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22 条记录 (耗时 0.027 秒)

    Semiconductor device
    11.
    发明授权
    Semiconductor device 有权
    半导体器件

    公开(公告)号：US07538433B2

    公开(公告)日：2009-05-26

    申请号：US11452957

    申请日：2006-06-15

    申请人： Koji Takemura ,  Hiroshige Hirano ,  Yutaka Itoh ,  Hikari Sano ,  Masao Takahashi ,  Koji Koike

    发明人： Koji Takemura ,  Hiroshige Hirano ,  Yutaka Itoh ,  Hikari Sano ,  Masao Takahashi ,  Koji Koike

    IPC分类号： H01L23/52

    CPC分类号： H01L23/585 ,  H01L21/76832 ,  H01L23/522 ,  H01L23/53295 ,  H01L23/562 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A semiconductor device includes at least three or more wiring layers stacked in an interlayer insulating film on a semiconductor substrate, a seal ring provided at the outer periphery of a chip region of the semiconductor substrate and a chip strength reinforcement provided in part of the chip region near the seal ring. The chip strength reinforcement is made of a plurality of dummy wiring structures and each of the plurality of dummy wiring structures is formed to extend across and within two or more of the wiring layers including one or none of the bottommost wiring layer and the topmost wiring layer using a via portion.

    摘要翻译： 一种半导体器件包括在半导体衬底上的层间绝缘膜中堆叠的至少三个或更多个布线层，设置在半导体衬底的芯片区域的外周处的密封环和在芯片区域的一部分中提供的芯片强度增强 靠近密封圈。 芯片强度加强件由多个虚拟布线结构构成，并且多个虚设布线结构中的每一个形成为跨越两个或更多个布线层中的两个或更多个布线层，包括最下面的布线层和最上面的布线层 使用通孔部分。

    Semiconductor device
    12.
    发明申请
    Semiconductor device 有权
    半导体器件

    公开(公告)号：US20070001308A1

    公开(公告)日：2007-01-04

    申请号：US11452957

    申请日：2006-06-15

    申请人： Koji Takemura ,  Hiroshige Hirano ,  Yutaka Itoh ,  Hikari Sano ,  Masao Takahashi ,  Koji Koike

    发明人： Koji Takemura ,  Hiroshige Hirano ,  Yutaka Itoh ,  Hikari Sano ,  Masao Takahashi ,  Koji Koike

    IPC分类号： H01L23/52 ,  H01L23/48

    CPC分类号： H01L23/585 ,  H01L21/76832 ,  H01L23/522 ,  H01L23/53295 ,  H01L23/562 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A semiconductor device includes at least three or more wiring layers stacked in an interlayer insulating film on a semiconductor substrate, a seal ring provided at the outer periphery of a chip region of the semiconductor substrate and a chip strength reinforcement provided in part of the chip region near the seal ring. The chip strength reinforcement is made of a plurality of dummy wiring structures and each of the plurality of dummy wiring structures is formed to extend across and within two or more of the wiring layers including one or none of the bottommost wiring layer and the topmost wiring layer using a via portion.

    摘要翻译： 一种半导体器件包括在半导体衬底上的层间绝缘膜中堆叠的至少三个或更多个布线层，设置在半导体衬底的芯片区域的外周处的密封环和在芯片区域的一部分中提供的芯片强度增强 靠近密封圈。 芯片强度加强件由多个虚拟布线结构构成，并且多个虚设布线结构中的每一个形成为跨越两个或更多个布线层中的两个或更多个布线层，包括最下面的布线层和最上面的布线层 使用通孔部分。

    Semiconductor device
    13.
    发明授权
    Semiconductor device 有权
    半导体器件

    公开(公告)号：US07888801B2

    公开(公告)日：2011-02-15

    申请号：US12430439

    申请日：2009-04-27

    申请人： Koji Takemura ,  Hiroshige Hirano ,  Yutaka Itoh ,  Hikari Sano ,  Masao Takahashi ,  Koji Koike

    发明人： Koji Takemura ,  Hiroshige Hirano ,  Yutaka Itoh ,  Hikari Sano ,  Masao Takahashi ,  Koji Koike

    IPC分类号： H01L23/522

    CPC分类号： H01L23/585 ,  H01L21/76832 ,  H01L23/522 ,  H01L23/53295 ,  H01L23/562 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A semiconductor device includes at least three or more wiring layers stacked in an interlayer insulating film on a semiconductor substrate, a seal ring provided at the outer periphery of a chip region of the semiconductor substrate and a chip strength reinforcement provided in part of the chip region near the seal ring. The chip strength reinforcement is made of a plurality of dummy wiring structures and each of the plurality of dummy wiring structures is formed to extend across and within two or more of the wiring layers including one or none of the bottommost wiring layer and the topmost wiring layer using a via portion.

