公开(公告)号：US07012320B2

公开(公告)日：2006-03-14

申请号：US09785486

申请日：2001-02-20

申请人： Shinji Takeda ,  Takashi Masuko ,  Masami Yusa ,  Tooru Kikuchi ,  Yasuo Miyadera ,  Iwao Maekawa ,  Mitsuo Yamasaki ,  Akira Kageyama ,  Aizou Kaneda

发明人： Shinji Takeda ,  Takashi Masuko ,  Masami Yusa ,  Tooru Kikuchi ,  Yasuo Miyadera ,  Iwao Maekawa ,  Mitsuo Yamasaki ,  Akira Kageyama ,  Aizou Kaneda

IPC分类号： H01L23/495

CPC分类号： H01L24/27 ,  H01L23/49513 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/743 ,  H01L24/83 ,  H01L2224/05599 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83805 ,  H01L2224/8385 ,  H01L2224/85399 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/01014 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2924/3512 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.

公开(公告)号：US06855579B2

公开(公告)日：2005-02-15

申请号：US09785436

申请日：2001-02-20

申请人： Shinji Takeda ,  Takashi Masuko ,  Masami Yusa ,  Tooru Kikuchi ,  Yasuo Miyadera ,  Iwao Maekawa ,  Mitsuo Yamasaki ,  Akira Kageyama ,  Aizou Kaneda

发明人： Shinji Takeda ,  Takashi Masuko ,  Masami Yusa ,  Tooru Kikuchi ,  Yasuo Miyadera ,  Iwao Maekawa ,  Mitsuo Yamasaki ,  Akira Kageyama ,  Aizou Kaneda

IPC分类号： H01L21/52 ,  H01L21/58 ,  H01L23/495 ,  H01L21/48

CPC分类号： H01L24/27 ,  H01L23/49513 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/743 ,  H01L24/83 ,  H01L24/97 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83805 ,  H01L2224/8385 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/181 ,  Y10T428/28 ,  H01L2924/00 ,  H01L2924/01014 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

摘要： A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.

摘要翻译： 将半导体芯片与吸水率为1.5体积％以下的薄膜状有机芯片接合材料贴合在引线框架上; 具有1.0体积％以下的饱和吸湿性，在250℃的温度下具有不大于3.0重量％的残留挥发组分，弹性模量为10MPa以下。半导体装置 这样获得的半导体器件的封装的回流焊接期间不会发生回流裂纹。

公开(公告)号：US07387914B2

公开(公告)日：2008-06-17

申请号：US11379921

申请日：2006-04-24

申请人： Shinji Takeda ,  Takashi Masuko ,  Masami Yusa ,  Tooru Kikuchi ,  Yasuo Miyadera ,  Iwao Maekawa ,  Mitsuo Yamasaki ,  Akira Kageyama ,  Aizou Kaneda

发明人： Shinji Takeda ,  Takashi Masuko ,  Masami Yusa ,  Tooru Kikuchi ,  Yasuo Miyadera ,  Iwao Maekawa ,  Mitsuo Yamasaki ,  Akira Kageyama ,  Aizou Kaneda

IPC分类号： H01L21/48 ,  H01L21/50

CPC分类号： H01L24/27 ,  H01L23/49513 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/743 ,  H01L24/83 ,  H01L24/97 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83805 ,  H01L2224/8385 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/181 ,  Y10T428/28 ,  H01L2924/00 ,  H01L2924/01014 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

摘要： A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.

摘要翻译： 将半导体芯片与吸水率为1.5体积％以下的薄膜状有机芯片接合材料贴合在引线框架上; 具有1.0体积％以下的饱和吸湿性，在250℃的温度下具有不大于3.0重量％的残留挥发组分，弹性模量为10MPa以下。半导体装置 这样获得的半导体器件的封装的回流焊接期间不会发生回流裂纹。

公开(公告)号：US5270438A

公开(公告)日：1993-12-14

申请号：US679940

申请日：1991-04-03

申请人： Masami Yusa ,  Shinji Takeda ,  Yasuo Miyadera

发明人： Masami Yusa ,  Shinji Takeda ,  Yasuo Miyadera

IPC分类号： C08G73/10 ,  C08G69/26 ,  C08G8/02

CPC分类号： C08G73/1039 ,  C08G73/1007

摘要： A fluorine-containing polyimide having a low dielectric constant, low water absorption and excellent heat resistance and moisture resistance and a precursor thereof such as a fluorine-containing polyamide-acid, can be prepared by reacting an acid anhydride with an aromatic diamine having perfluoroalkyl group.

