公开(公告)号：US06478679B1

公开(公告)日：2002-11-12

申请号：US09269973

申请日：1999-07-21

申请人： Atsunori Himoto ,  Kenji Tosaki ,  Madoka Nakayama ,  Miyuki Yasuoka ,  Koji Tsuchiya

发明人： Atsunori Himoto ,  Kenji Tosaki ,  Madoka Nakayama ,  Miyuki Yasuoka ,  Koji Tsuchiya

IPC分类号： A63F1302

CPC分类号： A63F13/95 ,  A63F13/12 ,  A63F13/215 ,  A63F13/26 ,  A63F13/92 ,  A63F2300/204 ,  A63F2300/206 ,  A63F2300/402 ,  A63F2300/403 ,  A63F2300/408 ,  A63F2300/636 ,  A63F2300/65 ,  A63F2300/8029

摘要： A memory device has a small-sized LCD disposed on an upper part of the front side of a case, and operation buttons disposed below the LCD. An external connection terminal for connecting a game apparatus or others to an outside apparatus is disposed in the lower side of the case nearer the front side thereof. A controller has a card slot for the memory device to be loaded in, which is provided in an upper part of an operation side thereof. The card slot has a window opened so as to expose a required part of the memory device when the memory device is loaded in the controller. With the memory device loaded in the controller a game player operates the operation buttons while watching the LCD of the memory device.

公开(公告)号：US5566558A

公开(公告)日：1996-10-22

申请号：US511933

申请日：1995-08-07

申请人： Koji Tsuchiya

发明人： Koji Tsuchiya

IPC分类号： D04B15/88 ,  D04B35/10 ,  D04B35/34

CPC分类号： D04B35/10 ,  D04B15/88 ,  D04B35/34

摘要： A circular knitting machine and take-up mechanism therefor includes a knitting unit for forming a tubular knit fabric, a first set of let-off rolls for flattening the tubular fabric into a double-layer web and delivering the web from the knitting unit, a slitter for slitting the flattened tubular fabric longitudinally along a predetermined line, a spreader for spreading the slit fabric into a single layer web, the spreader being extendable and contractible to spread fabrics of varying widths, a second set of let-off rolls for drawing the fabric across the spreader and a fabric take-up for taking-up the single layer web for storage and subsequent use.

摘要翻译： 一种圆形针织机及其卷绕机构包括：用于形成管状针织物的编织单元，将第一组送出辊用于将管状织物平坦化成双层织物并将织物从针织单元输送， 用于沿着预定线纵向切割扁平扁平管状织物的分切机，用于将狭缝织物铺展成单层织物的撒布机，撒布机可伸缩收缩以展开各种宽度的织物，第二组送出辊用于拉伸 织物穿过吊具和织物卷取，用于卷起单层纤维网进行存储和后续使用。

公开(公告)号：US5381676A

公开(公告)日：1995-01-17

申请号：US128807

申请日：1993-09-29

申请人： Takao Shibata ,  Kozo Taniguchi ,  Tashio Noguchi ,  Koji Tsuchiya

发明人： Takao Shibata ,  Kozo Taniguchi ,  Tashio Noguchi ,  Koji Tsuchiya

IPC分类号： D04B15/88

CPC分类号： D04B15/88

摘要： A fabric take-up apparatus for a circular knitting machine includes a set of delivery rolls for flattening and delivering the flattened fabric to take-up means which winds the flattened fabric into a roll, sensing means for sensing the tension in the fabric and for generating electrical signals indicative of fluctuations in tension from a predetermined, desired tension in the fabric, variable speed drive means for driving the delivery rolls, and control means for controlling the variable speed drive means responsive to the electrical signals generated by the tension sensing means.

