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公开(公告)号:US6129203A
公开(公告)日:2000-10-10
申请号:US29391
申请日:1998-02-27
申请人: Hiroyuki Kiyomura , Shinji Kanayama , Nobuya Matsumura , Kenichi Nishino , Kenji Takahashi , Naomi Kainou
发明人: Hiroyuki Kiyomura , Shinji Kanayama , Nobuya Matsumura , Kenichi Nishino , Kenji Takahashi , Naomi Kainou
CPC分类号: H05K13/0486
摘要: In a flip-chip mounting equipment, there is provided an IC removal device by which ICs (4) which have been recognized to be removed in error in spite of their faultlessness can be removed in a manner such that they are lined up in a row without being scratched on the surface and without incurring electrostatic destruction. Also the device allows an easy visual checking of the ICs with the objective of reuse. The device comprises a glass plate (2) for carrying ICs (4) and a mechanism for rotating this glass plate (2) at fixed angles, whereby if a recognition error occurs, a bonding head (1) with an IC (4) sucked thereby is moved to an IC removal position on the glass plate (2) and is then lowered until the IC (4) contacts the glass plate (2), thereby removing the IC (4). As a result, the ICs (4) can be lined up in a row without being scratched on the surface and without incurring electrostatic destruction, allowing an easy visual checking of the ICs with the objective of reuse.
摘要翻译: PCT No.PCT / JP97 / 02296 Sec。 371日期1998年2月27日 102(e)1998年2月27日PCT 1997年7月2日PCT公布。 公开号WO98 / 01901 日期1998年1月15日在一种倒装芯片安装设备中,提供了一种IC去除装置,通过该IC去除装置,尽管它们的无缺陷已被识别出被错误地去除的IC(4)可以以这样的方式被去除 连续排列而不会在表面上划伤而不会导致静电破坏。 此外,该器件允许容易地目视检查IC的目的是重新使用。 该装置包括用于承载IC(4)的玻璃板(2)和用于以固定角度旋转该玻璃板(2)的机构,由此如果发生识别错误,则吸入IC(4)的接合头(1) 从而移动到玻璃板(2)上的IC去除位置,然后降低直到IC(4)接触玻璃板(2),从而去除IC(4)。 结果,IC(4)可以排成一行而不会在表面上划伤而不会引起静电破坏,从而允许容易地目视检查IC以便重新使用。
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公开(公告)号:US06647616B1
公开(公告)日:2003-11-18
申请号:US09446031
申请日:1999-12-15
IPC分类号: B23P2100
CPC分类号: H01L21/67144 , H01L21/67763 , H01L21/67769 , H05K13/021 , Y10T29/53174 , Y10T29/53313 , Y10T29/53317
摘要: A bump bonding unit is disclosed including a novel storage, transport, and feed system for allocating trays that hold IC chips to various operations of the bump bonding unit. The bump bonding unit includes fist and second tray storage and feed apparatuses that transport trays from empty stacks to full stacks and vice versa, and a transfer head for picking up an IC chip without a bump formed thereon and moving the IC chip to a bump formation location, and for picking up the IC chip with the bump formed thereon and moving the IC chip to a storage location. The bump bonding unit also includes a bump forming unit for forming the bump on the IC chip. Each tray storage apparatus includes a carrier that moves vertically to position a stack of trays, a tray receiver that cooperates with the carrier to support a lowermost tray in the respective stack of trays, and tray holder to support and release a tray supported by the tray receiver.
