公开(公告)号：US09799802B2

公开(公告)日：2017-10-24

申请号：US14892906

申请日：2014-05-12

Applicant: LG INNOTEK CO., LTD.

Inventor： Ha Na Kim ,  Byung Mok Kim

IPC: H01L33/48 ,  H01L33/58 ,  H01L33/50

CPC classification number: H01L33/486 ,  H01L33/502 ,  H01L33/58 ,  H01L2924/16195 ,  H01L2924/16315

Abstract: An embodiment relates to a light emitting module. A light emitting module according to an embodiment includes a light source unit including a light emitting device; a body including a lower portion on which the light source unit is arranged, a wall portion arranged on the lower portion and configured to surround the light source unit, and an upper portion arranged on the wall portion; an optical member arranged on the light source unit to transmit light from the light emitting device; and an adhesive member arranged between the wall portion of the body and the optical member to couple the body and the optical member, wherein the upper portion of the body is arranged between the light emitting device and the adhesive member.

公开(公告)号：US08754423B2

公开(公告)日：2014-06-17

申请号：US14035700

申请日：2013-09-24

Applicant: LG Innotek Co., Ltd.

Inventor： Byung Mok Kim ,  Bo Hee Kang ,  Ha Na Kim ,  Hiroshi Kodaira ,  Yuichiro Tanda ,  Satoshi Ozeki

IPC: H01L25/075 ,  H01L33/02 ,  H01L33/44

CPC classification number: H01L33/62 ,  A61L2/08 ,  A61L2/10 ,  H01L33/38 ,  H01L33/483 ,  H01L33/486 ,  H01L33/641 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15174 ,  H01L2924/00014

Abstract: Embodiments provide a light emitting device package including a package body, at least one electrode pattern placed on the package body, at least one light emitting device electrically connected to the electrode pattern, a heat dissipation member inserted into the package body to thermally come into contact with the light emitting device, and a anti-fracture layer placed on the heat dissipation member. The anti-fracture layer vertically overlaps with at least a partial peripheral region of the heat dissipation member.

Abstract translation: 实施例提供了一种发光器件封装，其包括封装体，至少一个放置在封装主体上的电极图案，至少一个电连接到电极图案的发光器件，插入封装主体中以热接触的散热构件 和发光装置，以及设置在散热构件上的抗断裂层。 抗断裂层与散热构件的至少一部分周边区域垂直重叠。

公开(公告)号：US09831406B2

公开(公告)日：2017-11-28

申请号：US14729771

申请日：2015-06-03

Applicant: LG Innotek Co., Ltd.

Inventor： Byung Mok Kim ,  Bo Hee Kang ,  Ha Na Kim ,  Hiroshi Kodaira ,  Yuichiro Tanda ,  Satoshi Ozeki

IPC: H01L33/02 ,  H01L33/48 ,  H01L33/62 ,  A61L2/08 ,  A61L2/10 ,  H01L33/38 ,  H01L33/64

CPC classification number: H01L33/62 ,  A61L2/08 ,  A61L2/10 ,  H01L33/38 ,  H01L33/483 ,  H01L33/486 ,  H01L33/641 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15174 ,  H01L2924/00014

Abstract: A light emitting device package including a package body including a first cavity and a second cavity, a pad disposed on a bottom surface of the first cavity, a light emitting device disposed on the second cavity electrically connected to the pad, a heat dissipation member inserted into the package body, the heat dissipation member including a body and expanded portions disposed at a partial edge region of the body and electrode patterns disposed at the package body, wherein the package body has an upper portion and a lower portion disposed under the upper portion, wherein the first cavity including side surfaces and a bottom surface, wherein the second cavity provided in the bottom surface of the first cavity.

公开(公告)号：US09831395B2

公开(公告)日：2017-11-28

申请号：US14978741

申请日：2015-12-22

Applicant: LG INNOTEK CO., LTD.

Inventor： Baek Jun Kim ,  Hiroshi Kodaira ,  Ki Man Kang ,  Ha Na Kim ,  Hyun Don Song ,  Jung Woo Lee ,  Jung Hun Oh

IPC: H01L33/48 ,  H01L33/58 ,  H01L33/62

CPC classification number: H01L33/486 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/16195 ,  H01L2924/16315 ,  H01L2933/0058 ,  H01L2924/00014

Abstract: A light emitting device includes a body having a cavity and a step difference structure around the cavity, a plurality of electrodes in the cavity, a light emitting chip in the cavity, a transparent window having an outer portion provided on the step difference structure to cover the cavity, and an adhesive member between the transparent window and the body. The adhesive member includes a first adhesive member between an outer bottom surface of the transparent window and a bottom of the step difference structure and a second adhesive member between the outer portion of the transparent window and the body.