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公开(公告)号：US20240413073A1
公开(公告)日：2024-12-12
申请号：US18699554
申请日：2022-09-30
Applicant: LG INNOTEK CO., LTD.
Inventor： Han Sang KIM , Bo Ra KANG , Jeong Han KIM
IPC: H01L23/498 , H01L23/00
Abstract: A circuit board according to an embodiment includes an insulating layer; and a circuit pattern layer disposed on the insulating layer, wherein the insulating layer includes a surface layer containing fluorine (F), and the circuit pattern layer is disposed on the surface layer of the insulating layer.
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公开(公告)号：US20230240008A1
公开(公告)日：2023-07-27
申请号：US18010921
申请日：2021-06-17
Applicant: LG INNOTEK CO., LTD.
Inventor： Jeong Han KIM , Yong Suk KIM , Moo Seong KIM
CPC classification number: H05K1/056 , B32B27/20 , B32B3/30 , B32B3/02 , B32B7/02 , B32B15/043 , B32B15/20 , B32B15/14 , B32B2255/06 , B32B2255/205 , B32B2255/26 , B32B2307/538 , B32B2264/1055 , B32B2264/302 , B32B2260/021 , B32B2260/046 , B32B2307/30 , B32B2307/204 , B32B2457/08
Abstract: A resin coated copper according to an embodiment includes: an insulating layer including a resin and a filler dispersed in the resin; and a copper foil layer disposed on the insulating layer, wherein the insulating layer has a plurality of pores formed on a surface in contact with the copper foil layer, and the plurality of pores have a width of 200 nm to 350 nm.
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公开(公告)号：US20180348072A1
公开(公告)日：2018-12-06
申请号：US15757526
申请日：2015-12-21
Applicant: LG INNOTEK CO., LTD.
Inventor： Bi Yi KIM , Jeong Han KIM , Hyun Gyu PARK , Won Keun CHO , In Hee CHO , Hyun Jin JO , Seung Kwon HONG
Abstract: The present invention relates to a pressure sensing element having an expanded pressure sensing section and a safety apparatus including the same. A pressure sensing element, according to an embodiment of the present invention, comprises: an intermediate layer having a structure in which at least two functional layers are stacked on each other; a first electrode layer disposed on one surface of the intermediate layer and including a plurality of first electrode patterns; and a second electrode layer disposed on an opposite surface of the intermediate layer to overlap the first electrode layer with the intermediate layer between the first and second electrode layers, wherein among the two functional layers, the first functional layer has a thickness linearly varying in a first pressure section, and the second functional layer has a thickness linearly varying in a second pressure section; the maximum pressure in the first pressure section is lower than that in the second pressure section; and the minimum pressure in the second pressure section is included in the first pressure section.
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公开(公告)号：US20170069798A1
公开(公告)日：2017-03-09
申请号：US15303445
申请日：2015-03-27
Applicant: LG Innotek Co., Ltd.
Inventor： Jeong Han KIM , Jeung Ook PARK , Sang In YOON , Hyun Gu IM
CPC classification number: H01L33/44 , H01L33/00 , H01L33/38 , H01L33/62 , H01L33/642 , H05K1/02 , H05K1/021 , H05K1/056 , H05K1/117 , H05K1/18 , H05K1/183 , H05K2201/10106 , H05K2203/049
Abstract: The present invention relates to a printed circuit board having an improved heat radiation performance, and a light-emitting device including the same. A printed circuit board according to an embodiment of the present invention comprises: a first electrode layer, a first insulation layer disposed on one surface of the first electrode layer, the first insulation layer including at least a cavity formed through a part thereof; and a second electrode layer disposed on the first insulation layer, wherein at least a part of the one surface of the first electrode layer can be exposed to the outside through the cavity.
Abstract translation: 本发明涉及具有改善的散热性能的印刷电路板，以及包括该印刷电路板的发光装置。 根据本发明实施例的印刷电路板包括：第一电极层，设置在第一电极层的一个表面上的第一绝缘层，第一绝缘层至少包括通过其一部分形成的空腔; 以及设置在所述第一绝缘层上的第二电极层，其中所述第一电极层的所述一个表面的至少一部分可以通过所述空腔暴露于外部。
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