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32 条记录 (耗时 0.051 秒)

    Light emitting diodes packaged for high temperature operation
    12.
    发明授权
    Light emitting diodes packaged for high temperature operation 有权
    封装用于高温运行的发光二极管

    公开(公告)号：US07095053B2

    公开(公告)日：2006-08-22

    申请号：US10638579

    申请日：2003-08-11

    申请人： Joseph Mazzochette ,  Greg Blonder

    发明人： Joseph Mazzochette ,  Greg Blonder

    IPC分类号： H01L27/15 ,  H01L31/12 ,  H01L33/00

    CPC分类号： H01L33/647 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/642 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01012 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/19041 ,  H01L2924/00014 ,  H01L2924/00

    摘要： In accordance with the invention, an LED packaged for high temperature operation comprises a metal base including an underlying thermal connection pad and a pair of electrical connection pads, an overlying ceramic layer, and a LED die mounted overlying the metal base. The LED is thermally coupled through the metal base to the thermal connection pad, and the electrodes are electrically connected to the underlying electrical connection pads. A low thermal resistance insulating layer can electrically insulate other areas of die from the base while permitting heat passage. Heat flow can be enhanced by thermal vias to the thermal connector pad. Ceramic layers formed overlying the base can add circuitry and assist in distributing emitted light. The novel package can operate at temperatures as high as 250° C.

    摘要翻译： 根据本发明，用于高温操作的LED封装包括金属基底，其包括下面的热连接焊盘和一对电连接焊盘，上覆陶瓷层和安装在金属基底上的LED管芯。 LED通过金属基座热耦合到热连接焊盘，并且电极电连接到下面的电连接焊盘。 低热电绝缘层可以允许热通道使模具的其它区域与基座电绝缘。 可以通过热连接器垫的热通孔来增强热流。 形成在基座上方的陶瓷层可以增加电路并协助分配发射的光。 新型封装可在高达250°C的温度下工作

    Light emitting diodes packaged for high temperature operation
    15.
    发明申请
    Light emitting diodes packaged for high temperature operation 有权
    封装用于高温运行的发光二极管

    公开(公告)号：US20050029535A1

    公开(公告)日：2005-02-10

    申请号：US10933096

    申请日：2004-09-02

    申请人： Joseph Mazzochette ,  Greg Blonder

    发明人： Joseph Mazzochette ,  Greg Blonder

    IPC分类号： H01L25/075 ,  H01L33/48 ,  H01L33/64 ,  H01L33/00

    CPC分类号： H01L33/647 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/642 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01012 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/19041 ,  H01L2924/00014 ,  H01L2924/00

    摘要： In accordance with the invention, an LED packaged for high temperature operation comprises a metal base including an underlying thermal connection pad and a pair of electrical connection pads, an overlying ceramic layer, and a LED die mounted overlying the metal base. The LED is thermally coupled through the metal base to the thermal connection pad, and the electrodes are electrically connected to the underlying electrical connection pads. A low thermal resistance insulating layer can electrically insulate other areas of die from the base while permitting heat passage. Heat flow can be enhanced by thermal vias to the thermal connector pad. Ceramic layers formed overlying the base can add circuitry and assist in distributing emitted light. The novel package can operate at temperatures as high as 250° C.

    摘要翻译： 根据本发明，用于高温操作的LED封装包括金属基底，其包括下面的热连接焊盘和一对电连接焊盘，上覆陶瓷层和安装在金属基底上的LED管芯。 LED通过金属基座热耦合到热连接焊盘，并且电极电连接到下面的电连接焊盘。 低热电绝缘层可以允许热通道使模具的其它区域与基座电绝缘。 可以通过热连接器垫的热通孔来增强热流。 形成在基座上方的陶瓷层可以增加电路并协助分配发射的光。 新型封装可在高达250°C的温度下工作

    LIGHT EFFICIENT LED ASSEMBLY INCLUDING A SHAPED REFLECTIVE CAVITY AND METHOD FOR MAKING SAME
    17.
    发明申请
    LIGHT EFFICIENT LED ASSEMBLY INCLUDING A SHAPED REFLECTIVE CAVITY AND METHOD FOR MAKING SAME 有权
    有效的LED组件包括形成的反射腔及其制造方法