摘要翻译: 公开了一种凸块焊接单元,其包括用于分配托盘的新颖的存储,输送和馈送系统,其将IC芯片保持在凸块接合单元的各种操作。 凸块接合单元包括将托盘从空堆栈传送到全堆叠的第一和第二托盘存储和进给装置,反之亦然,以及用于拾取IC芯片而没有形成凸块的转移头,并将IC芯片移动到凸块形成 位置,并且用于拾取IC芯片,其上形成有凸块并将IC芯片移动到存储位置。 凸块接合单元还包括用于在IC芯片上形成凸块的凸块形成单元。 每个托盘存储装置包括一个托架,该托架垂直移动以定位托盘堆叠;托盘托架,其与托架配合以支撑相应堆叠的托盘中的最下托盘;以及托盘托架,用于支撑和释放由托盘支撑的托盘 接收器。
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公开(公告)号:US06467158B1
公开(公告)日:2002-10-22
申请号:US09122901
申请日:1998-07-27
IPC分类号: H05K330
CPC分类号: H05K13/0452 , H05K13/0409 , H05K13/041 , Y10S29/044 , Y10T29/4913 , Y10T29/49131 , Y10T29/49133 , Y10T29/53087 , Y10T29/53174 , Y10T29/53178 , Y10T29/53191
摘要: A component feeder including a rotary mechanism 31 which is mounted on a turning mechanism 17 for turning the suction nozzle 3 and causes the suction nozzle 3 to rotate around its axis line A, a detector 7 for detecting an amount of displacement the component 2 in rotating direction around the axis line A of the suction nozzle 3, and a controller 32 which controls the suction nozzle 3 such as to rotate at a necessary angle around its axis line A before picking up the component 2 in accordance with displacement of the component 2 in rotating direction around the axis line A.
摘要翻译: 一种部件供给器,包括旋转机构31,该旋转机构31安装在转动机构17上,用于转动吸嘴3并使吸嘴3围绕其轴线A旋转;检测器7,用于检测旋转中的部件2的位移量 方向围绕吸嘴3的轴线A,以及控制器32,其控制吸嘴3,以便在根据部件2的位移拾取部件2之前围绕其轴线A旋转必要的角度 旋转方向围绕轴线A.
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公开(公告)号:US06830989B1
公开(公告)日:2004-12-14
申请号:US10069401
申请日:2002-02-26
申请人: Satoshi Shida , Shinji Kanayama , Takashi Shimizu , Kenji Takahashi , Ryoji Inutsuka , Hiroyuki Yoshida
发明人: Satoshi Shida , Shinji Kanayama , Takashi Shimizu , Kenji Takahashi , Ryoji Inutsuka , Hiroyuki Yoshida
IPC分类号: H01L21301
CPC分类号: H01L21/67271 , H01L21/67144
摘要: Handling of each arrayed component is implemented in pickup operation within a movement range of a supporting body against the size of a supporting region of the arrayed component smaller than that in the prior art. Each component supported on a supporting body in array is moved to a pickup position with a movement of the supporting body in X and Y two component array directions, and is fed to pickup operation by a tool with push-up operation by a push-up pin involved, in which after each unit region (D1 to D4) dividedly set around the pickup position of the supporting body is positioned at a pickup standby position by rotation of the supporting body in a switching manner, the component in the positioned unit region is moved in each component array direction of the supporting body and fed to pickup operation in sequence.
摘要翻译: 在支撑体的移动范围内,在阵列部件的支撑区域的尺寸小于现有技术的尺寸的情况下,每个排列的部件的处理被实现在支撑体的运动范围内的拾取操作。 支撑在阵列中的支撑体上的每个部件通过支撑体在X和Y两个分量阵列方向上的移动而被移动到拾取位置,并且通过具有由上推的上推操作的工具进给到拾取操作 引脚,其中通过以切换方式旋转支撑体而将支撑体的拾取位置分开设置的每个单位区域(D1至D4)定位在拾取备用位置,定位单元区域中的部件为 在支撑体的每个分量阵列方向上移动并依次馈送到拾取操作。
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公开(公告)号:US5894657A
公开(公告)日:1999-04-20
申请号:US569937
申请日:1995-12-08
CPC分类号: H05K13/0408 , H05K13/0069 , H05K13/02 , Y10T29/53091 , Y10T29/53178 , Y10T29/53183 , Y10T29/53191
摘要: An electronic component mounting apparatus includes a feeding device for feeding a to-be-placed element including an electronic component, an anisotropic conductive film, or a paste, a holding device for holding the fed element, an element moving device for supporting and moving the holding device in a first direction and placing the element held by the holding device on a circuit board, and a board moving device for holding and moving the circuit board in a second direction generally at right angles to the first direction where the element moving device is moved.
