公开(公告)号：US6129203A

公开(公告)日：2000-10-10

申请号：US29391

申请日：1998-02-27

申请人： Hiroyuki Kiyomura ,  Shinji Kanayama ,  Nobuya Matsumura ,  Kenichi Nishino ,  Kenji Takahashi ,  Naomi Kainou

发明人： Hiroyuki Kiyomura ,  Shinji Kanayama ,  Nobuya Matsumura ,  Kenichi Nishino ,  Kenji Takahashi ,  Naomi Kainou

IPC分类号： H01L21/60 ,  H05K13/04 ,  H05K13/08 ,  B65G23/00

CPC分类号： H05K13/0486

摘要： In a flip-chip mounting equipment, there is provided an IC removal device by which ICs (4) which have been recognized to be removed in error in spite of their faultlessness can be removed in a manner such that they are lined up in a row without being scratched on the surface and without incurring electrostatic destruction. Also the device allows an easy visual checking of the ICs with the objective of reuse. The device comprises a glass plate (2) for carrying ICs (4) and a mechanism for rotating this glass plate (2) at fixed angles, whereby if a recognition error occurs, a bonding head (1) with an IC (4) sucked thereby is moved to an IC removal position on the glass plate (2) and is then lowered until the IC (4) contacts the glass plate (2), thereby removing the IC (4). As a result, the ICs (4) can be lined up in a row without being scratched on the surface and without incurring electrostatic destruction, allowing an easy visual checking of the ICs with the objective of reuse.

摘要翻译： PCT No.PCT / JP97 / 02296 Sec。 371日期1998年2月27日 102（e）1998年2月27日PCT 1997年7月2日PCT公布。 公开号WO98 / 01901 日期1998年1月15日在一种倒装芯片安装设备中，提供了一种IC去除装置，通过该IC去除装置，尽管它们的无缺陷已被识别出被错误地去除的IC（4）可以以这样的方式被去除 连续排列而不会在表面上划伤而不会导致静电破坏。 此外，该器件允许容易地目视检查IC的目的是重新使用。 该装置包括用于承载IC（4）的玻璃板（2）和用于以固定角度旋转该玻璃板（2）的机构，由此如果发生识别错误，则吸入IC（4）的接合头（1） 从而移动到玻璃板（2）上的IC去除位置，然后降低直到IC（4）接触玻璃板（2），从而去除IC（4）。 结果，IC（4）可以排成一行而不会在表面上划伤而不会引起静电破坏，从而允许容易地目视检查IC以便重新使用。

公开(公告)号：US06647616B1

公开(公告)日：2003-11-18

申请号：US09446031

申请日：1999-12-15

申请人： Nobuya Matsumura ,  Hiroyuki Kiyomura ,  Kenichi Nishino ,  Kenji Takahashi ,  Shinji Kanayama

发明人： Nobuya Matsumura ,  Hiroyuki Kiyomura ,  Kenichi Nishino ,  Kenji Takahashi ,  Shinji Kanayama

IPC分类号： B23P2100

CPC分类号： H01L21/67144 ,  H01L21/67763 ,  H01L21/67769 ,  H05K13/021 ,  Y10T29/53174 ,  Y10T29/53313 ,  Y10T29/53317

摘要： A bump bonding unit is disclosed including a novel storage, transport, and feed system for allocating trays that hold IC chips to various operations of the bump bonding unit. The bump bonding unit includes fist and second tray storage and feed apparatuses that transport trays from empty stacks to full stacks and vice versa, and a transfer head for picking up an IC chip without a bump formed thereon and moving the IC chip to a bump formation location, and for picking up the IC chip with the bump formed thereon and moving the IC chip to a storage location. The bump bonding unit also includes a bump forming unit for forming the bump on the IC chip. Each tray storage apparatus includes a carrier that moves vertically to position a stack of trays, a tray receiver that cooperates with the carrier to support a lowermost tray in the respective stack of trays, and tray holder to support and release a tray supported by the tray receiver.

