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公开(公告)号：US20120224710A1
公开(公告)日：2012-09-06
申请号：US13471084
申请日：2012-05-14
申请人： Jeffrey J. Terlizzi , Emery A. Sanford , M. Evans Hankey , Terry Tikalsky , John Tang , Daniele De Iuliis , Peter Russell-Clarke
发明人： Jeffrey J. Terlizzi , Emery A. Sanford , M. Evans Hankey , Terry Tikalsky , John Tang , Daniele De Iuliis , Peter Russell-Clarke
IPC分类号： H04R1/10
CPC分类号： H04R5/033 , H01R13/2428 , H01R13/6205 , H01R13/64 , H01R13/7039 , H01R29/00 , H01R43/26 , H04M1/0262 , H04M1/0274 , H04M1/0277 , H04M1/05 , H04M1/6058 , H04M1/6066 , H04M2250/02 , H04R1/1016 , H04R1/1041 , H04R1/1058 , Y02D70/10
摘要： A wireless headset device that includes an earbud assembly and a primary housing assembly, fixed to the earbud assembly, is provided. The earbud assembly can include an earbud flexible circuit board having mounted thereon a receiver and processing circuitry. The primary housing assembly can include a microphone and a primary housing flexible circuit board electrically coupled to the earbud circuit board and the microphone. In some embodiments, the headset device can include at least one flexible circuit board and the primary housing can include a connector assembly. The at least one flexible circuit board can be electrically coupled to the connector assembly and can include Universal Serial Bus (USB) circuitry operative to process USB protocol communications and serial circuitry operative to process serial protocol communications.
摘要翻译： 提供一种无线耳机装置，其包括耳塞组件和固定到耳塞组件的主壳体组件。 耳塞组件可以包括其上安装有接收器和处理电路的耳塞柔性电路板。 主壳体组件可以包括麦克风和电耦合到耳塞电路板和麦克风的主壳体柔性电路板。 在一些实施例中，耳机设备可以包括至少一个柔性电路板，并且主壳体可以包括连接器组件。 所述至少一个柔性电路板可以电耦合到所述连接器组件，并且可以包括可操作以处理USB协议通信的通用串行总线（USB）电路和用于处理串行协议通信的串行电路。
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公开(公告)号：US07942678B2
公开(公告)日：2011-05-17
申请号：US12869319
申请日：2010-08-26
IPC分类号： H01R12/00
CPC分类号： H04R5/033 , H01R13/2428 , H01R13/6205 , H01R13/64 , H01R13/7039 , H01R29/00 , H01R43/26 , H04M1/0262 , H04M1/0274 , H04M1/0277 , H04M1/05 , H04M1/6058 , H04M1/6066 , H04M2250/02 , H04R1/1016 , H04R1/1041 , H04R1/1058 , Y02D70/10
摘要： A headset connector assembly that includes a connector plate, a casing, and electrical contact members is provided. The connector plate can have a first mating surface, a second mating surface, and at least two apertures existing between the first and the second mating surfaces. The casing can have a first side in contact with the first mating surface and a second side. The casing can include a protruding cavity member for each of the at least two apertures. Each protruding cavity member can extend from the first side and be constructed to fit within one of the at least two apertures. Each protruding cavity member can house an electrical contact member.
摘要翻译： 提供了包括连接器板，壳体和电接触构件的耳机连接器组件。 连接器板可以具有第一配合表面，第二配合表面以及存在于第一和第二配合表面之间的至少两个孔。 壳体可以具有与第一配合表面接触的第一侧和第二侧。 壳体可以包括用于至少两个孔中的每一个的突出空腔构件。 每个突出空腔构件可以从第一侧延伸并且被构造成装配在至少两个孔中的一个中。 每个突出的腔体可以容纳电接触构件。
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公开(公告)号：US07798831B2
公开(公告)日：2010-09-21
申请号：US11999838
申请日：2007-12-06
IPC分类号： H01R13/62
CPC分类号： H01R43/24
摘要： A headset connector assembly that includes a connector plate, a casing, and electrical contact members is provided. The connector plate can have a first mating surface, a second mating surface, and at least two apertures existing between the first and the second mating surfaces. The casing can have a first side in contact with the first mating surface and a second side. The casing can include a protruding cavity member for each of the at least two apertures. Each protruding cavity member can extend from the first side and be constructed to fit within one of the at least two apertures. Each protruding cavity member can house an electrical contact member.
