IC discarding apparatus for flip chip mounting facility
    11.
    发明授权
    IC discarding apparatus for flip chip mounting facility 失效
    用于倒装芯片安装设备的IC废弃设备

    公开(公告)号:US6129203A

    公开(公告)日:2000-10-10

    申请号:US29391

    申请日:1998-02-27

    CPC分类号: H05K13/0486

    摘要: In a flip-chip mounting equipment, there is provided an IC removal device by which ICs (4) which have been recognized to be removed in error in spite of their faultlessness can be removed in a manner such that they are lined up in a row without being scratched on the surface and without incurring electrostatic destruction. Also the device allows an easy visual checking of the ICs with the objective of reuse. The device comprises a glass plate (2) for carrying ICs (4) and a mechanism for rotating this glass plate (2) at fixed angles, whereby if a recognition error occurs, a bonding head (1) with an IC (4) sucked thereby is moved to an IC removal position on the glass plate (2) and is then lowered until the IC (4) contacts the glass plate (2), thereby removing the IC (4). As a result, the ICs (4) can be lined up in a row without being scratched on the surface and without incurring electrostatic destruction, allowing an easy visual checking of the ICs with the objective of reuse.

    摘要翻译: PCT No.PCT / JP97 / 02296 Sec。 371日期1998年2月27日 102(e)1998年2月27日PCT 1997年7月2日PCT公布。 公开号WO98 / 01901 日期1998年1月15日在一种倒装芯片安装设备中,提供了一种IC去除装置,通过该IC去除装置,尽管它们的无缺陷已被识别出被错误地去除的IC(4)可以以这样的方式被去除 连续排列而不会在表面上划伤而不会导致静电破坏。 此外,该器件允许容易地目视检查IC的目的是重新使用。 该装置包括用于承载IC(4)的玻璃板(2)和用于以固定角度旋转该玻璃板(2)的机构,由此如果发生识别错误,则吸入IC(4)的接合头(1) 从而移动到玻璃板(2)上的IC去除位置,然后降低直到IC(4)接触玻璃板(2),从而去除IC(4)。 结果,IC(4)可以排成一行而不会在表面上划伤而不会引起静电破坏,从而允许容易地目视检查IC以便重新使用。

    Bump bonding unit with tray storage and transport apparatuses
    12.
    发明授权
    Bump bonding unit with tray storage and transport apparatuses 失效
    具有托盘存储和运输设备的凸块接合单元

    公开(公告)号:US06647616B1

    公开(公告)日:2003-11-18

    申请号:US09446031

    申请日:1999-12-15

    IPC分类号: B23P2100

    摘要: A bump bonding unit is disclosed including a novel storage, transport, and feed system for allocating trays that hold IC chips to various operations of the bump bonding unit. The bump bonding unit includes fist and second tray storage and feed apparatuses that transport trays from empty stacks to full stacks and vice versa, and a transfer head for picking up an IC chip without a bump formed thereon and moving the IC chip to a bump formation location, and for picking up the IC chip with the bump formed thereon and moving the IC chip to a storage location. The bump bonding unit also includes a bump forming unit for forming the bump on the IC chip. Each tray storage apparatus includes a carrier that moves vertically to position a stack of trays, a tray receiver that cooperates with the carrier to support a lowermost tray in the respective stack of trays, and tray holder to support and release a tray supported by the tray receiver.

    摘要翻译: 公开了一种凸块焊接单元,其包括用于分配托盘的新颖的存储,输送和馈送系统,其将IC芯片保持在凸块接合单元的各种操作。 凸块接合单元包括将托盘从空堆栈传送到全堆叠的第一和第二托盘存储和进给装置,反之亦然,以及用于拾取IC芯片而没有形成凸块的转移头,并将IC芯片移动到凸块形成 位置,并且用于拾取IC芯片,其上形成有凸块并将IC芯片移动到存储位置。 凸块接合单元还包括用于在IC芯片上形成凸块的凸块形成单元。 每个托盘存储装置包括一个托架,该托架垂直移动以定位托盘堆叠;托盘托架,其与托架配合以支撑相应堆叠的托盘中的最下托盘;以及托盘托架,用于支撑和释放由托盘支撑的托盘 接收器。

    Method and apparatus for handling arrayed part
    14.
    发明授权
    Method and apparatus for handling arrayed part 失效
    排列部件的处理方法和装置

    公开(公告)号:US06830989B1

    公开(公告)日:2004-12-14

    申请号:US10069401

    申请日:2002-02-26

    IPC分类号: H01L21301

    CPC分类号: H01L21/67271 H01L21/67144

    摘要: Handling of each arrayed component is implemented in pickup operation within a movement range of a supporting body against the size of a supporting region of the arrayed component smaller than that in the prior art. Each component supported on a supporting body in array is moved to a pickup position with a movement of the supporting body in X and Y two component array directions, and is fed to pickup operation by a tool with push-up operation by a push-up pin involved, in which after each unit region (D1 to D4) dividedly set around the pickup position of the supporting body is positioned at a pickup standby position by rotation of the supporting body in a switching manner, the component in the positioned unit region is moved in each component array direction of the supporting body and fed to pickup operation in sequence.

