Technique for processing a substrate
    12.
    发明授权
    Technique for processing a substrate 失效
    加工基材的技术

    公开(公告)号:US08685846B2

    公开(公告)日:2014-04-01

    申请号:US12695729

    申请日:2010-01-28

    IPC分类号: H01L21/425

    摘要: An improved technique for processing a substrate is disclosed. In one particular exemplary embodiment, the technique may be realized as a method for processing a substrate. The method may comprise ion implanting a substrate disposed downstream of the ion source with ions generated in an ion source; and disposing a first portion of a mask in front of the substrate to expose the first portion of the mask to the ions, the mask being supported by the first and second mask holders, the mask further comprising a second portion wound in the first mask holder.

    摘要翻译: 公开了一种用于处理衬底的改进技术。 在一个特定的示例性实施例中,该技术可以被实现为用于处理衬底的方法。 该方法可以包括离子注入在离子源的下游设置的离子,其离子在离子源中产生; 以及将掩模的第一部分设置在所述基板的前面以将所述掩模的所述第一部分暴露于所述离子,所述掩模由所述第一和第二掩模保持器支撑,所述掩模还包括缠绕在所述第一掩模保持器中的第二部分 。

    TECHNIQUES FOR PROCESSING A SUBSTRATE
    16.
    发明申请
    TECHNIQUES FOR PROCESSING A SUBSTRATE 有权
    加工基材的技术

    公开(公告)号:US20100297782A1

    公开(公告)日:2010-11-25

    申请号:US12783873

    申请日:2010-05-20

    IPC分类号: H01L21/66 H01L21/426

    摘要: Herein, an improved technique for processing a substrate is disclosed. In one particular exemplary embodiment, the technique may be realized with a system for processing one or more substrates. The system may comprise an ion source for generating ions of desired species, the ions generated from the ion source being directed toward the one or more substrates along an ion beam path; a substrate support for supporting the one or more substrates; a mask disposed between the ion source and the substrate support, the mask comprising a finger defining one or more apertures through which a portion of the ions traveling along the ion beam path pass; and a first detector for detecting ions, the first detector being fixedly positioned relative to the one or more substrates.

    摘要翻译: 本文中公开了一种用于处理衬底的改进技术。 在一个特定的示例性实施例中,该技术可以用用于处理一个或多个基板的系统来实现。 该系统可以包括用于产生所需物质的离子的离子源,从离子源产生的离子沿离子束路指向一个或多个衬底; 用于支撑所述一个或多个基板的基板支撑件; 设置在所述离子源和所述衬底支撑件之间的掩模,所述掩模包括限定一个或多个孔的手指,所述离子沿所述离子束路径行进的一部分穿过所述孔; 以及用于检测离子的第一检测器,所述第一检测器相对于所述一个或多个基板固定地定位。

    PLATEN CLEANING
    17.
    发明申请
    PLATEN CLEANING 审中-公开
    板清洁

    公开(公告)号:US20120017938A1

    公开(公告)日:2012-01-26

    申请号:US13187078

    申请日:2011-07-20

    IPC分类号: B08B1/00

    摘要: To achieve cost efficiency, solar cells must be processed at a high throughput. Breakages, which may leave debris on the clamping surface of the platen, adversely affect this throughput. A plurality of embodiments are disclosed which may be used to remove debris from the clamping surface without breaking the vacuum condition within the processing station. In some embodiments, a brush is used to sweep the debris from the surface of the platen. In other embodiments, an adhesive material is used to collect the debris. In some embodiments, the automation equipment used to handle masks may also be used to handle the platen cleaning mechanisms. In still other embodiments, stream of gas or ion beams are used to clean debris from the clamping surface of the platen.

    摘要翻译: 为了实现成本效益,必须以高产量处理太阳能电池。 碎片可能会使碎片在压板的夹紧表面上产生不利影响。 公开了多个实施例,其可以用于从夹紧表面去除碎屑而不破坏处理站内的真空状况。 在一些实施例中,刷子用于从压板的表面扫掠碎屑。 在其他实施例中,使用粘合剂材料来收集碎屑。 在一些实施例中,用于处理掩模的自动化设备也可用于处理压板清洁机构。 在其它实施例中,气流或离子束用于从压板的夹紧表面清洁碎屑。

    Aligning successive implants with a soft mask
    18.
    发明授权
    Aligning successive implants with a soft mask 有权
    将连续的植入物与柔软的面罩对齐

    公开(公告)号:US08921149B2

    公开(公告)日:2014-12-30

    申请号:US13034354

    申请日:2011-02-24

    摘要: A first species selectively dopes a workpiece to form a first doped region. In one embodiment, a selective implant is performed using a mask with apertures. A soft mask is applied to the first doped region. A second species is implanted into the workpiece to form a second implanted region. The soft mask blocks a portion of the second species. Then the soft mask is removed. The first species and second species may be opposite conductivities such that one is p-type and the other is n-type.

    摘要翻译: 第一种类选择性地掺杂工件以形成第一掺杂区域。 在一个实施例中,使用具有孔的掩模进行选择性植入。 软掩模被施加到第一掺杂区域。 将第二物质植入工件以形成第二注入区域。 软掩模阻挡了第二种物质的一部分。 然后去除软面膜。 第一种和第二种可能是相反的电导率,一个是p型,另一个是n型。