公开(公告)号：US5243019A

公开(公告)日：1993-09-07

申请号：US674604

申请日：1991-03-25

申请人： Shinji Takeda ,  Masami Yusa ,  Yasuo Miyadera

发明人： Shinji Takeda ,  Masami Yusa ,  Yasuo Miyadera

IPC分类号： C08G69/26 ,  C08G69/32 ,  C08G69/40 ,  C08G69/42

CPC分类号： C08G69/265 ,  C08G69/32 ,  C08G69/40

摘要： A fluorine-containing aromatic polyamide obtained by reacting an aromatic dicarboxylic acid having a perfluoroalkenyloxy group with a diamine is excellent in water repellency, water resistance, heat resistance, etc.

摘要翻译： 通过使具有全氟链烯氧基的芳香族二羧酸与二胺反应而得到的含氟芳香族聚酰胺的斥水性，耐水性，耐热性等优异。

公开(公告)号：US5401878A

公开(公告)日：1995-03-28

申请号：US114361

申请日：1993-09-01

申请人： Masami Yusa ,  Shinji Takeda ,  Yasuo Miyadera

发明人： Masami Yusa ,  Shinji Takeda ,  Yasuo Miyadera

IPC分类号： C08G73/10 ,  C07C217/84 ,  C07C271/28

CPC分类号： C08G73/1039 ,  C08G73/1007

摘要： A fluorine-containing polyimide having a low dielectric constant, low water absorption and excellent heat resistance and moisture resistance and a precursor thereof such as a fluorine-containing polyamide-acid, can be prepared by reacting an acid anhydride with an aromatic diamine having perfluoroalkyl group.

摘要翻译： 具有低介电常数，低吸水性和优异的耐热性和耐湿性的含氟聚酰亚胺及其前体如含氟聚酰胺酸可以通过使酸酐与具有全氟烷基的芳族二胺反应来制备 。

公开(公告)号：US07258918B2

公开(公告)日：2007-08-21

申请号：US10345166

申请日：2003-01-16

申请人： Isao Tsukagoshi ,  Yasushi Gotou ,  Masami Yusa ,  Yasuo Miyadera

发明人： Isao Tsukagoshi ,  Yasushi Gotou ,  Masami Yusa ,  Yasuo Miyadera

IPC分类号： B32B7/12

CPC分类号： H05K3/323 ,  B32B7/12 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/83851 ,  H05K3/305 ,  H05K3/321 ,  H05K3/325 ,  H05K2201/0329 ,  H05K2201/10977 ,  H05K2203/0278 ,  H05K2203/1189 ,  Y10T428/12569 ,  Y10T428/2852 ,  Y10T428/287 ,  Y10T428/2891

摘要： An adhesive film including a reactive adhesive capable of curing by heating or light irradiation and a polyphthalide represented by the formula I: wherein R represents a divalent aromatic hydrocarbon group or a divalent heteroring-containing aromatic group, R1 represents an alkyl group, a Fluorinated alkyl group, an alkoxy group or a halogen atom, where the number of R1 is 0 to 4, X represents O or N—R3, provided that R3 represents one of the following groups, Y represents SO2 or CO and n represents a number of repeating units in the polymer. The adhesive film can be used to connect, e.g., electrodes of a semiconductor chip to electrodes of a wiring board. The polyphthalide can be used to surface-treat, e.g., electrodes of a wiring board.

摘要翻译： 一种粘合膜，其包括能够通过加热或光照射固化的反应性粘合剂和由式I表示的多苯酞：其中R表示二价芳族烃基或含二价杂环的芳族基团，R 1， 表示R 1的数为0〜4的烷基，氟化烷基，烷氧基或卤素原子，X表示O或NR 3， 条件是R 3表示以下基团之一，Y表示SO 2或CO，n表示聚合物中的重复单元数。 粘合膜可用于将例如半导体芯片的电极连接到布线板的电极。 多苯酞可用于表面处理例如布线板的电极。

公开(公告)号：US20060263599A1

公开(公告)日：2006-11-23

申请号：US11494708

申请日：2006-07-28

申请人： Isao Tsukagoshi ,  Yasushi Gotou ,  Masami Yusa ,  Yasuo Miyadera

发明人： Isao Tsukagoshi ,  Yasushi Gotou ,  Masami Yusa ,  Yasuo Miyadera

IPC分类号： B32B7/12

CPC分类号： H05K3/323 ,  B32B7/12 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/83851 ,  H05K3/305 ,  H05K3/321 ,  H05K3/325 ,  H05K2201/0329 ,  H05K2201/10977 ,  H05K2203/0278 ,  H05K2203/1189 ,  Y10T428/12569 ,  Y10T428/2852 ,  Y10T428/287 ,  Y10T428/2891

摘要： The present invention relates to a method for connecting electrodes comprising: interposing the polyphthalide represented by the formula (I): wherein R represents a divalent aromatic hydrocarbon group or a divalent heteroring-containing aromatic group, R1 represents an alkyl group, a fluorinated alkyl group, an alkoxy group or a halogen atom, where the number of R1 is 0 to 4, X represents O or N—R3, provided that R3 represents one of the following groups, Y represents SO2 or Co and n represents a number of repeating units in the polymer, as a pressure-sensitive conductive polymer at least partially between electrodes opposed to each other; and applying a pressure to fix the both electrodes, a surface-treated wiring board comprising polyphthalide represented by the formula (I) formed on at least part of the surface of the electrode part, an adhesive film comprising an adhesive and polyphthalide represented by the formula (I), and an electrode-connected structure using the same.