    公开(公告)号：US20080062701A1

    公开(公告)日：2008-03-13

    申请号：US11847033

    申请日：2007-08-29

    申请人： Shane Harrah ,  Greg Blonder

    发明人： Shane Harrah ,  Greg Blonder

    IPC分类号： F21V7/00 ,  H01J9/00

    CPC分类号： G02B6/0021 ,  G02B6/0028 ,  G02B6/0068 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A method for making an efficient light emitting diode (LED) assembly by providing a thermally conductive base having a surface cavity, disposing a reflective paste in the surface cavity, and shaping the reflective paste to form a reflective cavity. The reflective cavity is shaped such that there is a mounting region and at least one reflective side wall at least partially surrounding the mounting region. Once shaped, the reflective paste is fired to set the reflective cavity in its shaped form. Next, one or more LED die may be mounted on the mounting region of the reflective cavity such that the emitted light is reflected by the side walls, thus increasing the light output of the LED assembly.

    摘要翻译： 一种制造高效发光二极管（LED）组件的方法，该方法通过提供具有表面空腔的导热底座，将反射浆料设置在表面空腔中，以及使反射浆料成形以形成反射腔。 反射腔被成形为使得存在至少部分地围绕安装区域的安装区域和至少一个反射侧壁。 一旦成型，反光膏被烧制，以将反射腔设置成其成形形式。 接下来，一个或多个LED管芯可以安装在反射腔的安装区域上，使得发射的光被侧壁反射，从而增加LED组件的光输出。

    Polarizer films and methods of making the same
    18.
    发明申请
    Polarizer films and methods of making the same 审中-公开
    偏光片和制作相同的方法

    公开(公告)号：US20070217008A1

    公开(公告)日：2007-09-20

    申请号：US11378230

    申请日：2006-03-17

    申请人： Jian Wang ,  Greg Blonder

    发明人： Jian Wang ,  Greg Blonder

    IPC分类号： G02B5/30

    CPC分类号： G02B5/1809 ,  G02B5/3025 ,  G02B5/3058

    摘要： In general, in one aspect, the invention features methods that include forming a roll of a first material into a substrate and forming a plurality of rows of a second material on the substrate, where the second material includes a metal, the rows of the second material extend along a first direction, the rows are spaced apart from one another, and adjacent rows are spaced apart by about 400 nm or less.

    摘要翻译： 通常，一方面，本发明的特征在于，包括将第一材料的辊形成到衬底中并在衬底上形成多行第二材料的方法，其中第二材料包括金属，第二层 材料沿着第一方向延伸，所述列彼此间隔开，并且相邻的行间隔开约400nm或更小。

    LED array package with internal feedback and control
    19.
    发明申请
    LED array package with internal feedback and control 有权
    LED阵列封装，内部反馈和控制

    公开(公告)号：US20060012986A1

    公开(公告)日：2006-01-19

    申请号：US10894185

    申请日：2004-07-19

    申请人： Joseph Mazzochette ,  Greg Blonder

    发明人： Joseph Mazzochette ,  Greg Blonder

    IPC分类号： B60Q1/26

    CPC分类号： F21K9/00 ,  F21V23/005 ,  F21V23/0457 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/73265 ,  H01L2924/10155 ,  H05B33/0815 ,  H05B33/0869 ,  H01L2924/00014

    摘要： A packaged LED array for high temperature operation comprises a metal base, the metal base including an underlying thermal connection pad. One or more layers of ceramic overly the metal base. The array includes a plurality of LED die, each LED die having electrodes. And, the LED thermally coupled to the metal base. A driver circuit is electrically connected to the LED die electrodes and controls the LED array current. An LED driver is mounted within the LED array package, and thermally coupled to the metal base. In a second embodiment, one or more of the LED die can be switched from the driver to a measurement circuit and used as a photodetector to measure the light output of the LED array. The measured photodetector signal can further be used as a feedback signal to control the LED array light output.

    摘要翻译： 用于高温操作的封装的LED阵列包括金属基底，金属基底包括下面的热连接垫。 一层或多层陶瓷过金属基底。 阵列包括多个LED管芯，每个LED管芯具有电极。 而且，LED热耦合到金属基底。 驱动电路电连接到LED管芯电极并控制LED阵列电流。 LED驱动器安装在LED阵列封装内，并且热耦合到金属基座。 在第二实施例中，一个或多个LED管芯可以从驱动器切换到测量电路，并且用作光电检测器以测量LED阵列的光输出。 所测量的光电检测器信号可进一步用作反馈信号以控制LED阵列光输出。