    摘要翻译： 一种半导体器件包括在半导体衬底上的层间绝缘膜中堆叠的至少三个或更多个布线层，设置在半导体衬底的芯片区域的外周处的密封环和在芯片区域的一部分中提供的芯片强度增强 靠近密封圈。 芯片强度加强件由多个虚拟布线结构构成，并且多个虚设布线结构中的每一个形成为跨越两个或更多个布线层中的两个或更多个布线层，包括最下面的布线层和最上面的布线层 使用通孔部分。

    Method of and structure for fixing a flexible electrical conductor
    18.
    发明授权
    Method of and structure for fixing a flexible electrical conductor 失效
    固定柔性电导体的方法和结构

    公开(公告)号：US06294255B1

    公开(公告)日：2001-09-25

    申请号：US09689594

    申请日：2000-10-13

    申请人： Masataka Suzuki ,  Hiroyuki Ashiya ,  Koji Koike ,  Shinobu Mochiduki

    发明人： Masataka Suzuki ,  Hiroyuki Ashiya ,  Koji Koike ,  Shinobu Mochiduki

    IPC分类号： H01R903

    CPC分类号： H01R12/62 ,  H01R4/029 ,  H01R13/5845 ,  H01R43/0207 ,  H05K1/0284 ,  H05K3/301 ,  H05K3/361 ,  H05K2201/0397 ,  H05K2201/09036 ,  H05K2201/10356 ,  H05K2201/2009 ,  H05K2203/0285 ,  Y10T428/2933

    摘要： A method of fixing a flexible electrical conductor, in which a plurality of flat conductors in which their connecting ends to be connected to another circuit are exposed are integrally covered with a resin-made cladding member, to a fixing portion for connection to the other circuit, comprises the steps of: placing the cladding member on this side of the connecting ends on the fixing portion; and welding together the cladding member on this side of the connecting ends and the fixing portion so as to fix the flexible electrical conductor to the fixing portion. As a result, even if an external force is applied to the flexible electrical conductor, the force is not applied directly to a connecting portion for connecting the connecting ends to connecting ends of the other circuit, thereby improving the electrical reliability in the connection.

    摘要翻译： 一种固定柔性电导体的方法，其中将其连接到另一电路的连接端暴露的多个扁平导体一体地被树脂制的包覆部件覆盖到用于连接到另一个电路的固定部分 包括以下步骤：将包覆部件放置在固定部分上的连接端的该侧面上; 并将包覆部件焊接在连接端的这一侧和固定部分上，以将柔性电导体固定在固定部分上。 结果，即使对柔性电导体施加外力，也不会将力直接施加到用于将连接端连接到另一电路的连接端的连接部，从而提高连接中的电可靠性。

    Proofer
    19.
    发明授权
    Proofer 有权

    公开(公告)号：US07789222B2

    公开(公告)日：2010-09-07

    申请号：US12030427

    申请日：2008-02-13

    申请人： Kazuhide Fujita ,  Masayuki Koma ,  Koji Koike ,  Satoshi Goto

    发明人： Kazuhide Fujita ,  Masayuki Koma ,  Koji Koike ,  Satoshi Goto

    IPC分类号： B65G17/16 ,  B65G17/18 ,  B65G17/32 ,  B65G43/00 ,  B65G23/44

    CPC分类号： A21C13/02

    摘要： An endless dough conveyor 16 is provided with a resin endless toothed belt 18 instead of a metal chain. A toothed pulley 22 around which the endless toothed belt is wound is also made of resin. A rail 64 is disposed adjacent to a horizontal path of the belt, and a roller 46 attached to the belt is adapted to roll on the rail. At least two induction motors are provided for driving the endless toothed belt. The induction motors are supplied with electric power from a single inverter 35. At least a pulley is provided with a detecting unit 80. The detecting unit 80 detects a state in which teeth of the endless toothed belt climb onto that of the pulley, thereby predicting breakage of the belt. Thus, it is possible to prevent contamination of dough in a proofer.

    摘要翻译： 无端的面料输送机16设置有树脂无端带齿带18而不是金属链。 卷绕有环形齿形带的齿形带轮22也由树脂制成。 轨道64设置成邻近带的水平路径，并且附接到带的辊46适于在轨道上滚动。 提供至少两个感应电动机用于驱动环形带齿带。 感应电动机由单个逆变器35提供电力。至少一个滑轮设置有检测单元80.检测单元80检测环形带齿的齿爬上皮带轮的齿的状态，由此预测 皮带破损。 因此，可以防止制版机中面团的污染。

    PROOFER
    20.
    发明申请
    PROOFER 有权

    公开(公告)号：US20080199286A1

    公开(公告)日：2008-08-21

    申请号：US12030427

    申请日：2008-02-13

    申请人： Kazuhide Fujita ,  Masayuki Koma ,  Koji Koike ,  Satoshi Goto

    发明人： Kazuhide Fujita ,  Masayuki Koma ,  Koji Koike ,  Satoshi Goto

    IPC分类号： A21C13/02 ,  A21C13/00

    CPC分类号： A21C13/02

    摘要： An endless dough conveyor 16 is provided with a resin endless toothed belt 18 instead of a metal chain. A toothed pulley 22 around which the endless toothed belt is wound is also made of resin. A rail 64 is disposed adjacent to a horizontal path of the belt, and a roller 46 attached to the belt is adapted to roll on the rail. At least two induction motors are provided for driving the endless toothed belt. The induction motors are supplied with electric power from a single inverter 35. At least a pulley is provided with a detecting unit 80. The detecting unit 80 detects a state in which teeth of the endless toothed belt climb onto that of the pulley, thereby predicting breakage of the belt. Thus, it is possible to prevent contamination of dough in a proofer.

    摘要翻译： 无端的面料输送机16设置有树脂无端带齿带18而不是金属链。 卷绕有环形齿形带的齿形带轮22也由树脂制成。 轨道64设置成邻近带的水平路径，并且附接到带的辊46适于在轨道上滚动。 提供至少两个感应电动机用于驱动环形带齿带。 感应电动机由单个逆变器35提供电力。至少一个滑轮设置有检测单元80.检测单元80检测环形带齿的齿爬上皮带轮的齿的状态，由此预测 皮带破损。 因此，可以防止制版机中面团的污染。