摘要翻译： 用于圆形针织机的织物卷取装置包括一组输送辊，用于使扁平织物平整并输送到将扁平织物卷成卷的卷取装置，用于感测织物中的张力的感测装置和用于产生 指示织物中预定的期望张力的张力波动的电信号，用于驱动输送辊的变速驱动装置，以及响应于张力检测装置产生的电信号来控制变速驱动装置的控制装置。

公开(公告)号：US4565076A

公开(公告)日：1986-01-21

申请号：US661102

申请日：1984-10-15

申请人： Koji Tsuchiya

发明人： Koji Tsuchiya

IPC分类号： D04B15/94 ,  D04B15/88 ,  D04B35/10

CPC分类号： D04B35/10 ,  D04B15/88

摘要： A single safety device to automatically stop a conventional circular knitting machine in the event of failure of the belt used to drive a pair of fabric advancing rollers of the machine while the fabric is being knit, and/or to stop the machine in the event of failure to secure the so-advanced fabric to the rotary shaft upon which the fabric is normally rolled to sequentially form individual rolls of fabric on the machine.

摘要翻译： 一种单一的安全装置，用于在织物被编织时在用于驱动机器的一对织物推进辊的皮带发生故障的情况下自动停止传统的圆形针织机，和/或在发生织物的情况下停止机器 未能将如此先进的织物固定到旋转轴上，织物通常在该旋转轴上顺序地在机器上形成单个的织物卷。

公开(公告)号：US09000634B2

公开(公告)日：2015-04-07

申请号：US13387560

申请日：2010-07-26

申请人： Hiroto Tanaka ,  Takeshi Kanai ,  Masaaki Kimura ,  Koji Tsuchiya

发明人： Hiroto Tanaka ,  Takeshi Kanai ,  Masaaki Kimura ,  Koji Tsuchiya

IPC分类号： H02K5/18 ,  H02K11/00 ,  H02K13/00 ,  H02K9/28 ,  H02K5/14 ,  H02K7/116

CPC分类号： H02K9/28 ,  H02K5/148 ,  H02K5/18 ,  H02K7/1166 ,  H02K11/33 ,  H02K13/006

摘要： In a brush holder accommodating part 26d of a gear housing 26, paired flat surface parts 26c and paired curved parts 26b are alternately disposed so as to be formed into an elliptical shape, one of the paired flat surface parts is formed with first heat sinks 26i, and two brushes 20 and 20 mounted on a brush holder unit 19 accommodated in the brush holder accommodating part 26d are disposed near the first heat sinks 26i.

摘要翻译： 在齿轮壳体26的刷架容纳部26d中，成对的平面部26c和成对的弯曲部26b交替地配置成形成为椭圆形状，一对平面部中的一个形成有第一散热片26i 并且安装在容纳在电刷架容纳部26d中的电刷架单元19上的两个电刷20和20设置在第一散热器26i附近。

公开(公告)号：US20130010145A1

公开(公告)日：2013-01-10

申请号：US13530746

申请日：2012-06-22

申请人： Hiroki Hagiwara ,  Keiji Sasano ,  Hiroaki Tanaka ,  Yuki Tuji ,  Tsuyoshi Watanabe ,  Koji Tsuchiya ,  Kenzo Tanaka ,  Takaya Wada ,  Noboru Kawabata ,  Hirokazu Yoshida ,  Hironori Yokoyama

发明人： Hiroki Hagiwara ,  Keiji Sasano ,  Hiroaki Tanaka ,  Yuki Tuji ,  Tsuyoshi Watanabe ,  Koji Tsuchiya ,  Kenzo Tanaka ,  Takaya Wada ,  Noboru Kawabata ,  Hirokazu Yoshida ,  Hironori Yokoyama

IPC分类号： H04N5/225

CPC分类号： H01L27/14634 ,  H01L27/14618 ,  H01L27/14636 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H04N5/2253 ,  H04N5/369 ,  H05K1/0206 ,  H05K1/0207 ,  H05K2201/10121 ,  H01L2924/00014 ,  H01L2924/00

摘要： A solid-state image sensing apparatus includes a solid-state image sensing device, signal processing circuit device, and a multi-layer wiring package. The solid-state image sensing device has a pixel in an image sensing area thereof. The pixel receives incident light and generate a signal electric charge. The signal processing circuit device is arranged to face the image sensing area and applies signal processing to a signal output from the solid-state image sensing device. The multi-layer wiring package has wiring layers, the solid-state image sensing device, and the signal processing circuit device. Each of the wiring layers is laminated via an insulator. The multi-layer wiring package is formed such that a first wiring layer provided between the solid-state image sensing device and the signal processing circuit device has a greater thickness than second wiring layers and has heat conductivity higher than or equal to heat conductivity of the second wiring layers.

