公开(公告)号：US20120201994A1

公开(公告)日：2012-08-09

申请号：US13498211

申请日：2010-09-30

Applicant: Manfred Michalk

Inventor： Manfred Michalk

IPC: B32B3/08 ,  B32B7/02 ,  B32B38/04 ,  B32B37/10 ,  B32B38/00

CPC classification number: G06K19/07745 ,  G06K19/07718 ,  G06K19/07728 ,  G06K19/07749 ,  G06K19/0775 ,  H01L2224/48091 ,  H01L2224/48227 ,  Y10T156/1062 ,  Y10T428/23 ,  H01L2924/00014

Abstract: The present invention relates to a method for producing a functional laminate (14), wherein the method comprises the following steps: providing at least one thermoplastic film as the substrate layer (8), producing at least one aperture (9) in the substrate layer (8), inserting at least one functional component (1) into the aperture (9), laminating the substrate layer (8) with at least one additional plastic film as the cover layer (10, 10.1, 10.2) by applying pressure and supplying heat. A soft, elastic and temperature-resistant embedding material is disposed such that the functional component (1) is surrounded by the embedding material at least in the substrate layer (8), said embedding material having a thermal expansion coefficient that is at least as large as a thermal expansion coefficient of the material of the substrate layer (8), wherein the shrinkage behavior of the embedding material and of the material of the substrate layer (8) is similar or the same.

Abstract translation: 本发明涉及一种制备功能层压板（14）的方法，其中该方法包括以下步骤：提供至少一种热塑性薄膜作为基底层（8），在基底层中产生至少一个孔（9） （8），将至少一个功能部件（1）插入到所述孔（9）中，通过施加压力和供给来将所述基底层（8）与至少一个额外的塑料膜层压作为覆盖层（10,10.1,10.2） 热。 设置柔软，耐弹性和耐温的包埋材料，使得至少在基材层（8）中，功能组分（1）被包埋材料包围，所述嵌入材料的热膨胀系数至少等于 作为基材层（8）的材料的热膨胀系数，其中包埋材料和基材层（8）的材料的收缩行为相似或相同。

公开(公告)号：US20080131669A1

公开(公告)日：2008-06-05

申请号：US11870969

申请日：2007-10-11

Applicant: Manfred Michalk

Inventor： Manfred Michalk

IPC: B32B3/10 ,  B32B27/14

CPC classification number: B42D25/45 ,  B32B27/12 ,  B42D25/00 ,  B42D25/29 ,  B42D2033/46 ,  G06K19/07722 ,  G06K19/07728 ,  G06K19/07749 ,  Y10T428/2481 ,  Y10T428/26 ,  Y10T428/27 ,  Y10T442/20 ,  Y10T442/2738 ,  Y10T442/2746 ,  Y10T442/2754 ,  Y10T442/674

Abstract: The transponder with an electronic unit comprising an antenna coil (4) connected to a chip module (5) embedded in a multi-layer laminate support (1) comprises at least one flexible thermoplastic layer (2) disposed on both sides of the electronic unit wherein the multi-layer laminate support further comprises a non-woven foil (3) with a grammage of less than 25 g/m2.

Abstract translation: 具有电子单元的应答器包括连接到嵌入多层层压支架（1）中的芯片模块（5）的天线线圈（4），包括设置在电子单元两侧的至少一个柔性热塑性层（2） 其中所述多层层压体支撑件还包括具有小于25g / m 2的克重的无纺布箔（3）。

公开(公告)号：US20070163992A1

公开(公告)日：2007-07-19

申请号：US10570256

申请日：2004-08-28

Applicant: Martin Michalk ,  Manfred Michalk ,  Sabine Nieland

Inventor： Martin Michalk ,  Manfred Michalk ,  Sabine Nieland

IPC: C23F1/00 ,  B23P15/00 ,  C03C15/00 ,  B44C1/22 ,  B31D3/00 ,  C09J5/00 ,  B32B37/12

CPC classification number: H01L21/563 ,  H01L21/67144 ,  H01L21/6835 ,  H01L23/49855 ,  H01L24/28 ,  H01L24/32 ,  H01L24/81 ,  H01L24/97 ,  H01L2221/68318 ,  H01L2221/68354 ,  H01L2224/16 ,  H01L2224/27013 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/83051 ,  H01L2224/83102 ,  H01L2224/83385 ,  H01L2224/83951 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/01061 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15151 ,  H01L2924/18161 ,  Y10T156/1702 ,  H01L2224/81 ,  H01L2924/00

