摘要:
A master slice semiconductor IC has a SOI substrate and a plurality of basic cells arranged in a matrix on the SOI substrate. The basic cell includes a two-input NAND gate and a diode forward biased between one of power supply lines and the NAND gate. The diode has a P-N junction extending between the top surface of a semiconductor layer and the insulator layer underlying the semiconductor layer. The diode reduces the supply voltage by the forward drop voltage thereof to reduce power consumption in the NAND gate, and the SOI structure of the basic cell prevents reduction of integration density and operational speed.
摘要:
In an unused unit cell of a gate array integrated semiconductor device, a P-type semiconductor region is connected to a ground potential connection and an N-type semiconductor region is connected to a positive power supply connection, thereby reversely-biasing the P-type and N-type semiconductor regions.
摘要:
Disclosed is a method for making a semiconductor integrated circuit device used to form a p-channel MOS field-effect transistor and a n-channel MOS field-effect transistor on a common SOI substrate with a structure that a first silicon layer, insulating film and a second silicon layer are layered; wherein the steps from sectioning a SOI layer as the second silicon layer by insulation separation into a plurality of active regions to forming at least one gate electrode to be laid through gate insulating film on the surface of each of the plurality of active regions are conducted with no relation to the conductivity type of MOS field-effect transistor.
摘要:
A multivalued mask ROM is configured by arranging cell transistors in a matrix form, which is defined by wiring word lines and ground lines in rows and by wiring bit lines in columns. Each of the cell transistors is encompassed by a word line, a ground line and at least two bit lines. Herein, gates of the cell transistors which align in a same row are connected with a same word line, while sources and drains of the cell transistors are adequately connected or disconnected with the ground line and bit lines. In an integrated circuit, contacts are formed between n+ regions, first-layer metal and second-layer metal on a well region to establish connections by which the source and drain of the cell transistor are adequately connected with the ground line and/or bit lines. That is, ROM codes are formed using the contacts. A circuitry is provided for the multivalued mask ROM to read out stored information of the cell transistors in synchronization with a clock signal. In Low-level duration of the clock signal, the circuitry performs precharge to a first bit line and pull-down to a second bit line. In High-level duration of the clock signal, the circuitry stops the precharge and pull-down while activating the word line to detect levels of the first and second lines, which are used as values for a two-bit code corresponding to stored information of the cell transistor.
摘要:
In a semiconductor integrated circuit, a control transistor 4 and a potential clamp circuit 9 are arranged between a power supply line 2 and a virtual power supply line 3. Even in a sleeve mode where the control transistor 4 is turned off, the potential clamp circuit 9-1 clamps the virtual power supply line 3 at a certain potential to hold a potential state (high level or low level) of each node of a logical circuit. At this time, each FET forming the logical circuit is applied with a back bias so that a threshold voltage Vt becomes higher than that in an active mode. Therefore, a leakage current can be decreased. In the semiconductor integrated circuit, the threshold voltage Vt of the control transistor 4 can be selected to be equal to that of one FET of the complementary FET forming the logical circuit. Therefore, the layout area and the number of manufacturing steps can be reduced.
摘要:
In a semiconductor device where a CMOS circuit and a bipolar circuit are mixed, the bipolar circuit is operated between a first power supply voltage and a second power supply voltage, and the CMOS circuit and a level conversion circuit between a CMOS level and a bipolar level are operated between the first power supply voltage and a third power supply voltage. The third power supply voltage is between the first and second power supply voltages.
摘要:
In a semiconductor device including a MOSFET, a first semiconductor layer is formed over a silicon substrate and has a gate region. Further, a second semiconductor layer is formed over the first semiconductor layer with a gate oxide film therebetween, and has an active region. The active region has a source region, a drain region and a channel region. An insulator layer on the active region encloses a back gate wiring layer.
摘要:
The invention provides a semiconductor integrated circuit including a substrate, and a plurality of block cells arranged on the substrate and including a plurality of basic cells. Each of the basic cells includes a plurality of CMOS transistors. At least one of the CMOS transistors is an asymmetrical one in which one of a source diffusion layer or a drain diffusion layer has a lightly doped drain (LDD) structure or a deep doped drain (DDD) structure.
摘要:
The invention includes one or more LED elements, a silicon substrate on which the LED elements are mounted via micro bumps and internally formed wiring is connected to the micro bumps, a heat insulation organic substrate which is stuck to the opposite side of the LED elements-mounting side of the silicon substrate and has through-holes in which the wiring goes through, a chip-mounting substrate which is stuck to the opposite side of the silicon substrate side of the heat insulation organic substrate and internally formed wiring is connected to wiring in the through-holes of the heat insulation organic substrate, and an LED control circuit chip which is connected to the wiring of the chip-mounting substrate via micro bumps, and mounted via the micro bumps on the opposite side of the heat insulation organic substrate side of the chip-mounting substrate.
摘要:
A semiconductor integrated circuit is disclosed which avoids operating speed degradation resulting from an increase of the gate resistance due to making the size of the device small. In a basic cell 103 comprising a group 101 of P-channel MOS transistors and a group 102 of N-channel MOS transistors, the gate width of all the MOS transistors constituting the basic cell 103 is set below 7 .mu.m, and the gate electrodes 108a, 108b, 109a, 109b are formed to surround the perimeter of source or drain diffusion areas 106a, 106c, 107a, 107c of the MOS transistors to form an electrically closed loop.