公开(公告)号：US20080169480A1

公开(公告)日：2008-07-17

申请号：US11652060

申请日：2007-01-11

申请人： Jui-Ping Weng ,  Hsiao-Wen Lee

发明人： Jui-Ping Weng ,  Hsiao-Wen Lee

IPC分类号： H01L33/00

CPC分类号： H01L33/641 ,  H01L24/97 ,  H01L33/486 ,  H01L33/507 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2924/12044 ,  H01L2924/00014 ,  H01L2924/00

摘要： An optoelectronic device package. The optoelectronic device package includes a substrate, a reflector formed on a first plane of the substrate, a cover bonded to the reflector to form a closed space, a plurality of microlenses formed on a first plane of the cover, a phosphor film formed on a second plane of the cover within the closed space, a thermal-conductive film formed on a second plane of the substrate, an electrode formed on the sidewall and the second plane of the substrate uncovered by the thermal-conductive film, and an optoelectronic device formed on the first plane of the substrate within the closed space. The invention also provides a method of packaging the optoelectronic device.

摘要翻译： 光电器件封装。 所述光电器件封装包括衬底，形成在所述衬底的第一平面上的反射器，结合到所述反射器以形成闭合空间的盖，形成在所述盖的第一平面上的多个微透镜，形成在所述衬底上的荧光膜 封闭空间内的盖的第二平面，形成在基板的第二平面上的导热膜，形成在未被导热膜覆盖的侧壁和基板的第二平面上的电极和形成的光电子器件 在封闭空间内的衬底的第一平面上。 本发明还提供一种封装光电器件的方法。

公开(公告)号：US20080191334A1

公开(公告)日：2008-08-14

申请号：US11705133

申请日：2007-02-12

申请人： Hsiao-Wen Lee ,  Jui-Ping Weng

发明人： Hsiao-Wen Lee ,  Jui-Ping Weng

IPC分类号： H01L23/02

CPC分类号： H01L27/14618 ,  H01L27/14683 ,  H01L2224/0554 ,  H01L2224/05548 ,  H01L2224/05573 ,  H01L2224/13 ,  H01L2924/00014 ,  H01L2924/16235 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： Glass dam structures for imaging device chip scale package. An optoelectronic device chip scale package comprises a substrate configured as a support structure for the chip scale package. A semiconductor die with die circuitry is attached to the substrate. A glass encapsulant is disposed on the substrate encapsulating the semiconductor die, wherein the glass encapsulant has a dam structure around an opening. A seal layer is disposed between the substrate and the dam structure bonding the two together.

摘要翻译： 用于成像装置芯片级封装的玻璃坝结构。 光电子器件芯片级封装包括被配置为用于芯片级封装的支撑结构的衬底。 具有管芯电路的半导体管芯连接到衬底。 玻璃密封剂设置在封装半导体管芯的衬底上，其中玻璃密封剂在开口周围具有坝结构。 密封层设置在基板和将两者结合在一起的坝结构之间。

公开(公告)号：US20100237379A1

公开(公告)日：2010-09-23

申请号：US12407385

申请日：2009-03-19

申请人： Wu-Cheng KUO ,  Jui-Ping Weng ,  Tzu-Han Lin

发明人： Wu-Cheng KUO ,  Jui-Ping Weng ,  Tzu-Han Lin

IPC分类号： H01L33/00

CPC分类号： H01L33/486 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/00

摘要： An embodiment of the invention provides a light emitting device, which includes: a first substrate made of a semiconductor material or a ceramic material; a first hole having extending direction from a first side toward an opposite second side and from a first surface toward an opposite second surface of the first substrate; a second hole having extending direction from the first side toward the second side and from the first surface toward the second surface; a light emitting element disposed overlying the first surface and having a first electrode and a second electrode; a first conducting layer overlying a first sidewall of the first hole and electrically connected to the first electrode; and a second conducting layer overlying a second sidewall of the second hole and electrically connected to the second electrode.

摘要翻译： 本发明的实施例提供了一种发光器件，其包括：由半导体材料或陶瓷材料制成的第一衬底; 第一孔，其具有从第一侧朝向相反的第二侧的延伸方向以及从第一基板的第一表面朝向相反的第二表面; 第二孔，从第一侧向第二侧延伸，从第一面向第二面延伸; 设置在所述第一表面上并具有第一电极和第二电极的发光元件; 覆盖所述第一孔的第一侧壁并电连接到所述第一电极的第一导电层; 以及覆盖所述第二孔的第二侧壁并电连接到所述第二电极的第二导电层。