摘要翻译： 公开了一种凸块焊接单元，其包括用于分配托盘的新颖的存储，输送和馈送系统，其将IC芯片保持在凸块接合单元的各种操作。 凸块接合单元包括将托盘从空堆栈传送到全堆叠的第一和第二托盘存储和进给装置，反之亦然，以及用于拾取IC芯片而没有形成凸块的转移头，并将IC芯片移动到凸块形成 位置，并且用于拾取IC芯片，其上形成有凸块并将IC芯片移动到存储位置。 凸块接合单元还包括用于在IC芯片上形成凸块的凸块形成单元。 每个托盘存储装置包括一个托架，该托架垂直移动以定位托盘堆叠;托盘托架，其与托架配合以支撑相应堆叠的托盘中的最下托盘;以及托盘托架，用于支撑和释放由托盘支撑的托盘 接收器。

公开(公告)号：US06467158B1

公开(公告)日：2002-10-22

申请号：US09122901

申请日：1998-07-27

申请人： Hiroyuki Kiyomura ,  Shinji Kanayama ,  Nobuya Matsumura ,  Kenji Takahashi ,  Hiroshi Nasu

发明人： Hiroyuki Kiyomura ,  Shinji Kanayama ,  Nobuya Matsumura ,  Kenji Takahashi ,  Hiroshi Nasu

IPC分类号： H05K330

CPC分类号： H05K13/0452 ,  H05K13/0409 ,  H05K13/041 ,  Y10S29/044 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49133 ,  Y10T29/53087 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53191

摘要： A component feeder including a rotary mechanism 31 which is mounted on a turning mechanism 17 for turning the suction nozzle 3 and causes the suction nozzle 3 to rotate around its axis line A, a detector 7 for detecting an amount of displacement the component 2 in rotating direction around the axis line A of the suction nozzle 3, and a controller 32 which controls the suction nozzle 3 such as to rotate at a necessary angle around its axis line A before picking up the component 2 in accordance with displacement of the component 2 in rotating direction around the axis line A.

摘要翻译： 一种部件供给器，包括旋转机构31，该旋转机构31安装在转动机构17上，用于转动吸嘴3并使吸嘴3围绕其轴线A旋转;检测器7，用于检测旋转中的部件2的位移量 方向围绕吸嘴3的轴线A，以及控制器32，其控制吸嘴3，以便在根据部件2的位移拾取部件2之前围绕其轴线A旋转必要的角度 旋转方向围绕轴线A.

公开(公告)号：US06439447B1

公开(公告)日：2002-08-27

申请号：US09763959

申请日：2001-02-28

申请人： Shozo Minamitani ,  Kazushi Higashi ,  Kenji Takahashi ,  Shinji Kanayama ,  Hiroshi Wada ,  Takafumi Tsujisawa ,  Makoto Akita ,  Kenji Okamoto ,  Shinzo Eguchi ,  Yasuhiro Kametani

发明人： Shozo Minamitani ,  Kazushi Higashi ,  Kenji Takahashi ,  Shinji Kanayama ,  Hiroshi Wada ,  Takafumi Tsujisawa ,  Makoto Akita ,  Kenji Okamoto ,  Shinzo Eguchi ,  Yasuhiro Kametani

IPC分类号： B23K106

CPC分类号： H01L22/12 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/75 ,  H01L2224/759 ,  H01L2224/81801 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/00014

摘要： When electrodes on an electronic component and electrode portions on a circuit board are joined via bumps with the electronic component and the circuit board vibrated respectively, a vibration damping detect device and a deciding device detect damping of the vibration caused by a progress of joining between the bumps and the electrode portions, and then determine a good or defective of the joining on a basis of the damping of the vibration. Further, regarding an impedance of an ultrasonic oscillator, a movement amount of a nozzle, or a current supplying to a VCM, these waveforms during the joining are compared with waveforms of good joining thereof and then the good or defective is determined. According to the above constructions, the good or defective of the joining between the electronic component and the circuit board can be determined during the joining. Further, when a joining state becomes wrong during the joining, the joining state can be changed. Thus generation of defective components is prevented and a yield can be improved.