摘要翻译： 提供了包括连接器板，壳体和电接触构件的耳机连接器组件。 连接器板可以具有第一配合表面，第二配合表面以及存在于第一和第二配合表面之间的至少两个孔。 壳体可以具有与第一配合表面接触的第一侧和第二侧。 壳体可以包括用于至少两个孔中的每一个的突出空腔构件。 每个突出空腔构件可以从第一侧延伸并且被构造成装配在至少两个孔中的一个中。 每个突出的腔体可以容纳电接触构件。
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公开(公告)号：US20080166007A1
公开(公告)日：2008-07-10
申请号：US11824180
申请日：2007-06-28
申请人： M. Evans Hankey , Emery A. Sanford
发明人： M. Evans Hankey , Emery A. Sanford
IPC分类号： H04R1/10
CPC分类号： H04R1/1058 , H04M1/05 , H04R1/083 , H04R1/1016 , H04R1/1041 , H04R1/1066 , H04R1/1075 , H04R31/006 , H04R2201/107 , H04R2420/07 , Y02D70/10
摘要： A headset device that includes an earbud housing, a primary housing, a threaded neck, an earbud screw, and a primary housing screw is provided. The earbud housing can include an earbud through-hole and a first neck engaging surface. The primary housing can include a housing through-hole and a second neck engaging surface. The threaded neck can include first and second neck surfaces that can mate, respectively to the first and second neck engaging surface. The earbud screw can fit through the earbud through-hole and can interlock with the threaded neck to fix the earbud housing to the threaded neck. The primary housing screw can fit through the housing through-hole and can interlock with the threaded neck to fix the primary housing to the threaded neck. The threaded neck can include a through-hole for enabling circuitry disposed in the earbud housing to electrically couple to circuitry disposed in the primary housing.
摘要翻译： 提供包括耳塞壳体，主壳体，螺纹颈部，耳塞螺钉和主壳体螺钉的耳机设备。 耳塞壳体可以包括耳塞通孔和第一颈部接合表面。 主壳体可以包括壳体通孔和第二颈部接合表面。 螺纹颈部可以包括分别与第一和第二颈部接合表面配合的第一和第二颈部表面。 耳塞螺钉可以穿过耳塞通孔，并可以与螺纹颈部锁定，将耳塞外壳固定到螺纹颈部。 主壳体螺钉可以穿过壳体通孔，并且可以与螺纹颈部互锁，以将主壳体固定到螺纹颈部。 螺纹颈部可以包括通孔，用于使得设置在耳塞壳体中的电路能够电耦合到设置在主壳体中的电路。
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15.发明授权公开(公告)号：US09059514B2
公开(公告)日：2015-06-16
申请号：US13524997
申请日：2012-06-15
申请人： Emery A. Sanford , Qingxiang Li , Lijun Zhang , Anthony S. Montevirgen , Teodor Dabov , Erik G. P. de Jong , Wey-Jiun Lin
发明人： Emery A. Sanford , Qingxiang Li , Lijun Zhang , Anthony S. Montevirgen , Teodor Dabov , Erik G. P. de Jong , Wey-Jiun Lin
CPC分类号： H01Q1/243 , H01Q1/38 , H01Q1/42 , H01Q1/526 , Y10T29/49016
摘要： An electronic device may be provided with a conductive housing. An antenna window structure may be formed in an opening in the housing. The antenna window structure may have an antenna support structure that is attached to the conductive housing and that supports antenna structures. An antenna window cap may be mounted in the opening and attached to the antenna support structure with liquid adhesive. Alignment structures may be provided in the antenna support structure. An antenna support plate with mating alignment structures may be used in attaching the antenna structures to the antenna support structures. Metal shielding structures may be used to provide electromagnetic shielding. A shielding wall may be formed from a sheet metal structure supported by a plastic support structure. A flexible metal shielding foil layer may be welded to the shielding wall using a sacrificial plate.
