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    CIRCUIT BOARD
    1.
    发明申请
    CIRCUIT BOARD 有权

    公开(公告)号：US20230066269A1

    公开(公告)日：2023-03-02

    申请号：US17792768

    申请日：2021-01-13

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Min Young HWANG ,  Hyun Gu IM ,  Byeong Kyun CHOI

    IPC: H05K1/02

    Abstract: A circuit board according to an embodiment includes an insulating layer; and a via portion disposed in a via hole formed in the insulating layer; wherein the via portion includes: a first pad disposed on a lower surface of the insulating layer; a second pad disposed on an upper surface of the insulating layer; a third pad disposed in the via hole and disposed on the first pad; and a connection portion disposed in the via hole and disposed between the second pad and the third pad.

    PRINTED CIRCUIT BOARD
    2.
    发明申请
    PRINTED CIRCUIT BOARD 有权

    公开(公告)号：US20220061147A1

    公开(公告)日：2022-02-24

    申请号：US17413427

    申请日：2019-12-12

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Yong Suk KIM ,  Hyun Gu IM ,  Byeong Kyun CHOI

    IPC: H05K1/02

    Abstract: A printed circuit board according to an embodiment includes: an insulating layer; and a circuit pattern disposed on the insulating layer, wherein the circuit pattern includes an upper surface, a lower surface, a first side surface, and a second side surface, and surface roughness Ra of at least three surfaces of the upper surface, the lower surface, the first side surface, and the second side surface of the circuit pattern is 0.1 μm to 0.31 μm.

    CIRCUIT BOARD
    5.
    发明申请
    CIRCUIT BOARD 有权

    公开(公告)号：US20220132653A1

    公开(公告)日：2022-04-28

    申请号：US17310657

    申请日：2020-02-13

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Byeong Kyun CHOI ,  Min Young HWANG ,  Hyun Gu IM

    IPC: H05K1/02 ,  H05K1/03

    Abstract: A circuit board, according to an embodiment, comprises: a first insulating layer; a second insulating layer disposed on one surface of the first insulating layer; and a third insulating layer disposed on the other surface of the first insulating layer. A circuit pattern is disposed on at least one insulating layer from among the first to third insulating layers, at least one insulating layer from among the first to third insulating layers comprises glass fiber, at least one insulating layer from among the first to third insulating layers does not comprise glass fiber, and the thicknesses of the first to third insulating layers are different from each other.

    LIGHT-EMITTING DEVICE AND LIGHT-EMITTING DEVICE PACKAGE INCLUDING THE SAME
    6.
    发明申请
    LIGHT-EMITTING DEVICE AND LIGHT-EMITTING DEVICE PACKAGE INCLUDING THE SAME 审中-公开

    公开(公告)号：US20180190867A1

    公开(公告)日：2018-07-05

    申请号：US15740167

    申请日：2016-06-17

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Young Ju HAN ,  Jina GU ,  Hyun Gu IM

    IPC: H01L33/36 ,  H01L33/52 ,  H01L33/62 ,  H01L33/64

    Abstract: A light-emitting device according to an embodiment of the present invention includes a substrate; a light-emitting structure provided on the substrate, and including a first conductive type semiconductor layer, a second conductive type semiconductor layer, and an active layer provided between the first conductive type semiconductor layer and the second conductive type semiconductor layer; a first electrode provided on the light-emitting structure; a first connecting electrode provided on the first electrode; a second electrode provided on the light-emitting structure; a second connecting electrode provided on the second electrode; and a support layer provided around the first electrode, the first connecting electrode, the second electrode and the second connecting electrode. The support layer includes a first support layer having a first coefficient of thermal expansion, and a second support layer provided on the first support layer and having a second coefficient of thermal expansion.

    PRINTED CIRCUIT BOARD AND LIGHT EMITTING DEVICE
    7.
    发明申请
    PRINTED CIRCUIT BOARD AND LIGHT EMITTING DEVICE 有权
    印刷电路板和发光装置

    公开(公告)号：US20150181691A1

    公开(公告)日：2015-06-25

    申请号：US14580491

    申请日：2014-12-23

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Sang In YOON ,  Jeong Han Kim ,  Jeung Ook Park ,  Hyun Gu IM

    IPC: H05K1/02 ,  H05K1/09 ,  H01L33/62

    CPC classification number: H05K1/0201 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/8592 ,  H05K1/05 ,  H05K1/053 ,  H05K1/056 ,  H05K1/09 ,  H05K3/243 ,  H05K2201/0338 ,  H05K2201/10106 ,  H01L2924/00014

    Abstract: A printed circuit board according to an embodiment of the present invention includes a substrate including a first metal layer, a second metal layer formed on one surface of the first metal layer, and a third metal layer formed on the other surface of the first metal layer, an insulating layer formed on the second metal layer, and a circuit pattern formed on the insulating layer. A cavity configured to accommodate a light emitting element package is formed in the insulating layer. A thermal conductivity of the first metal layer is greater than thermal conductivities of the second metal layer and the third metal layer.

