公开(公告)号：US20230127225A1

公开(公告)日：2023-04-27

申请号：US17910275

申请日：2020-03-13

Applicant: LG ELECTRONICS INC.

Inventor： Jungsub KIM ,  Yeonhong JUNG ,  Sunghyun MOON ,  Myoungsoo KIM ,  Yoonchul KIM

IPC: H01L33/60 ,  H01L25/075 ,  H01L33/52

Abstract: The display device according to the present invention comprises: a substrate; semiconductor light-emitting diodes disposed on the substrate; a planarization layer formed so as to cover the semiconductor light-emitting diodes; and wire electrodes electrically connected to the semiconductor light-emitting diodes, wherein the substrate comprises individual pixel areas in which the semiconductor light-emitting diodes are disposed, and the individual pixel areas are each any one of first individual pixel areas, in which the semiconductor light-emitting diodes are disposed and which emit the light output by the semiconductor light-emitting diodes, and second individual pixel areas, in which a repair layer is disposed so as to emit the light output by an adjacent first individual pixel area.

公开(公告)号：US20220367774A1

公开(公告)日：2022-11-17

申请号：US17761516

申请日：2019-09-18

Applicant: LG ELECTRONICS INC.

Inventor： Myoungsoo KIM ,  Sunghyun MOON ,  Jisoo KO ,  Jungsub KIM ,  Bongchu SHIM ,  Wonjae CHANG

IPC: H01L33/62 ,  H01L25/075 ,  H01L33/00 ,  H01L33/22 ,  H01L33/44

Abstract: Discussed is a manufacturing method of a display device. The manufacturing method includes forming a semiconductor light emitting element comprising an assembly blocking layer formed on one surface of the semiconductor light emitting element; preparing an assembly substrate comprising an assembly recess and configured such that the semiconductor light emitting element is assembled in the assembly recess; putting the semiconductor light emitting element into a chamber filled with a fluid; locating the assembly substrate on an upper surface of the chamber, and assembling the semiconductor light emitting element in the assembly recess of the assembly substrate using a magnetic field and an electric field; and transferring the semiconductor light emitting element assembled in the assembly recess of the assembly substrate to a wiring substrate.

公开(公告)号：US20220277983A1

公开(公告)日：2022-09-01

申请号：US17630288

申请日：2019-08-07

Applicant: LG ELECTRONICS INC.

Inventor： Jungsub KIM ,  Yongdae KIM ,  Sunghyun MOON

IPC: H01L21/683 ,  G03F7/00

Abstract: Disclosed, in the present specification, is a transfer substrate for transferring a semiconductor light emitting device with high reliability and a method for manufacturing a display device by using same. Specifically, the transfer substrate includes an organic stamp layer having a protrusion, wherein the organic stamp layer contains a plurality of inorganic fillers, and the concentration of the inorganic fillers is formed so as to increase as the distance from the protrusion increases. Therefore, the protrusion of the organic stamp layer has a low concentration of the inorganic fillers so as to maintain sufficient adhesion for transferring the semiconductor light emitting device, and the stiffness of the organic stamp layer itself is formed so as to be much stronger than that of a stamp layer using a single organic material. Accordingly, it is possible to improve the accuracy of transfer by minimizing an arrangement error of the semiconductor light emitting device due to the deformation of the stamp layer occurring in a transfer process. Accordingly, it is possible to improve the accuracy of transfer by minimizing an arrangement error of the semiconductor light emitting device caused by the deformation of the stamp layer occurring during a transfer process.

公开(公告)号：US20210320146A1

公开(公告)日：2021-10-14

申请号：US17259084

申请日：2018-08-29

Applicant: LG ELECTRONICS INC.

Inventor： Jungsub KIM ,  Sunghyun MOON ,  Younghak CHANG ,  Jina JEON

IPC: H01L27/15 ,  H01L33/22 ,  H01L33/62 ,  H01L33/00

Abstract: A display device is discussed. The Display device includes a plurality of semiconductor light-emitting elements on a substrate, wherein the substrate includes: a base substrate; an insulating layer on the base substrate; and pads protruding farther than the insulating layer and enabling the semiconductor light-emitting elements to in contact, wherein the insulating layer includes inorganic particles, and at least a portion of some of the inorganic particles is formed so as to protrude from a surface of the insulating layer.

公开(公告)号：US20240332475A1

公开(公告)日：2024-10-03

申请号：US18697320

申请日：2021-09-30

Applicant: LG ELECTRONICS INC.

Inventor： Jungsub KIM ,  Changseo PARK ,  Gunho KIM ,  Yongil SHIN ,  Yoonchul KIM

IPC: H01L33/62 ,  H01L25/075

CPC classification number: H01L33/62 ,  H01L25/0753

Abstract: The display device includes a substrate, first assembly wiring, second assembly wiring, a partition, and first to third semiconductor light emitting devices. Each of the plurality of pixels includes first to third sub-pixels. The first to third assembly holes are located in the first to third sub-pixels. The first assembly wiring includes a first bus wiring in a plurality of pixels, and a plurality of first branch wirings branching from the first bus wiring. The second assembly wiring includes a second bus wiring in a plurality of pixels, and a plurality of second branch wirings branching from the second bus wiring. Each of the first to third semiconductor light emitting devices may be disposed in first to third assembly holes between the first bus wiring, the second bus wiring, the first branch wiring, and the second branch wiring.