公开(公告)号：US20130001804A1

公开(公告)日：2013-01-03

申请号：US13534078

申请日：2012-06-27

申请人： YOSHIHIKO SHIMANUKI ,  Yoshihiro Suzuki ,  Koji Tsuchiya

发明人： YOSHIHIKO SHIMANUKI ,  Yoshihiro Suzuki ,  Koji Tsuchiya

IPC分类号： H01L23/48

CPC分类号： H01L24/97 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/49548 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/32014 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10162 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/351 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

摘要： There are constituted by a tab on which a semiconductor chip is mounted, a sealing portion formed by resin-sealing the semiconductor chip, a plurality of leads each having a mounted surface exposed to a peripheral portion of a rear surface of the sealing portion and a sealing-portion forming surface disposed on an opposite side thereto, and a wire for connecting a pad of the semiconductor chip and a lead, wherein the length between inner ends of the sealing-portion forming surfaces of the leads disposed so as to oppose to each other is formed to be larger than the length between inner ends of the mounted surfaces. Thereby, a chip mounting region surrounded by the inner end of the sealing-portion forming surface of each lead can be expanded and the size of the mountable chip is increased.

摘要翻译： 由安装半导体芯片的突片，通过树脂密封半导体芯片形成的密封部分，多个引线，每个引线具有暴露于密封部分的后表面的周边部分的安装表面，以及 密封部分形成表面设置在其相对侧上，以及导线，用于连接半导体芯片的焊盘和引线，其中引线的密封部分形成表面的内端之间的长度设置为与每个 另一个形成为大于安装表面的内端之间的长度。 由此，能够扩大由各引线的密封部形成面的内端包围的芯片安装区域，能够增大安装芯片的尺寸。

公开(公告)号：US08062112B2

公开(公告)日：2011-11-22

申请号：US11089761

申请日：2005-03-24

申请人： Koji Tsuchiya

发明人： Koji Tsuchiya

IPC分类号： A63F9/24

CPC分类号： A63F13/58 ,  A63F13/10 ,  A63F13/49 ,  A63F13/5375 ,  A63F13/54 ,  A63F13/822 ,  A63F2300/65 ,  A63F2300/807

摘要： In processing new damage, when a character passes a first devastating flame and drops into a next devastating flame, damage of the latter devastating flame is deemed first damage, and the “game continuity ability value” is exempted from decrement. If the character drops into a further devastating flame, such drop is not new damage, and the “game continuity ability value” is decreased by a predetermined decrement value.In processing recurrent damage, when the character passes a first devastating flame, drops into a second devastating flame and drops again into a third devastating flame, the first failure occurs at the second devastating flame, and the “game continuity ability value” is decreased by a predetermined value, and is exempted from decrement at the third devastating flame because the drop is a recurrent failure.

摘要翻译： 在处理新的伤害时，当一个角色经过第一个毁灭性的火焰并落入下一个毁灭性的火焰中时，后者的毁灭性火焰的伤害被认为是第一次伤害，“游戏连续性能力值”被免除减少。 如果角色掉入另一个毁灭性的火焰中，这种下降并不是新的伤害，而且“游戏连续性能力”值减小预定的减小值。 在处理反复伤害时，当角色经过第一个毁灭性的火焰时，会掉入第二个毁灭性的火焰，并再次落入第三个毁灭性的火焰中，第一个故障发生在第二个毁灭性的火焰处，“游戏连续性能”值被减少 一个预定的值，并且在第三个毁灭性的火焰中被免除减少，因为这个下降是一个复发的故障。