Abstract: The invention relates to a method and device that make it possible to increase the productivity of the chip bonding and the before and after working steps associated with the chip bonding. To this end, the invention provides a method for contacting semiconductor chips (3) on a metallic substrate (16), whereby an etch resist (27) is located at least on one substrate side, and semiconductor chips (3) are contacted on the contacting side (30) by means of flip-chip bonding processes, during which a contacting region (7) is created on the contacting side (30) of the substrate (16). A semiconductor chip (3) having two contact bumps (6) is contacted on said contacting region in such a manner that: a contact bump (6) is contacted on both sides of a structure line (35) or of a structure trench (13) dividing the contacting region (7), and; after the contacting, an underfilling of the chip (3) ensues after which an electrically insulating passage (14) is made in the contacting region (7), and a module (32), which supports the semiconductor chip (3), is removed from the substrate (16).

Abstract translation: 本发明涉及一种能够提高芯片接合的生产率和与芯片接合相关的前后工作步骤的方法和装置。 为此，本发明提供了一种用于使金属衬底（16）上的半导体芯片（3）接触的方法，其中抗蚀剂（27）至少位于一个衬底侧上，半导体芯片（3）在 通过倒装芯片接合工艺在接触侧（30）处形成接触区域（7），所述接触区域（7）在基板（16）的接触侧（30）上形成。 具有两个接触凸块（6）的半导体芯片（3）以这样的方式接触所述接触区域：接触凸块（6）在结构线（35）或结构沟槽（13）的两侧接触 ）分隔接触区域（7），和 在接触之后，随后将芯片（3）的底部填充物接着在接触区域（7）中形成电绝缘通道（14），并且移除支撑半导体芯片（3）的模块（32） 从基板（16）。

公开(公告)号：US09044925B2

公开(公告)日：2015-06-02

申请号：US13257436

申请日：2010-03-19

Applicant: Manfred Michalk

Inventor： Manfred Michalk

IPC: B32B37/00 ,  B32B37/06 ,  B32B3/30 ,  B32B37/08 ,  B32B37/10 ,  B32B38/00

CPC classification number: B32B37/06 ,  B32B3/30 ,  B32B27/08 ,  B32B27/365 ,  B32B37/08 ,  B32B37/10 ,  B32B38/004 ,  B32B2250/244 ,  B32B2305/342 ,  B32B2305/347 ,  B32B2307/308 ,  B32B2307/736 ,  B32B2425/00 ,  B32B2519/00 ,  Y10T428/24612

Abstract: The invention relates to a device (14) for laminating a film-tape-like multilayer thermoplastic film arrangement (1), according to the invention comprising heatable press plates (8.1, 8.2) and cooling surfaces (10), wherein a width of said press plates (8.1, 8.2) and cooling surfaces (10) is greater than or equal to a width of the film arrangement (1), wherein the film arrangement (1) is arranged in the position thereof relative to the press plates (8.1, 8.2) such that press plate edges (20) lie at the grid center (5.1) and the cooling surfaces (10) are arranged with a distance up to 3 mm next to a press plate edge (20) and beginning in the same grid (5), wherein a length of the cooling surfaces (10) is greater than or equal to a length of the press plates (8.1, 8.2), wherein one press plate (8.1, 8.2) and one cooling surface (10) are respectively arranged on both sides of the film arrangement (1), wherein the press plates (8.1, 8.2) are fastened to press plate holding blocks (15) that can be moved or are supported by first press tables (19.1), and wherein the cooling surfaces (10) are part of cooling blocks (16) that can be moved or are supported by second press tables (19.2). The invention further relates to a multi-layer thermoplastic laminated film arrangement (1) and to a method for laminating a film-tape-like multilayer thermoplastic film arrangement (1).

Abstract translation: 本发明涉及一种用于层压根据本发明的薄膜带状多层热塑性薄膜装置（1）的装置（14），其包括可加热压板（8.1,8.2）和冷却表面（10），其中所述 压板（8.1,8.2）和冷却表面（10）大于或等于胶片装置（1）的宽度，其中胶片装置（1）相对于压板（8.1， 8.2），使得压板边缘（20）位于格栅中心（5.1）处，并且冷却表面（10）在压板边缘（20）旁边距离高达3毫米的距离设置，并从相同的网格开始 5），其中冷却表面（10）的长度大于或等于压板（8.1,8.2）的长度，其中一个压板（8.1,8.2）和一个冷却表面（10）分别布置 在薄膜装置（1）的两侧上，其中压板（8.1,8.2）紧固到压板固定块（15）上， 可以由第一压力表（19.1）移动或支撑，并且其中冷却表面（10）是能够移动或由第二压力表（19.2）支撑的冷却块（16）的一部分。 本发明还涉及多层热塑性层压膜装置（1）和层叠薄膜带状多层热塑性薄膜装置（1）的方法。