摘要翻译： 当电子部件上的电极和电路板上的电极部分上的电极通过凸块与电子部件和电路板分别振动时，减振检测装置和判定装置检测由连接件 凸起和电极部分，然后基于振动的阻尼确定接合的良好或有缺陷。 此外，关于超声波振荡器的阻抗，喷嘴的移动量或向VCM供给的电流，将这些接合期间的这些波形与良好接合的波形进行比较，然后确定良好或有缺陷。 根据上述结构，可以在接合期间确定电子部件和电路板之间的接合的良好或有缺陷。 此外，当接合期间接合状态变得错误时，可以改变接合状态。 因此，防止缺陷成分的产生，并且可以提高成品率。

公开(公告)号：US07549567B2

公开(公告)日：2009-06-23

申请号：US11668794

申请日：2007-01-30

申请人： Kazushi Higashi ,  Shozo Minamitani ,  Shinji Kanayama ,  Kenji Takahashi

发明人： Kazushi Higashi ,  Shozo Minamitani ,  Shinji Kanayama ,  Kenji Takahashi

IPC分类号： B23K1/06 ,  B23K5/20

CPC分类号： H01L21/67144 ,  H01L21/6838 ,  H01L24/75 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/14 ,  H05K13/0409 ,  Y10T29/4913 ,  Y10T29/49142 ,  Y10T29/49144 ,  Y10T29/53174 ,  Y10T29/53178 ,  H01L2924/00 ,  H01L2224/05599

摘要： Component 3 is pressed onto a circuit board 4 so that their respective metal interconnects 5, 6 are in close contact with each other, and ultrasonic vibration is applied to the suction nozzle 14 holding the component 3. Friction is thereby generated between metal interconnects 5, 6 whereby the component 3 is bonded on circuit substrate. Suction nozzle 14 for handling components is made of stainless steel and has a working face 14a provided with a hardened layer 14b, or alternatively, suction nozzle 14 may have a suction head 14c having a working face 14a made of cemented carbide. Working face 14a of suction nozzle 14 is refined by polishing as required during the mounting operation.

摘要翻译： 部件3被压在电路板4上，使得它们各自的金属互连件5,6彼此紧密接触，并且超声波振动被施加到保持部件3的吸嘴14上。从而在金属互连件5之间产生摩擦， 6，由此将部件3接合在电路基板上。 用于处理部件的吸嘴14由不锈钢制成并具有设置有硬化层14b的工作面14a，或者，吸嘴14可具有具有由硬质合金制成的工作面14a的吸头14c。 吸嘴14的工作面14a在安装操作期间根据需要进行研磨精制。

公开(公告)号：US06321973B1

公开(公告)日：2001-11-27

申请号：US09354087

申请日：1999-07-15

申请人： Shozo Minamitani ,  Kazushi Higashi ,  Kenji Takahashi ,  Shinji Kanayama ,  Hiroshi Wada ,  Takafumi Tsujisawa

发明人： Shozo Minamitani ,  Kazushi Higashi ,  Kenji Takahashi ,  Shinji Kanayama ,  Hiroshi Wada ,  Takafumi Tsujisawa

IPC分类号： B23K106

CPC分类号： H01L24/81 ,  H01L21/67138 ,  H01L24/75 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/75 ,  H01L2224/75355 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14

摘要： The present invention provides a bump-joining apparatus, a bump-joining method, and a semiconductor component-manufacturing apparatus whereby bumps and electrode portions of circuit board are perfectly joined, with higher join strength than in the conventional art. The apparatus includes a vibration generation device, a pressing device and a control unit, wherein bumps are pressed to electrode portions of a circuit board and vibrated with ultrasonic waves after reaching an initial contact area before reaching a join-completed-contact area at a completion of the joining, so that the bumps are more perfectly joined to the electrode portion than in the conventional art which vibrates the bump only after reaching the join-completed-contact area. Larger join strength is achieved than in the conventional art.