摘要翻译： 电子设备可以设置有导电外壳。 天线窗口结构可以形成在壳体中的开口中。 天线窗口结构可以具有附接到导电壳体并且支撑天线结构的天线支撑结构。 天线窗口帽可以安装在开口中并且用液体粘合剂附接到天线支撑结构。 对准结构可以设置在天线支撑结构中。 具有匹配对准结构的天线支撑板可以用于将天线结构附接到天线支撑结构。 金属屏蔽结构可用于提供电磁屏蔽。 屏蔽壁可以由由塑料支撑结构支撑的金属板结构形成。 可以使用牺牲板将柔性金属屏蔽箔层焊接到屏蔽壁。
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公开(公告)号：US08969730B2
公开(公告)日：2015-03-03
申请号：US13587793
申请日：2012-08-16
CPC分类号： H05K1/14 , H05K1/0218 , H05K1/118 , H05K1/147 , H05K3/3494 , H05K3/363 , H05K2201/09481 , H05K2201/10666 , H05K2201/10977 , H05K2203/0195 , H05K2203/1147 , H05K2203/1311 , Y10T29/49121 , Y10T29/49155
摘要： Printed circuits may be electrically and mechanically connected to each other using connections such as solder connections. A first printed circuit such as a rigid printed circuit board may have solder pads and other metal traces. A second printed circuit such as a flexible printed circuit may have openings. Solder connections may be formed in the openings to attach metal traces in the flexible printed circuit to the solder pads on the rigid printed circuit board. A ring of adhesive may surround the solder connections. The flexible printed circuit may be attached to the rigid printed circuit board using the ring of adhesive. An insulating tape may cover the solder connections. A conductive shielding layer with a conductive layer and a layer of conductive adhesive may overlap the solder joints. The conductive adhesive may connect the shielding layer to the metal traces on the rigid printed circuit board.
摘要翻译： 印刷电路可以使用诸如焊料连接的连接彼此电连接和机械连接。 诸如刚性印刷电路板的第一印刷电路板可以具有焊盘和其它金属迹线。 诸如柔性印刷电路的第二印刷电路可以具有开口。 可以在开口中形成焊接连接以将柔性印刷电路中的金属迹线附接到刚性印刷电路板上的焊盘。 粘合剂环可以围绕焊料连接。 柔性印刷电路可以使用粘合剂环附接到刚性印刷电路板。 绝缘胶带可以覆盖焊料连接。 具有导电层和导电粘合剂层的导电屏蔽层可与焊点重叠。 导电粘合剂可以将屏蔽层连接到刚性印刷电路板上的金属迹线。
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公开(公告)号：US08893975B2
公开(公告)日：2014-11-25
申请号：US13607663
申请日：2012-09-07
申请人： Emery A. Sanford
发明人： Emery A. Sanford
IPC分类号： G06K19/00
CPC分类号： G06K19/06103
摘要： A system for integrating a marked product housing includes an image capture device configured to capture an image of indicia formed on an exterior surface of the marked product housing, a controller in operative communication with the image capture device configured to process the image of the indicia to retrieve a unique product identifier represented by the indicia, and an indicia forming device in operative communication with the controller configured to form a coded formation onto an interior surface of the marked product housing representing the unique product identifier.
摘要翻译： 用于集成标记产品外壳的系统包括被配置为捕获形成在标记产品外壳的外表面上的标记的图像的图像捕获装置，与被配置为将标记的图像处理成图像的图像捕获装置可操作地通信的控制器 检索由标记表示的唯一的产品标识符，以及与控制器可操作地通信的标记形成装置，其被配置为在标记的产品外壳的内表面上形成代表唯一产品标识符的编码形式。
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公开(公告)号：US20140071634A1
公开(公告)日：2014-03-13
申请号：US13607014
申请日：2012-09-07
申请人： David A. Pakula , Emery A. Sanford , Tyson B. Manullang , Anthony S. Montevirgen , Nicholas G.L. Merz , Christopher M. Werner
发明人： David A. Pakula , Emery A. Sanford , Tyson B. Manullang , Anthony S. Montevirgen , Nicholas G.L. Merz , Christopher M. Werner
CPC分类号： H01M2/1022 , H01M2200/30 , H04M1/0277 , H05K1/0243 , H05K9/0032 , H05K2201/10371
摘要： An electronic device may include subassemblies such as battery structures, electromagnetic shielding structures, and button structures. The electromagnetic shielding structures may include a conductive fence and a flexible shielding layer that covers electronic components. The electromagnetic shielding structure may be formed with a recess that receives a protruding portion of a battery. The recess may be formed from a multi-level shielding structure that includes rigid and flexible portions. The button structures may be mounted to a ledge that is formed as an integral part of a device housing. An electronic device battery may be enclosed in a protective battery sleeve. The battery sleeve may include a center portion that encloses the battery and peripheral portions that are folded and coupled to the center portion by adhesive material interposed between opposing surfaces of the folded peripheral portions and the center portion of the battery sleeve.