    摘要翻译: 在支撑体的移动范围内,在阵列部件的支撑区域的尺寸小于现有技术的尺寸的情况下,每个排列的部件的处理被实现在支撑体的运动范围内的拾取操作。 支撑在阵列中的支撑体上的每个部件通过支撑体在X和Y两个分量阵列方向上的移动而被移动到拾取位置,并且通过具有由上推的上推操作的工具进给到拾取操作 引脚,其中通过以切换方式旋转支撑体而将支撑体的拾取位置分开设置的每个单位区域(D1至D4)定位在拾取备用位置,定位单元区域中的部件为 在支撑体的每个分量阵列方向上移动并依次馈送到拾取操作。

    Wire connecting structure and cable connector assembly
    18.
    发明授权
    Wire connecting structure and cable connector assembly 有权
    电线连接结构和电缆连接器组件

    公开(公告)号:US09004957B2

    公开(公告)日:2015-04-14

    申请号:US13602657

    申请日:2012-09-04

    摘要: A wire connecting structure and a cable connector assembly is provided. The wire connecting structure includes an electrical conductor, a cable and a resin. The electrical conductor includes a wire connecting portion. The cable includes an insulator and a core wire surrounded by and exposed from the insulator, the core wire connected to the wire connecting portion. The resin seals a part of the core wire exposed from the insulator and a part of the wire connecting portion.

    摘要翻译: 提供电线连接结构和电缆连接器组件。 电线连接结构包括电导体,电缆和树脂。 电导体包括电线连接部。 电缆包括绝缘体和由绝缘体包围和暴露的芯线,芯线连接到电线连接部分。 树脂密封从绝缘体暴露的芯线的一部分和电线连接部分的一部分。

    CONTROL APPARATUS AND CONTROL METHOD FOR ELECTRICITY STORAGE DEVICE
    19.
    发明申请
    CONTROL APPARATUS AND CONTROL METHOD FOR ELECTRICITY STORAGE DEVICE 审中-公开
    电力存储装置的控制装置和控制方法

    公开(公告)号:US20140320087A1

    公开(公告)日:2014-10-30

    申请号:US14361499

    申请日:2012-11-29

    申请人: Kenji Takahashi

    发明人: Kenji Takahashi

    IPC分类号: H02J7/00

    CPC分类号: H02J7/007 H01M10/443

    摘要: A control method controls the charging and discharging of an electricity storage device. In this control method, the temperature of a reference point inside the electricity storage device is calculated by using the temperature occurring outside the electricity storage device and an expression that expresses movement of heat. An upper-limit electric power that is used in the charging control or the discharging control of the electricity storage device is set to an electric power that corresponds to the calculated temperature of the reference point. The reference point is a grid point that exhibits a temperature that corresponds to, the internal resistance of the electricity storage device, of a plurality of grid points provided inside the electricity storage device.

    摘要翻译: 控制方法控制蓄电装置的充放电。 在该控制方法中,通过使用蓄电装置外部发生的温度和表示热量的运动来计算蓄电装置内的基准点的温度。 在蓄电装置的充电控制或放电控制中使用的上限电力被设定为与计算出的基准点温度对应的电力。 参考点是呈现与设置在蓄电装置内部的多个栅极点相对应的蓄电装置的内部电阻的温度的栅格点。

    Device and method for calculating value of rechargeable battery
    20.
    发明授权
    Device and method for calculating value of rechargeable battery 有权
    用于计算可充电电池的值的装置和方法

    公开(公告)号:US08836284B2

    公开(公告)日:2014-09-16

    申请号:US13698584

    申请日:2010-05-17

    摘要: A rechargeable battery is used with a plurality of battery cells restrained by a restraint member. After the rechargeable battery has the restraint member removed therefrom and is thus disassembled when the rechargeable battery is subsequently re-restrained by the restraint member and thus reused an internal resistance measurement unit measures the rechargeable battery's internal resistance based on battery data detected after the rechargeable battery is re-restrained. At least for the internal voltage, from a value thereof as measured after the battery is re-restrained an evaluation unit evaluates a value of the rechargeable battery that is reused.

    摘要翻译: 可充电电池与被约束件约束的多个电池单元一起使用。 在可再充电电池具有从其中移除的限制构件并因此在可再充电电池随后被约束构件重新约束时被拆卸并因此被重新使用的内部电阻测量单元基于在可再充电电池之后检测到的电池数据来测量可再充电电池的内部电阻 被重新约束。 至少对于内部电压,根据在重新约束电池之后测量的值,评估单元评估再利用的可再充电电池的值。