公开(公告)号：US20240055412A1

公开(公告)日：2024-02-15

申请号：US18232042

申请日：2023-08-09

Applicant: LG ELECTRONICS INC.

Inventor： Myoungsoo KIM ,  Changseo PARK ,  Gunho KIM ,  Jungsub KIM

IPC: H01L25/075 ,  H01L33/38 ,  H01L33/00

CPC classification number: H01L25/0753 ,  H01L33/38 ,  H01L33/0075 ,  H01L33/0093 ,  H01L33/44

Abstract: Discussed is a semiconductor light emitting device package for a display pixel The semiconductor light emitting device package can include a first semiconductor light emitting device of a first color having a first material and a second semiconductor light emitting device of a second color having a second material disposed on the first semiconductor light emitting device. The first semiconductor light emitting device can include a first semiconductor light emitting structure having an inner recess, and a first-first electrode and first-second electrode layer electrically connected to a first side and a second side of the first semiconductor light emitting structure, respectively. The second semiconductor light emitting device can be disposed in the inner recess of the first semiconductor light emitting device.

公开(公告)号：US20240038930A1

公开(公告)日：2024-02-01

申请号：US18266081

申请日：2020-12-09

Applicant: LG ELECTRONICS INC.

Inventor： Jungsub KIM ,  Gunho KIM ,  Yoonchul KIM ,  Jisoo KO

IPC: H01L33/20 ,  H01L25/075 ,  H01L33/00

CPC classification number: H01L33/20 ,  H01L25/0753 ,  H01L33/0093

Abstract: A display device according to the present invention comprises: a wiring board including a plurality of pixel areas; and semiconductor light-emitting devices disposed in the pixel areas, wherein the pixel areas include semiconductor light-emitting devices having different shapes and emitting different colors, and wherein the wiring board has two or more pixel areas having different arrangements of the semiconductor light-emitting devices. The present invention may be used as an align key when manufacturing a display device by varying the arrangement of semiconductor light-emitting devices in some pixel areas.

公开(公告)号：US20230060259A1

公开(公告)日：2023-03-02

申请号：US17736812

申请日：2022-05-04

Applicant: LG ELECTRONICS INC.

Inventor： Myoungsoo KIM ,  Changseo PARK ,  Gunho KIM ,  Minwoo LEE ,  Jungsub KIM

IPC: H01L25/075 ,  H01L33/38

Abstract: An overlapping assembly substrate structure for semiconductor light emitting devices, includes a first assembly substrate structure and a second assembly substrate structure disposed spaced apart from each other. The first assembly substrate structure can include a first electrode and a second electrode spaced apart by a first distance and a first partition wall having a circular first assembly hole to accommodate a semiconductor light emitting device having a circular shape. Further, the second assembly substrate structure can include a third electrode and a fourth electrode spaced apart by a second distance greater than the first distance and a second partition wall having an elliptical second assembly hole to accommodate a semiconductor light emitting device having an elliptical shape.

公开(公告)号：US20230014515A1

公开(公告)日：2023-01-19

申请号：US17621399

申请日：2019-07-10

Applicant: LG ELECTRONICS INC.

Inventor： Jungsub KIM ,  Junghoon KIM ,  Changseo PARK

IPC: H01L25/075 ,  H01L33/38 ,  H01L33/00

Abstract: The present specification provides a micro LED display device which minimizes a short-circuit fault by using a semiconductor light emitting element including multiple passivation layers formed therein, and a manufacturing method thereof. In a display device using a plurality of semiconductor light emitting elements according to one embodiment of the present invention, at least one of the semiconductor light emitting elements comprises: a first conductive semiconductor layer; a second conductive semiconductor layer; an active layer; a first conductive electrode; a second conductive electrode; and a first passivation layer and a second passivation layer successively disposed to surround the lateral surfaces of the first conductive semiconductor layer and the second conductive semiconductor layer, wherein the second passivation layer is positioned in a region excluding parts in contact with a first electrode and a second electrode, on the first conductive electrode and the second conductive electrode.

公开(公告)号：US20220336423A1

公开(公告)日：2022-10-20

申请号：US17633100

申请日：2019-08-07

Applicant: LG ELECTRONICS INC.

Inventor： Jungsub KIM ,  Yongdae KIM ,  Yoonchul KIM ,  Changseo PARK ,  Jina JEON

IPC: H01L25/075 ,  H01L23/00 ,  H01L33/62

Abstract: Disclosed in the present specification are a substrate for transferring, with high reliability, a semiconductor light emitting element, and a method for manufacturing a display device by using same. Particularly, when a semiconductor light emitting element is self-assembled on an assembly substrate by using an electromagnetic field, an assembly groove in which a semiconductor light emitting element for alignment is assembled is formed in the assembly substrate. The semiconductor light emitting element for alignment, assembled in the assembly groove, is used for alignment in a step of being transferred to a final wiring substrate. Unlike conventional alignment keys, the semiconductor light emitting element for alignment reflects an alignment error of semiconductor light emitting elements that occurs during a transfer process after assembly. Therefore, when semiconductor light emitting elements are transferred to a wiring substrate on the basis of the semiconductor light emitting element for alignment, transfer accuracy can be improved.