公开(公告)号：US07967213B2

公开(公告)日：2011-06-28

申请号：US10598788

申请日：2005-03-11

Applicant: Manfred Michalk

Inventor： Manfred Michalk

IPC: G06K19/07

CPC classification number: G06K19/07749 ,  B42D25/24 ,  B42D25/305 ,  G06K19/02 ,  G06K19/041 ,  G06K19/07728 ,  G06K19/07745 ,  H01L2924/0002 ,  H05K3/281 ,  H01L2924/00

Abstract: The invention relates to a flat transponder having an electronic circuit which is arranged in a layer or in a layer composite and which contains at least one chip and conductor tracks or conductor wires, and also to a method for the production thereof. The invention is based on the object of specifying a transponder of the type mentioned at the beginning and a method for the production thereof which is flexible, has the most uniform thickness possible and can be bonded to further elements by means of water-based adhesives, its electronic components largely being protected against damage by bending and against being detected by feel. According to the invention, the object is achieved by a transponder in which the circuit is arranged in or on a circuit carrier (7) made of plastic, on whose two larger opposite outer surfaces a paper layer (6) applied by lamination is in each case applied.

Abstract translation: 本发明涉及一种具有电子电路的扁平应答器，该电子电路布置在层或复合层中，并且包含至少一个芯片和导体轨道或导线，以及其制造方法。 本发明的目的是确定一开始所提到的类型的应答器及其制造方法，该方法是柔性的，其厚度可以是最均匀的，并且可以通过水基粘合剂与其它元件结合， 其电子部件在很大程度上受到保护，不受弯曲的损害，也不受感觉的检测。 根据本发明，该目的是通过应答器实现的，其中电路布置在由塑料制成的电路载体（7）中或其上，其中两个较大的相对的外表面上通过层压施加的纸层（6） 应用案例

公开(公告)号：US07915739B2

公开(公告)日：2011-03-29

申请号：US11816375

申请日：2006-02-17

Applicant: Manfred Michalk ,  Sabine Nieland ,  Martin Michalk

Inventor： Manfred Michalk ,  Sabine Nieland ,  Martin Michalk

IPC: H01L23/48

CPC classification number: H01L21/563 ,  H01L23/13 ,  H01L23/142 ,  H01L24/32 ,  H01L24/81 ,  H01L24/97 ,  H01L2224/13144 ,  H01L2224/16245 ,  H01L2224/27013 ,  H01L2224/40 ,  H01L2224/73203 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83051 ,  H01L2224/83385 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01061 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2924/01027 ,  H01L2924/3512 ,  H01L2924/00

Abstract: The method comprises the following steps: the substrate in the form of a one-piece basic substrate (4) is prepatterned into regions corresponding to future modules, pads of the semiconductor chip (1) are then contact-connected in predetermined regions of a first area of the basic substrate (4) and on the top side (12) of the prepatterned basic substrate (4) and on one area side of the semiconductor chip (1) a first adhesive layer (16) is applied, a second adhesive layer (17) is subsequently applied to the other area side of the semiconductor chip (1), and a curing of the adhesive layers (16, 17) and a final patterning of the metallic basic substrate (4) are then effected.

Abstract translation: 该方法包括以下步骤：以单片式基板（4）的形式将基板预先图形化为与未来模块对应的区域，然后将半导体芯片（1）的焊盘接触连接在第一 基底基板（4）的面积和预制图案化基底基板（4）的顶面（12）和半导体芯片（1）的一个区域侧上施加第一粘合层（16），第二粘合层 （17）随后被施加到半导体芯片（1）的另一个区域侧，然后实现粘合剂层（16,17）的固化和金属基底（4）的最终图案化。

公开(公告)号：US07727861B2

公开(公告)日：2010-06-01

申请号：US10570256

申请日：2004-08-28

Applicant: Martin Michalk ,  Manfred Michalk ,  Sabine Nieland

Inventor： Martin Michalk ,  Manfred Michalk ,  Sabine Nieland

IPC: H01L21/00

CPC classification number: H01L21/563 ,  H01L21/67144 ,  H01L21/6835 ,  H01L23/49855 ,  H01L24/28 ,  H01L24/32 ,  H01L24/81 ,  H01L24/97 ,  H01L2221/68318 ,  H01L2221/68354 ,  H01L2224/16 ,  H01L2224/27013 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/83051 ,  H01L2224/83102 ,  H01L2224/83385 ,  H01L2224/83951 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/01061 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15151 ,  H01L2924/18161 ,  Y10T156/1702 ,  H01L2224/81 ,  H01L2924/00