摘要翻译: 一种电子部件安装装置,包括:馈送装置,用于馈送包括电子部件,各向异性导电膜或糊状物的待放置元件,用于保持馈送元件的保持装置;用于支撑和移动的元件移动装置 保持装置在第一方向上并且将由保持装置保持的元件放置在电路板上,以及板移动装置,用于沿着与元件移动装置的第一方向成直角的第二方向保持和移动电路板 移动了
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公开(公告)号:US5783915A
公开(公告)日:1998-07-21
申请号:US589005
申请日:1996-01-19
申请人: Satoshi Shida , Akira Kabeshita , Shinji Kanayama , Kenji Takahashi , Makoto Imanishi , Osamu Nakao
发明人: Satoshi Shida , Akira Kabeshita , Shinji Kanayama , Kenji Takahashi , Makoto Imanishi , Osamu Nakao
IPC分类号: H02K7/14 , H02K41/035 , H02P25/02 , H02K41/00 , H02K41/02
CPC分类号: H02K41/0356 , H02P25/034 , H02K7/14
摘要: A linear actuating apparatus includes a shaft moved by a linear actuator means to slide along a center axis. A vertical position detector are provide for detecting the current position of the shaft to produce position signals indicative of detected positions. An actuation controller controls the movement of the shaft based on the position signals from the position detector.
摘要翻译: 线性致动装置包括由线性致动器装置移动以沿着中心轴线滑动的轴。 垂直位置检测器用于检测轴的当前位置以产生指示检测位置的位置信号。 致动控制器基于来自位置检测器的位置信号来控制轴的运动。
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公开(公告)号:US09175814B2
公开(公告)日:2015-11-03
申请号:US14237178
申请日:2012-02-15
申请人: Satoshi Shida , Kenji Takahashi , Mitsuko Shuto , Masahiro Miki , Hideo Nagai , Takaari Uemoto
发明人: Satoshi Shida , Kenji Takahashi , Mitsuko Shuto , Masahiro Miki , Hideo Nagai , Takaari Uemoto
IPC分类号: F21V29/00 , B60Q1/06 , F21S13/10 , F21V3/00 , F21V15/00 , F21S4/00 , F21V21/00 , F21K99/00 , F21V17/10 , F21V29/506 , F21V3/02 , F21V3/04 , F21V13/02 , F21V23/00 , F21Y101/02 , F21V7/00 , F21V29/15 , F21V29/85
CPC分类号: F21K9/23 , F21K9/60 , F21V3/02 , F21V3/061 , F21V3/062 , F21V7/0016 , F21V13/02 , F21V17/101 , F21V23/002 , F21V23/006 , F21V29/15 , F21V29/506 , F21V29/85 , F21Y2115/10
摘要: An LED lamp has an envelope that includes a globe and a case, an interior space of the envelope being divided in two by a mount closing an opening of the globe, the lamp containing, in a globe side of the interior space, an LED and, in a case side of the interior space, a circuit unit for causing the LED to emit light. The LED is thermally connected to the mount, and the mount and the case are joined to the globe such that, during light emission, at least as much heat from the LED is propagated from the mount to the globe as from the mount to the case.