摘要翻译： 本发明提供一种凸块接合装置，凸块接合方法和半导体部件制造装置，其中电路板的凸块和电极部分完美地接合，具有比传统技术更高的接合强度。 该装置包括振动发生装置，按压装置和控制单元，其中，在完成接合完成接触区域之前，在达到初始接触面积之后，将凸块按压到电路板的电极部分并用超声波振动 使得凸块更好地与仅在达到接合完成接触区域之后使凸起振动的传统技术中与电极部分完美接合。 实现了比传统技术更大的连接强度。

公开(公告)号：US06264704B1

公开(公告)日：2001-07-24

申请号：US09266928

申请日：1999-03-12

申请人： Shozo Minamitani ,  Takashi Shimizu ,  Shinji Kanayama ,  Kenji Takahashi ,  Kazushi Higashi ,  Satoshi Shida ,  Naoto Hosotani

发明人： Shozo Minamitani ,  Takashi Shimizu ,  Shinji Kanayama ,  Kenji Takahashi ,  Kazushi Higashi ,  Satoshi Shida ,  Naoto Hosotani

IPC分类号： H01L2100

CPC分类号： H05K13/0417 ,  H01L21/67144 ,  H01L21/6838 ,  H01L24/75 ,  H01L2924/12041 ,  Y10T29/41 ,  H01L2924/00

摘要： A divided component separated individually beforehand is supplied in a state while stored in a storage body, taken outside by a take-out and storage unit, and a component is mounted on the divided component by a mounting unit, and thereby a divided component with the component is produced. A plurality of the produced divided components with the components mounted thereon are collected into the storage body.

摘要翻译： 在预先分离的分割部件以存储在存储体中的状态下被供给，由取出和存储单元取出外部，并且通过安装单元将部件安装在分割部件上，从而将分割部件与 组件生产。 多个产生的具有安装在其上的部件的分割部件被收集到存储体中。

公开(公告)号：US06193136B1

公开(公告)日：2001-02-27

申请号：US09373957

申请日：1999-08-13

申请人： Kazushi Higashi ,  Hiroyuki Otani ,  Shozo Minamitani ,  Shinji Kanayama ,  Kenji Takahashi

发明人： Kazushi Higashi ,  Hiroyuki Otani ,  Shozo Minamitani ,  Shinji Kanayama ,  Kenji Takahashi

IPC分类号： B23K106

CPC分类号： H01L21/563 ,  B23K20/10 ,  B23K2101/40 ,  H01L21/67126 ,  H01L24/27 ,  H01L24/29 ,  H01L24/743 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75355 ,  H01L2224/75743 ,  H01L2224/75801 ,  H01L2224/81121 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83862 ,  H01L2224/83874 ,  H01L2224/92125 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/05599

摘要： Sealant 11 is supplied in advance to one or both of the electrical bonding areas 5,6 of the component 3 and the mounting surface 4, and as the component 3 is brought in contact with the mounting surface 4, the sealant 11 is compressed and filled therebetween in a required area. At the same time ultrasonic vibration is applied to the component 3 for generating friction between the electrical bonding areas 5, 6 of the component 3 and the mounting surface 4 in tight contact with each other, so that both electrical bonding areas 5, 6 are melted and ultrasonically bonded together, and thereby the component 3 is mounted on the mounting surface 4.