摘要翻译： 本发明涉及一种连接电极的方法，包括：插入由式（I）表示的多苯酞：其中R表示二价芳族烃基或含二价杂环的芳族基团，R 1表示 烷基，氟化烷基，烷氧基或卤原子，其中R 1的数目为0至4，X表示O或NR 3，提供 R 3表示以下基团之一，Y表示SO 2或Co，n表示聚合物中的重复单元数，作为压敏导电性聚合物 最少部分地彼此相对的电极; 并且施加压力以固定两个电极，包括形成在电极部分的至少一部分表面上的由式（I）表示的多苯酞的表面处理布线板，包含由式（I）表示的粘合剂和多苯酞的粘合剂膜 （I），以及使用其的电极连接结构。

公开(公告)号：US5571579A

公开(公告)日：1996-11-05

申请号：US326151

申请日：1994-10-19

申请人： Toshihiko Kato ,  Masami Yusa ,  Nobuo Miyadera ,  Hideyuki Hashimoto ,  Yasuo Miyadera ,  Masahiro Kawakami

发明人： Toshihiko Kato ,  Masami Yusa ,  Nobuo Miyadera ,  Hideyuki Hashimoto ,  Yasuo Miyadera ,  Masahiro Kawakami

IPC分类号： C08G73/10 ,  C09D179/08 ,  C09K19/56 ,  G02F1/1337 ,  C09K19/00 ,  B05D3/12

CPC分类号： C08G73/1053 ,  C09D179/08 ,  G02F1/133723 ,  Y10T428/1018

摘要： An alignment film for liquid crystal is provided which comprises a polyimide comprising a repeating unit of the general formula (I): ##STR1## wherein n is an integer of from 2 to 16 and R.sup.1 represents a divalent organic group. This polyimide is obtained for example, from a reaction between ethylene glycol bis(trimellitate dianhydride) and 4,4'-diaminodiphenyl ether. This polyimide or a varnish of a precursor thereof is coated on a plate, and dried to obtain an alignment film for liquid crystal, which stably exhibits a high pretilt angle, irrespective of curing temperatures. The present invention further provides a liquid crystal-sandwiched panel and a liquid crystal display module prepared using the alignment film as well as a material for the preparation of the alignment film.

摘要翻译： 提供了一种用于液晶的取向膜，其包括含有通式（I）的重复单元的聚酰亚胺：其中n为2至16的整数，R 1表示二价有机基团。 该聚酰亚胺例如由乙二醇双（偏苯三酸二酐）与4,4'-二氨基二苯醚的反应得到。 将该聚酰亚胺或其前体清漆涂布在板上，干燥，得到与固化温度无关的稳定地表现出高预倾角的液晶取向膜。 本发明还提供一种液晶夹板和使用取向膜制备的液晶显示模块以及用于制备取向膜的材料。

公开(公告)号：US20060260744A1

公开(公告)日：2006-11-23

申请号：US11494709

申请日：2006-07-28

申请人： Isao Tsukagoshi ,  Yasushi Gotou ,  Masami Yusa ,  Yasuo Miyadera

发明人： Isao Tsukagoshi ,  Yasushi Gotou ,  Masami Yusa ,  Yasuo Miyadera

IPC分类号： C09J5/00

CPC分类号： H05K3/323 ,  B32B7/12 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/83851 ,  H05K3/305 ,  H05K3/321 ,  H05K3/325 ,  H05K2201/0329 ,  H05K2201/10977 ,  H05K2203/0278 ,  H05K2203/1189 ,  Y10T428/12569 ,  Y10T428/2852 ,  Y10T428/287 ,  Y10T428/2891

摘要： The present invention relates to a method for connecting electrodes comprising: interposing the polyphthalide represented by the formula (I): wherein R represents a divalent aromatic hydrocarbon group or a divalent heteroring-containing aromatic group, R1 represents an alkyl group, a fluorinated alkyl group, an alkoxy group or a halogen atom, where the number of R1 is 0 to 4, X represents O or N—R3, provided that R3 represents one of the following groups, Y represents SO2 or Co and n represents a number of repeating units in the polymer, as a pressure-sensitive conductive polymer at least partially between electrodes opposed to each other; and applying a pressure to fix the both electrodes, a surface-treated wiring board comprising polyphthalide represented by the formula (I) formed on at least part of the surface of the electrode part, an adhesive film comprising an adhesive and polyphthalide represented by the formula (I), and an electrode-connected structure using the same.