摘要翻译: LED灯具有一个包围球体和一个壳体的外壳,外壳的内部空间被一个闭合整个球体开口的安装座分成两部分,该灯在内部空间的球形侧面包含一个LED和 在内部空间的壳体侧,用于使LED发光的电路单元。 LED被热连接到安装座,并且安装座和壳体连接到球体,使得在发光期间,至少来自LED的热量至少从安装件传播到球体,从安装件到壳体 。
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公开(公告)号:US09004957B2
公开(公告)日:2015-04-14
申请号:US13602657
申请日:2012-09-04
申请人: Masayuki Aizawa , Kenji Takahashi , Keita Mashino
发明人: Masayuki Aizawa , Kenji Takahashi , Keita Mashino
IPC分类号: H01R4/02 , H01R12/59 , H01R13/6473
CPC分类号: H01R12/596 , H01R12/598 , H01R13/6473
摘要: A wire connecting structure and a cable connector assembly is provided. The wire connecting structure includes an electrical conductor, a cable and a resin. The electrical conductor includes a wire connecting portion. The cable includes an insulator and a core wire surrounded by and exposed from the insulator, the core wire connected to the wire connecting portion. The resin seals a part of the core wire exposed from the insulator and a part of the wire connecting portion.
摘要翻译: 提供电线连接结构和电缆连接器组件。 电线连接结构包括电导体,电缆和树脂。 电导体包括电线连接部。 电缆包括绝缘体和由绝缘体包围和暴露的芯线,芯线连接到电线连接部分。 树脂密封从绝缘体暴露的芯线的一部分和电线连接部分的一部分。
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19.
公开(公告)号:US20140320087A1
公开(公告)日:2014-10-30
申请号:US14361499
申请日:2012-11-29
申请人: Kenji Takahashi
发明人: Kenji Takahashi
IPC分类号: H02J7/00
CPC分类号: H02J7/007 , H01M10/443
摘要: A control method controls the charging and discharging of an electricity storage device. In this control method, the temperature of a reference point inside the electricity storage device is calculated by using the temperature occurring outside the electricity storage device and an expression that expresses movement of heat. An upper-limit electric power that is used in the charging control or the discharging control of the electricity storage device is set to an electric power that corresponds to the calculated temperature of the reference point. The reference point is a grid point that exhibits a temperature that corresponds to, the internal resistance of the electricity storage device, of a plurality of grid points provided inside the electricity storage device.
摘要翻译: 控制方法控制蓄电装置的充放电。 在该控制方法中,通过使用蓄电装置外部发生的温度和表示热量的运动来计算蓄电装置内的基准点的温度。 在蓄电装置的充电控制或放电控制中使用的上限电力被设定为与计算出的基准点温度对应的电力。 参考点是呈现与设置在蓄电装置内部的多个栅极点相对应的蓄电装置的内部电阻的温度的栅格点。
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公开(公告)号:US08836284B2
公开(公告)日:2014-09-16
申请号:US13698584
申请日:2010-05-17
申请人: Kenji Takahashi , Nobuyasu Haga , Shuji Tomura
发明人: Kenji Takahashi , Nobuyasu Haga , Shuji Tomura
CPC分类号: H01M2/1072 , G01R31/3662 , H01M10/48 , H01M10/54 , H02J7/0021 , Y02E60/12 , Y02W30/84
摘要: A rechargeable battery is used with a plurality of battery cells restrained by a restraint member. After the rechargeable battery has the restraint member removed therefrom and is thus disassembled when the rechargeable battery is subsequently re-restrained by the restraint member and thus reused an internal resistance measurement unit measures the rechargeable battery's internal resistance based on battery data detected after the rechargeable battery is re-restrained. At least for the internal voltage, from a value thereof as measured after the battery is re-restrained an evaluation unit evaluates a value of the rechargeable battery that is reused.
摘要翻译: 可充电电池与被约束件约束的多个电池单元一起使用。 在可再充电电池具有从其中移除的限制构件并因此在可再充电电池随后被约束构件重新约束时被拆卸并因此被重新使用的内部电阻测量单元基于在可再充电电池之后检测到的电池数据来测量可再充电电池的内部电阻 被重新约束。 至少对于内部电压,根据在重新约束电池之后测量的值,评估单元评估再利用的可再充电电池的值。
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