公开(公告)号：US20180348627A1

公开(公告)日：2018-12-06

申请号：US15776759

申请日：2017-01-31

申请人： LG CHEM, LTD.

发明人： Ji Young HWANG ,  Han Min SEO ,  Nam Seok BAE ,  Seung Heon LEE ,  Dong Hyun OH ,  Jungsun YOU

IPC分类号： G03F1/76 ,  G03F1/48

CPC分类号： G03F7/004 ,  G03F7/20 ,  G03F7/26 ,  H01L21/033

摘要： The present application relates to a film mask comprising: a transparent substrate; a darkened light-shielding pattern layer provided on the transparent substrate; and an embossed pattern part provided on a surface of the transparent substrate, which is provided with the darkened light-shielding pattern layer, a method for manufacturing the same, a method for forming a pattern by using the same, and a pattern formed by using the same.

公开(公告)号：US20180046017A1

公开(公告)日：2018-02-15

申请号：US15559742

申请日：2016-03-28

申请人： LG CHEM, LTD.

发明人： Ilha LEE ,  Seung Heon LEE ,  Song Ho JANG ,  Dong Hyun OH ,  Ji Young HWANG ,  Ki-Hwan KIM ,  Han Min SEO ,  Chan Hyoung PARK ,  Sun Young PARK

IPC分类号： G02F1/1335 ,  B32B15/04 ,  G02F1/1343 ,  C23C14/18 ,  C23C14/00 ,  B32B3/26 ,  C23C14/06

CPC分类号： G02F1/133502 ,  B32B3/266 ,  B32B9/04 ,  B32B15/04 ,  B32B2307/202 ,  B32B2307/416 ,  B32B2309/105 ,  C03C17/36 ,  C03C17/3605 ,  C03C17/3626 ,  C03C17/3649 ,  C03C17/3671 ,  C23C14/0036 ,  C23C14/0676 ,  C23C14/185 ,  G02F1/13338 ,  G02F1/134363 ,  G02F1/13439 ,  G06F3/041 ,  G06F3/044 ,  G06F2203/04103 ,  H01L51/5203 ,  H01L51/5281

摘要： The present specification relates to a conductive structure body, a method for manufacturing the same, and an electrode and an electronic device including the conductive structure body.

公开(公告)号：US20170225434A1

公开(公告)日：2017-08-10

申请号：US15502933

申请日：2015-08-11

申请人： LG CHEM, LTD.

发明人： Donghyun LEE ,  Seung Heon LEE ,  Jiehyun SEONG ,  Joo Yeon KIM ,  Sarah KIM ,  Jung Yeon LEE ,  Nam Seok BAE

IPC分类号： B32B15/20 ,  B32B15/02

CPC分类号： B32B15/20 ,  B32B15/02

摘要： The present specification relates to an aluminum oxide composition, a substrate including the same, and a method for manufacturing the same.

公开(公告)号：US20160278166A1

公开(公告)日：2016-09-22

申请号：US15033370

申请日：2014-11-27

申请人： LG CHEM, LTD.

发明人： Jiehyun SEONG ,  Hyeon CHOI ,  Sarah KIM ,  Seung Heon LEE

IPC分类号： H05B3/84 ,  H05B3/00 ,  H05B1/02

CPC分类号： H05B3/84 ,  H05B1/0236 ,  H05B3/0014 ,  H05B3/26 ,  H05B2203/002 ,  H05B2203/013

摘要： The present specification provides a heating element including an adhesive film; and a conductive heating pattern provided on at least one surface of the adhesive film and having a line height of 10 micrometers or less, and a method for fabricating the same.

摘要翻译： 本说明书提供了包括粘合膜的加热元件; 以及设置在粘合膜的至少一个表面上并具有10微米或更小的线高度的导电加热图案及其制造方法。

公开(公告)号：US20160271992A1

公开(公告)日：2016-09-22

申请号：US14442335

申请日：2014-08-01

申请人： LG CHEM, LTD.