    Abstract translation: 根据本发明的实施例的印刷电路板包括：第一金属层，形成在第一金属层的一个表面上的第二金属层和形成在第一金属层的另一个表面上的第三金属层的基板; 形成在第二金属层上的绝缘层和形成在绝缘层上的电路图案。 构造成容纳发光元件封装的空腔形成在绝缘层中。 第一金属层的热导率大于第二金属层和第三金属层的热导率。

    CIRCUIT BOARD
    8.
    发明申请
    CIRCUIT BOARD 审中-公开

    公开(公告)号：US20200315004A1

    公开(公告)日：2020-10-01

    申请号：US16649913

    申请日：2018-09-18

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Jong Sik LEE ,  Jin A GU ,  Soo Jung YOON ,  Gyung Seok LEE ,  Hyun Gu IM

    IPC: H05K1/03 ,  H05K1/09 ,  H05K1/02 ,  H01L33/64 ,  H05K3/46 ,  C09C1/00 ,  C09C3/12 ,  C08K9/06 ,  C08K3/38

    Abstract: A circuit board according to an embodiment of the present invention comprises: a first metal layer; an insulating layer disposed on the first metal layer and comprising boron nitride agglomerate particles coated with a resin; and a second metal layer disposed on the insulating layer, wherein: one of both surfaces of the first metal layer, on which the insulating layer is disposed, is in at least partial contact with one surface of the insulating layer; one of both surfaces of the second metal layer, on which the insulating layer is disposed, is in at least partial contact with the other surface of the insulating layer; a plurality of grooves are formed on a surface which is one of both surfaces of at least one of the first metal layer and the second metal layer and which has the insulating layer disposed thereon; at least some of the particles are arranged in at least some of the plurality of grooves; the width (W) of at least one of the plurality of grooves is 1 to 1.8 times D50 of the particles; and a ratio (D/W) of the depth (D) to the width (W) of at least one of the plurality of grooves is 0.2 to 0.3.

    PRINTED CIRCUIT BOARD AND LIGHT-EMITTING DEVICE INCLUDING SAME
    10.
    发明申请
    PRINTED CIRCUIT BOARD AND LIGHT-EMITTING DEVICE INCLUDING SAME 有权
    印刷电路板和包括其的发光器件

    公开(公告)号：US20170069798A1

    公开(公告)日：2017-03-09

    申请号：US15303445

    申请日：2015-03-27

    Applicant: LG Innotek Co., Ltd.

    Inventor： Jeong Han KIM ,  Jeung Ook PARK ,  Sang In YOON ,  Hyun Gu IM

    IPC: H01L33/44 ,  H01L33/38 ,  H01L33/64 ,  H05K1/18 ,  H01L33/62

    CPC classification number: H01L33/44 ,  H01L33/00 ,  H01L33/38 ,  H01L33/62 ,  H01L33/642 ,  H05K1/02 ,  H05K1/021 ,  H05K1/056 ,  H05K1/117 ,  H05K1/18 ,  H05K1/183 ,  H05K2201/10106 ,  H05K2203/049

    Abstract: The present invention relates to a printed circuit board having an improved heat radiation performance, and a light-emitting device including the same. A printed circuit board according to an embodiment of the present invention comprises: a first electrode layer, a first insulation layer disposed on one surface of the first electrode layer, the first insulation layer including at least a cavity formed through a part thereof; and a second electrode layer disposed on the first insulation layer, wherein at least a part of the one surface of the first electrode layer can be exposed to the outside through the cavity.

    Abstract translation: 本发明涉及具有改善的散热性能的印刷电路板，以及包括该印刷电路板的发光装置。 根据本发明实施例的印刷电路板包括：第一电极层，设置在第一电极层的一个表面上的第一绝缘层，第一绝缘层至少包括通过其一部分形成的空腔; 以及设置在所述第一绝缘层上的第二电极层，其中所述第一电极层的所述一个表面的至少一部分可以通过所述空腔暴露于外部。

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