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    PRINTED CIRCUIT BOARD AND LIGHT EMITTING DEVICE
    1.
    发明申请
    PRINTED CIRCUIT BOARD AND LIGHT EMITTING DEVICE 有权
    印刷电路板和发光装置

    公开(公告)号：US20150181691A1

    公开(公告)日：2015-06-25

    申请号：US14580491

    申请日：2014-12-23

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Sang In YOON ,  Jeong Han Kim ,  Jeung Ook Park ,  Hyun Gu IM

    IPC: H05K1/02 ,  H05K1/09 ,  H01L33/62

    CPC classification number: H05K1/0201 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/8592 ,  H05K1/05 ,  H05K1/053 ,  H05K1/056 ,  H05K1/09 ,  H05K3/243 ,  H05K2201/0338 ,  H05K2201/10106 ,  H01L2924/00014

    Abstract: A printed circuit board according to an embodiment of the present invention includes a substrate including a first metal layer, a second metal layer formed on one surface of the first metal layer, and a third metal layer formed on the other surface of the first metal layer, an insulating layer formed on the second metal layer, and a circuit pattern formed on the insulating layer. A cavity configured to accommodate a light emitting element package is formed in the insulating layer. A thermal conductivity of the first metal layer is greater than thermal conductivities of the second metal layer and the third metal layer.

    Abstract translation: 根据本发明的实施例的印刷电路板包括：第一金属层，形成在第一金属层的一个表面上的第二金属层和形成在第一金属层的另一个表面上的第三金属层的基板; 形成在第二金属层上的绝缘层和形成在绝缘层上的电路图案。 构造成容纳发光元件封装的空腔形成在绝缘层中。 第一金属层的热导率大于第二金属层和第三金属层的热导率。

    THERMOELECTRIC ELEMENT AND COOLING APPARATUS COMPRISING SAME
    2.
    发明申请
    THERMOELECTRIC ELEMENT AND COOLING APPARATUS COMPRISING SAME 审中-公开

    公开(公告)号：US20180212132A1

    公开(公告)日：2018-07-26

    申请号：US15746093

    申请日：2016-07-20

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Sang In YOON ,  Sung Chul KIM ,  Myoung Lae ROH

    IPC: H01L35/32 ,  H01L35/16

    CPC classification number: H01L35/32 ,  H01L35/02 ,  H01L35/16 ,  H01L35/18 ,  H01L35/30 ,  H01L35/34

    Abstract: The thermoelement according to one embodiment of the present invention includes: a first substrate; multiple p-type thermoelectric legs and multiple n-type thermoelectric legs, which are alternately disposed on the first substrate; a second substrate disposed on the multiple p-type thermoelectric legs and the multiple n-type thermoelectric legs; and multiple electrodes for serially connecting the multiple p-type thermoelectric legs and the multiple n-type thermoelectric legs, wherein the peak number of the n-type thermoelectric legs and that of the p-type thermoelectric legs differ in X-ray diffraction (XRD) analysis in the range of 2θ=20-60°.

    PRINTED CIRCUIT BOARD AND LIGHT-EMITTING DEVICE INCLUDING SAME
    4.
    发明申请
    PRINTED CIRCUIT BOARD AND LIGHT-EMITTING DEVICE INCLUDING SAME 有权
    印刷电路板和包括其的发光器件

    公开(公告)号：US20170069798A1

    公开(公告)日：2017-03-09

    申请号：US15303445

    申请日：2015-03-27

    Applicant: LG Innotek Co., Ltd.

    Inventor： Jeong Han KIM ,  Jeung Ook PARK ,  Sang In YOON ,  Hyun Gu IM

    IPC: H01L33/44 ,  H01L33/38 ,  H01L33/64 ,  H05K1/18 ,  H01L33/62

    CPC classification number: H01L33/44 ,  H01L33/00 ,  H01L33/38 ,  H01L33/62 ,  H01L33/642 ,  H05K1/02 ,  H05K1/021 ,  H05K1/056 ,  H05K1/117 ,  H05K1/18 ,  H05K1/183 ,  H05K2201/10106 ,  H05K2203/049

    Abstract: The present invention relates to a printed circuit board having an improved heat radiation performance, and a light-emitting device including the same. A printed circuit board according to an embodiment of the present invention comprises: a first electrode layer, a first insulation layer disposed on one surface of the first electrode layer, the first insulation layer including at least a cavity formed through a part thereof; and a second electrode layer disposed on the first insulation layer, wherein at least a part of the one surface of the first electrode layer can be exposed to the outside through the cavity.

    Abstract translation: 本发明涉及具有改善的散热性能的印刷电路板，以及包括该印刷电路板的发光装置。 根据本发明实施例的印刷电路板包括：第一电极层，设置在第一电极层的一个表面上的第一绝缘层，第一绝缘层至少包括通过其一部分形成的空腔; 以及设置在所述第一绝缘层上的第二电极层，其中所述第一电极层的所述一个表面的至少一部分可以通过所述空腔暴露于外部。

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