效
    具有凸起部分的三维光电集成电路器件

    公开(公告)号：US5357122A

    公开(公告)日：1994-10-18

    申请号：US939694

    申请日：1992-09-02

    申请人： Akihiko Okubora ,  Chiaki Takano ,  Kiyoshi Tanaka ,  Hideto Ishikawa

    发明人： Akihiko Okubora ,  Chiaki Takano ,  Kiyoshi Tanaka ,  Hideto Ishikawa

    IPC分类号： G02B6/42 ,  G02B6/43 ,  H01L23/48 ,  H01L25/065 ,  H01L27/144 ,  H01L27/15 ,  H01L27/14

    CPC分类号： G02B6/43 ,  H01L23/48 ,  H01L25/0657 ,  H01L27/1443 ,  H01L27/15 ,  G02B6/4214 ,  H01L2225/06534 ,  H01L2225/06565 ,  H01L2924/0002

    摘要： An optical-electronic integrated circuit device capable of three-dimensionally transmitting optical signals between plural semiconductor substrates on each of which an integrated circuit is previously formed. At least one of the light emitting elements and the light receiving elements are formed on the semiconductor substrate which transmits the light propagated between these elements. In this manner, signals may be transmitted in a direction perpendicular to the semiconductor substrate even without specifically processing the semiconductor substrate. Additionally, signal distortion, transmission losses, mutual intervention or delay are not incurred. For two-dimensionally connecting plural three-dimensionally integrated optical-electronic integrated circuit devices in a direction parallel to the semiconductor substrates, the circuit devices are arrayed on an optical interconnection base plate, and light signals are transmitted by means of a pair of inclined surfaces which are formed on the optical interconnection base plate and which are arranged facing the light emitting element and the light receiving element, and the light waveguide channels defined between these inclined surfaces. This drastically increases the operating speed of the circuit device and the integration degree.

    摘要翻译： 一种能够在预先形成有集成电路的多个半导体基板之间三维地发送光信号的光电集成电路装置。 发光元件和光接收元件中的至少一个形成在半导体衬底上，透射在这些元件之间传播的光。 以这种方式，即使没有具体地处理半导体衬底，也可以在垂直于半导体衬底的方向上传输信号。 此外，不会发生信号失真，传输损耗，相互干预或延迟。 为了在与半导体基板平行的方向上二维地连接多个三维集成的光电集成电路器件，电路器件被排列在光互连基板上，并且光信号通过一对倾斜表面 它们形成在光学互连基板上并且被布置成面向发光元件和光接收元件以及限定在这些倾斜表面之间的光波导通道。 这大大提高了电路设备的工作速度和集成度。

    Fireproof frame structure in a building opening portion
    18.
    发明授权
    Fireproof frame structure in a building opening portion 失效
    建筑物开口部分的防火框架结构

    公开(公告)号：US4993203A

    公开(公告)日：1991-02-19

    申请号：US428762

    申请日：1989-10-30

    申请人： Kiyoshi Tanaka ,  Kazushige Hori

    发明人： Kiyoshi Tanaka ,  Kazushige Hori

    IPC分类号： E06B5/16

    CPC分类号： E06B5/164

    摘要： A structure of a fireproof frame for building opening portions wherein a groove is formed over the entire circumference of a wood frame, which is disposed to a building opening portion, at the surface abutted against an opening member. A non-combustible heat forming sealing material is filled in the groove and the surface of the sealing material is covered with a thin film, which is excellent in heat conductivity, by means of the self bondability of said sealing material.

    摘要翻译： 一种用于建筑开口部分的防火框架的结构，其中在邻近打开构件的表面处设置在建筑物开口部分上的木框架的整个圆周上形成有凹槽。 通过所述密封材料的自粘合性，将不可燃的热成型密封材料填充到所述凹槽中，并且用导热性优异的薄膜覆盖所述密封材料的表面。