摘要翻译： 密封剂11预先被供给到部件3的电接合区域5,6和安装表面4中，并且当部件3与安装表面4接触时，密封剂11被压缩和填充 在所需区域之间。 同时，对组件3施加超声波振动，以在组件3的电接合区域5,6和安装表面4之间产生摩擦力，彼此紧密接触，使得两个电接合区域5,6被熔化 并超声波接合在一起，从而将部件3安装在安装面4上。

公开(公告)号：US06467670B2

公开(公告)日：2002-10-22

申请号：US09756307

申请日：2001-01-08

申请人： Kazushi Higashi ,  Hiroyuki Otani ,  Shozo Minamitani ,  Shinji Kanayama ,  Kenji Takahashi

发明人： Kazushi Higashi ,  Hiroyuki Otani ,  Shozo Minamitani ,  Shinji Kanayama ,  Kenji Takahashi

IPC分类号： B23K2012

CPC分类号： H01L21/563 ,  B23K20/10 ,  B23K2101/40 ,  H01L21/67126 ,  H01L24/27 ,  H01L24/29 ,  H01L24/743 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75355 ,  H01L2224/75743 ,  H01L2224/75801 ,  H01L2224/81121 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83862 ,  H01L2224/83874 ,  H01L2224/92125 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/05599

摘要： Sealant 11 is supplied in advance to one or both of the electrical bonding areas 5,6 of the component 3 and the mounting surface 4, and as the component 3 is brought in contact with the mounting surface 4, the sealant 11 is compressed and filled therebetween in a required area. At the same time ultrasonic vibration is applied to the component 3 for generating friction between the electrical bonding areas 5, 6 of the component 3 and the mounting surface 4 in tight contact with each other, so that both electrical bonding areas 5, 6 are melted and ultrasonically bonded together, and thereby the component 3 is mounted on the mounting surface 4.

摘要翻译： 密封剂11预先被供给到部件3的电接合区域5,6和安装表面4中，并且当部件3与安装表面4接触时，密封剂11被压缩和填充 在所需区域之间。 同时，对组件3施加超声波振动，以在组件3的电接合区域5,6和安装表面4之间产生摩擦力，彼此紧密接触，使得两个电接合区域5,6被熔化 并超声波接合在一起，从而将部件3安装在安装面4上。

公开(公告)号：US20070119905A1

公开(公告)日：2007-05-31

申请号：US11668794

申请日：2007-01-30

申请人： Kazushi Higashi ,  Shozo Minamitani ,  Shinji Kanayama ,  Kenji Takahashi

发明人： Kazushi Higashi ,  Shozo Minamitani ,  Shinji Kanayama ,  Kenji Takahashi

IPC分类号： A47J36/02

CPC分类号： H01L21/67144 ,  H01L21/6838 ,  H01L24/75 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/14 ,  H05K13/0409 ,  Y10T29/4913 ,  Y10T29/49142 ,  Y10T29/49144 ,  Y10T29/53174 ,  Y10T29/53178 ,  H01L2924/00 ,  H01L2224/05599

摘要： Component 3 is pressed onto a circuit board 4 so that their respective metal interconnects 5, 6 are in close contact with each other, and ultrasonic vibration is applied to the suction nozzle 14 holding the component 3. Friction is thereby generated between metal interconnects 5, 6 whereby the component 3 is bonded on circuit substrate. Suction nozzle 14 for handling components is made of stainless steel and has a working face 14a provided with a hardened layer 14b, or alternatively, suction nozzle 14 may have a suction head 14c having a working face 14a made of cemented carbide. Working face 14a of suction nozzle 14 is refined by polishing as required during the mounting operation.

摘要翻译： 部件3被压在电路板4上，使得它们各自的金属互连件5,6彼此紧密接触，并且超声波振动被施加到保持部件3的吸嘴14上。从而在金属互连件5之间产生摩擦， 6，由此将部件3接合在电路基板上。 用于处理部件的吸嘴14由不锈钢制成，并且具有设置有硬化层14b的工作面14a，或者，吸嘴14可具有具有由硬质合金制成的工作面14a的吸头14c。 吸嘴14的工作面14a根据需要通过在安装操作期间进行研磨来精炼。