公开(公告)号：US07525184B2

公开(公告)日：2009-04-28

申请号：US10519785

申请日：2003-05-30

申请人： Yoshihiko Shimanuki ,  Yoshihiro Suzuki ,  Koji Tsuchiya

发明人： Yoshihiko Shimanuki ,  Yoshihiro Suzuki ,  Koji Tsuchiya

IPC分类号： H01L21/00 ,  H01L23/02

CPC分类号： H01L24/97 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/49548 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/32014 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10162 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/351 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

摘要： There are constituted by a tab (1b) on which a semiconductor chip (2) is mounted, a sealing portion (3) formed by resin-sealing the semiconductor chip (2), a plurality of leads (1a) each having a mounted surface (1d) exposed to a peripheral portion of a rear surface (3a) of the sealing portion (3) and a sealing-portion forming surface (1g) disposed on an opposite side thereto, and a wire (4) for connecting a pad (2a) of the semiconductor chip (2) and a lead (1a), wherein the length (M) between inner ends (1h) of the sealing-portion forming surfaces (1g) of the leads (1a) disposed so as to oppose to each other is formed to be larger than the length (L) between inner ends (1h) of the mounted surfaces (1d). Thereby, a chip mounting region surrounded by the inner end (1h) of the sealing-portion forming surface (1g) of each lead (1a) can be expanded and the size of the mountable chip is increased.

摘要翻译： 由安装有半导体芯片（2）的突片（1b），通过树脂密封半导体芯片（2）形成的密封部分（3），多个引线（1a），其具有安装表面 （1d）暴露于密封部分（3）的后表面（3a）的周边部分和设置在其相对侧上的密封部分形成表面（1g）和用于连接焊盘（4）的焊丝（4） 2a）和引线（1a）之间的长度（M），其中引线（1a）的密封部分形成表面（1g）的内端（1h）之间的长度（M）设置为与 彼此形成为大于安装面（1d）的内端（1h）之间的长度（L）。 由此，可以扩大由每个引线（1a）的密封部形成面（1g）的内端（1h）包围的芯片安装区域，并且可安装芯片的尺寸增大。

公开(公告)号：US20060017143A1

公开(公告)日：2006-01-26

申请号：US10519785

申请日：2003-05-30

申请人： Yoshihiko Shimanuki ,  Yoshihiro Suzuki ,  Koji Tsuchiya

发明人： Yoshihiko Shimanuki ,  Yoshihiro Suzuki ,  Koji Tsuchiya

IPC分类号： H01L23/02

CPC分类号： H01L24/97 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/49548 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/32014 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10162 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/351 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

摘要： There are constituted by a tab (1b) on which a semiconductor chip (2) is mounted, a sealing portion (3) formed by resin-sealing the semiconductor chip (2), a plurality of leads (1a) each having a mounted surface (1d) exposed to a peripheral portion of a rear surface (3a) of the sealing portion (3) and a sealing-portion forming surface (1g) disposed on an opposite side thereto, and a wire (4) for connecting a pad (2a) of the semiconductor chip (2) and a lead (1a), wherein the length (M) between inner ends (1h) of the sealing-portion forming surfaces (1g) of the leads (1a) disposed so as to oppose to each other is formed to be larger than the length (L) between inner ends (1h) of the mounted surfaces (1d). Thereby, a chip mounting region surrounded by the inner end (1h) of the sealing-portion forming surface (1g) of each lead (1a) can be expanded and the size of the mountable chip is increased.

摘要翻译： 由安装半导体芯片（2）的突片（1b），通过树脂密封半导体芯片（2）形成的密封部分（3）构成的多个引线（1a），每个引线 暴露于密封部分（3）的后表面（3a）的周边部分的安装表面（1d）和设置在其相对侧上的密封部分形成表面（1g）和线（4） 用于连接半导体芯片（2）的焊盘（2a）和引线（1a），其中引线的密封部分形成表面（1g）的内端（1h）之间的长度（M） （1a）形成为大于安装表面（1d）的内端（1h）之间的长度（L）。 由此，可以扩大由每个引线（1a）的密封部形成面（1g）的内端（1h）包围的芯片安装区域，并且可安装芯片的尺寸增大。