发明人： Beom Mo KOO ,  Kun Seok LEE ,  Seung Heon LEE ,  Yong Goo SON ,  Jooyeon KIM

IPC分类号： B41N10/04

CPC分类号： B41N10/04 ,  B41N10/02 ,  B41N2210/04 ,  B41N2210/12 ,  B41N2210/14

摘要： Provided are a blanket for offset printing and a fine pattern manufactured by using the same.

摘要翻译： 提供了用于胶版印刷的橡皮布和使用它的精细图案。

公开(公告)号：US20210195760A1

公开(公告)日：2021-06-24

申请号：US16755540

申请日：2019-03-11

申请人： LG CHEM, LTD.

发明人： Yong Goo SON ,  Kun Seok LEE ,  Jung Ok MOON ,  Kiseok LEE ,  Seung Heon LEE

IPC分类号： H05K3/38 ,  H05K1/02

摘要： A method of manufacturing a transparent electrode substrate according to an exemplary embodiment includes: a) forming a structure including a transparent base, a bonding layer on a surface of the transparent base, and a metal foil on a surface of the bonding layer opposite the transparent base; b) forming a metal foil pattern by patterning the metal foil; c) heat-treating the structure resulting from b) at a temperature of 70° C. to 100° C.; and d) completely curing the bonding layer. Also, a transparent electrode substrate is disclosed.

公开(公告)号：US20180351194A1

公开(公告)日：2018-12-06

申请号：US15779275

申请日：2016-12-19

申请人： LG CHEM, LTD.

发明人： Kun Seok LEE ,  Jungyeon LEE ,  Seung Heon LEE ,  Sun Mi JIN ,  Hyejin KWON

IPC分类号： H01M10/04 ,  H01M2/16

摘要： The present application relates to a separator and a battery comprising the same. A separator according to an exemplary embodiment of the present application includes: a porous substrate; and a first bonding layer pattern provided on at least one surface of the porous substrate, in which each pattern constituting the first bonding layer pattern is a pattern including a second bonding layer pattern having an aperture ratio of 5% or more and 40% or less.

公开(公告)号：US20180269420A1

公开(公告)日：2018-09-20

申请号：US15758319

申请日：2016-10-26

申请人： LG CHEM, LTD.

发明人： Ilha LEE ,  Pumsuk PARK ,  Ji Young HWANG ,  Ki-Hwan KIM ,  Seung Heon LEE ,  Dong Hyun OH ,  Chan Hyoung PARK

IPC分类号： H01L51/52 ,  H01L27/32 ,  G02B5/30

CPC分类号： H01L51/5203 ,  G02B5/3025 ,  H01L27/32 ,  H01L27/3206 ,  H01L51/5281 ,  H01L51/5284

摘要： The present specification relates to an organic light emitting device.

公开(公告)号：US20180196346A1

公开(公告)日：2018-07-12

申请号：US15741993

申请日：2017-01-04

申请人： LG CHEM, LTD.

发明人： Yong Goo SON ,  Seung Heon LEE ,  Han Min SEO ,  Chang Yoon LIM ,  Ji Eun MYUNG ,  Kiseok LEE

IPC分类号： G03F7/20 ,  H05K3/00 ,  G03F7/16 ,  G03F7/32 ,  G03F7/038

CPC分类号： G03F7/2002 ,  G03F7/038 ,  G03F7/162 ,  G03F7/168 ,  G03F7/322 ,  H01L51/5212 ,  H05K1/0274 ,  H05K1/09 ,  H05K3/0011 ,  H05K3/12 ,  H05K2201/0108 ,  H05K2201/0326 ,  H05K2201/0376 ,  H05K2201/09681 ,  H05K2203/0264 ,  H05K2203/0278

摘要： The present specification relates to a manufacturing method of a circuit board. More particularly, the present specification relates to a circuit board and a manufacturing method of an electronic device including the same.

公开(公告)号：US20180188645A1

公开(公告)日：2018-07-05

申请号：US15580239

申请日：2016-07-28

申请人： LG CHEM, LTD.

发明人： Yong Goo SON ,  Seung Heon LEE

IPC分类号： G03F1/48

摘要： The present specification relates to a photomask, a laminate including the photomask, a method for manufacturing the photomask, a device for forming a pattern using the photomask, and a method for forming a pattern using the photomask.