Abstract: The invention relates to a method and device that make it possible to increase the productivity of the chip bonding and the before and after working steps associated with the chip bonding. To this end, the invention provides a method for contacting semiconductor chips (3) on a metallic substrate (16), whereby an etch resist (27) is located at least on one substrate side, and semiconductor chips (3) are contacted on the contacting side (30) by means of flip-chip bonding processes, during which a contacting region (7) is created on the contacting side (30) of the substrate (16). A semiconductor chip (3) having two contact bumps (6) is contacted on said contacting region in such a manner that: a contact bump (6) is contacted on both sides of a structure line (35) or of a structure trench (13) dividing the contacting region (7), and; after the contacting, an underfilling of the chip (3) ensues after which an electrically insulating passage (14) is made in the contacting region (7), and a module (32), which supports the semiconductor chip (3), is removed from the substrate (16).

Abstract translation: 本发明涉及一种能够提高芯片接合的生产率和与芯片接合相关的前后工作步骤的方法和装置。 为此，本发明提供了一种用于使金属衬底（16）上的半导体芯片（3）接触的方法，其中抗蚀剂（27）至少位于一个衬底侧上，半导体芯片（3）在 通过倒装芯片接合工艺在接触侧（30）处形成接触区域（7），所述接触区域（7）在基板（16）的接触侧（30）上形成。 具有两个接触凸块（6）的半导体芯片（3）以这样的方式接触所述接触区域：接触凸块（6）在结构线（35）或结构沟槽（13）的两侧接触 ）分隔接触区域（7），和 在接触之后，随后将芯片（3）的底部填充物接着在接触区域（7）中形成电绝缘通道（14），并且移除支撑半导体芯片（3）的模块（32） 从基板（16）。

公开(公告)号：US20080258873A1

公开(公告)日：2008-10-23

申请号：US11948774

申请日：2007-11-30

Applicant: Manfred Michalk ,  Kay Hirschfeld

Inventor： Manfred Michalk ,  Kay Hirschfeld

IPC: H04Q5/22 ,  B32B3/26 ,  H05K1/16

CPC classification number: H05K3/103 ,  H05K1/0366 ,  H05K1/182 ,  H05K2201/0293 ,  H05K2201/10287 ,  Y10T428/249953 ,  Y10T428/249986

Abstract: The invention refers to a functional laminate including at least one electrically conductive component, particularly an antenna coil or a track, arranged on a non-woven substrate with a grammage of less than 25 g/m2.

Abstract translation: 本发明涉及一种功能性层压体，其包括布置在无纺基材上的至少一种导电组分，特别是天线线圈或轨道，其克重小于25g / m 2。

公开(公告)号：US20070278315A1

公开(公告)日：2007-12-06

申请号：US10598788

申请日：2005-03-11

Applicant: Manfred Michalk

Inventor： Manfred Michalk

IPC: G06K19/077

CPC classification number: G06K19/07749 ,  B42D25/24 ,  B42D25/305 ,  G06K19/02 ,  G06K19/041 ,  G06K19/07728 ,  G06K19/07745 ,  H01L2924/0002 ,  H05K3/281 ,  H01L2924/00

Abstract: The invention relates to a flat transponder having an electronic circuit which is arranged in a layer or in a layer composite and which contains at least one chip and conductor tracks or conductor wires, and also to a method for the production thereof. The invention is based on the object of specifying a transponder of the type mentioned at the beginning and a method for the production thereof which is flexible, has the most uniform thickness possible and can be bonded to further elements by means of water-based adhesives, its electronic components largely being protected against damage by bending and against being detected by feel. According to the invention, the object is achieved by a transponder in which the circuit is arranged in or on a circuit carrier (7) made of plastic, on whose two larger opposite outer surfaces a paper layer (6) applied by lamination is in each case applied.

Abstract translation: 本发明涉及一种具有电子电路的扁平应答器，该电子电路布置在层或复合层中，并且包含至少一个芯片和导体轨道或导线，以及其制造方法。 本发明的目的是确定一开始所提到的类型的应答器及其制造方法，该方法是柔性的，其厚度可以是最均匀的，并且可以通过水基粘合剂与其它元件结合， 其电子部件大部分受到保护，不受弯曲的损伤，并且不受感觉的检测。 根据本发明，该目的是通过应答器实现的，其中电路布置在由塑料制成的电路载体（7）中或其上，其中两个较大的相对的外表面上通过层压施加的纸层（6） 应用案例