摘要翻译： 电子设备可以包括诸如电池结构，电磁屏蔽结构和按钮结构的子组件。 电磁屏蔽结构可以包括导电栅栏和覆盖电子元件的柔性屏蔽层。 电磁屏蔽结构可以形成有容纳电池的突出部分的凹部。 凹部可以由包括刚性和柔性部分的多层屏蔽结构形成。 按钮结构可以安装到形成为装置壳体的整体部分的凸缘。 电子设备电池可以封装在保护电池套中。 电池套可以包括中心部分，其包围电池和外围部分，所述中心部分被插入在折叠周边部分的相对表面和电池套筒的中心部分之间的粘合材料折叠并联接到中心部分。
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公开(公告)号：US20140048310A1
公开(公告)日：2014-02-20
申请号：US13587793
申请日：2012-08-16
CPC分类号： H05K1/14 , H05K1/0218 , H05K1/118 , H05K1/147 , H05K3/3494 , H05K3/363 , H05K2201/09481 , H05K2201/10666 , H05K2201/10977 , H05K2203/0195 , H05K2203/1147 , H05K2203/1311 , Y10T29/49121 , Y10T29/49155
摘要： Printed circuits may be electrically and mechanically connected to each other using connections such as solder connections. A first printed circuit such as a rigid printed circuit board may have solder pads and other metal traces. A second printed circuit such as a flexible printed circuit may have openings. Solder connections may be formed in the openings to attach metal traces in the flexible printed circuit to the solder pads on the rigid printed circuit board. A ring of adhesive may surround the solder connections. The flexible printed circuit may be attached to the rigid printed circuit board using the ring of adhesive. An insulating tape may cover the solder connections. A conductive shielding layer with a conductive layer and a layer of conductive adhesive may overlap the solder joints. The conductive adhesive may connect the shielding layer to the metal traces on the rigid printed circuit board.
摘要翻译： 印刷电路可以使用诸如焊料连接的连接彼此电连接和机械连接。 诸如刚性印刷电路板的第一印刷电路板可以具有焊盘和其它金属迹线。 诸如柔性印刷电路的第二印刷电路可以具有开口。 可以在开口中形成焊接连接以将柔性印刷电路中的金属迹线附接到刚性印刷电路板上的焊盘。 粘合剂环可以围绕焊料连接。 柔性印刷电路可以使用粘合剂环附接到刚性印刷电路板。 绝缘胶带可以覆盖焊料连接。 具有导电层和导电粘合剂层的导电屏蔽层可与焊点重叠。 导电粘合剂可以将屏蔽层连接到刚性印刷电路板上的金属迹线。
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公开(公告)号：US20130163210A1
公开(公告)日：2013-06-27
申请号：US13337822
申请日：2011-12-27
申请人： Emery A. Sanford , Sean A. Mayo
发明人： Emery A. Sanford , Sean A. Mayo
CPC分类号： H05K1/147 , H05K3/284 , H05K3/363 , H05K3/4069 , Y10T29/49146
摘要： An integrated structure for interconnection of electrical components is provided. In one embodiment, the integrated structure includes a through mold via (TMV) module having a substrate and at least one component coupled to the substrate. A flexible printed circuit board (flex-PCB) is integrated with the substrate of the TMV module. A TMV is provided through a body of the module to allow the flex-PCB to couple with a logic board.
摘要翻译： 提供了用于电气部件互连的集成结构。 在一个实施例中，集成结构包括具有衬底和耦合到衬底的至少一个部件的贯穿模具通孔（TMV）模块。 柔性印刷电路板（flex-PCB）与TMV模块的基板集成。 通过模块的主体提供TMV，以允许flex-PCB与逻辑板耦合。
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