公开(公告)号：US20090309178A1

公开(公告)日：2009-12-17

申请号：US12543804

申请日：2009-08-19

申请人： Jui-Ping Weng ,  Jang-Cheng Hsieh ,  Tzu-Han Lin ,  Pai-Chun Peter Zung

发明人： Jui-Ping Weng ,  Jang-Cheng Hsieh ,  Tzu-Han Lin ,  Pai-Chun Peter Zung

IPC分类号： H01L31/02

CPC分类号： H01L27/14618 ,  H01L27/14683 ,  H01L2224/10

摘要： The invention provides an image sensor package and method for fabricating the same. The image sensor package comprises a first substrate comprising a sensor device thereon and a hole therein. A bonding pad comprising a first opening is formed on an upper surface of the first substrate. A second substrate comprising a spacer element with a second opening therein is disposed on the first substrate. A conductive plug is formed in the hole and passes through the first and second openings to the second substrate to electrically contact with the bonding pad. A conductive layer is formed on a lower surface of the first substrate and electrically connects to the conductive plug. A solder ball is formed on the conductive layer and electrically connects to the bonding pad by the conductive plug. The image sensor package further comprises a second substrate bonding to the first substrate. The image sensor package is relatively less thick, thus, the dimensions thereof are relatively reduced.

摘要翻译： 本发明提供一种图像传感器封装及其制造方法。 图像传感器封装包括其上包括传感器装置的第一基板和其中的孔。 包括第一开口的焊盘形成在第一基板的上表面上。 包括其中具有第二开口的间隔元件的第二基板设置在第一基板上。 导电插塞形成在孔中，并通过第一和第二开口到第二基板，以与接合焊盘电接触。 导电层形成在第一基板的下表面上并电连接到导电插塞。 在导电层上形成焊球，并通过导电插塞与焊盘电连接。 图像传感器封装还包括与第一基板结合的第二基板。 图像传感器封装相对较薄，因此其尺寸相对减小。

公开(公告)号：US07928655B2

公开(公告)日：2011-04-19

申请号：US12267872

申请日：2008-11-10

申请人： Tzu-Han Lin ,  Tzy-Ying Lin ,  Jui-Ping Weng ,  Wei-Hung Kang

发明人： Tzu-Han Lin ,  Tzy-Ying Lin ,  Jui-Ping Weng ,  Wei-Hung Kang

IPC分类号： H05B33/04

CPC分类号： H01L33/507 ,  H01L24/24 ,  H01L24/97 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/48227 ,  H01L2924/10253 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2933/0041 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

摘要： A light-emitting diode (LED) device is disclosed. The LED device includes a semiconductor substrate with a planar top surface, a light-emitting diode (LED) chip disposed over the top surface of the semiconductor substrate, at least two isolated outer wiring layers formed through the semiconductor substrate and electrically connected to the light-emitting diode chip, serving as input terminals, a transparent encapsulating layer with a substantially planar top surface formed over the semiconductor substrate, capping the LED chip and the at least two isolated outer wiring layers, and a lens module adhered to the substantially planar top surface of the transparent encapsulating layer to cap the light-emitting diode chip. In one embodiment, the lens module includes a fluorescent layer and a lens covering or covered by the fluorescent layer.

摘要翻译： 公开了一种发光二极管（LED）装置。 LED装置包括：具有平面顶面的半导体基板，设置在半导体基板的上表面上的发光二极管（LED）芯片，至少两个隔离的外部布线层，形成在半导体基板上并电连接到该光 用作输入端子的透明封装层，形成在所述半导体衬底上方的基本上平坦的顶表面，对所述LED芯片和所述至少两个隔离的外部布线层进行封盖;以及透镜模块，其粘附到所述基本平坦的顶部 透明封装层的表面覆盖发光二极管芯片。 在一个实施例中，透镜模块包括荧光层和覆盖或被荧光层覆盖的透镜。

公开(公告)号：US20090181490A1

公开(公告)日：2009-07-16

申请号：US12407115

申请日：2009-03-19

申请人： Jui-Ping Weng ,  Tzu-Han Lin ,  Pai-Chun Peter Zung

发明人： Jui-Ping Weng ,  Tzu-Han Lin ,  Pai-Chun Peter Zung

IPC分类号： H01L31/18

CPC分类号： H01L27/14687 ,  H01L27/14618 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/05147 ,  H01L2224/05184 ,  H01L2224/05548 ,  H01L2224/0557 ,  H01L2224/10 ,  H01L2924/00014 ,  Y10S257/911 ,  H01L2224/05599

摘要： Image sensing devices and methods for fabricating the same are provided. An exemplary image sensing device comprises a first substrate having a first side and a second side opposing each other. A plurality of image sensing elements is formed in the first substrate at the first side. A conductive via is formed through the first substrate, having a first surface exposed by the first substrate at the first side and a second surface exposed by the first substrate at the second side. A conductive pad overlies the conductive via at the first side and is electrically connecting the image sensing elements. A conductive layer overlies the conductive via at the second side and electrically connects with the conductive pad. A conductive bump is formed over a portion of the conductive layer. A second substrate is bonded with the first substrate at the first side.

摘要翻译： 提供了图像感测装置及其制造方法。 示例性图像感测装置包括具有彼此相对的第一侧和第二侧的第一基板。 在第一侧的第一基板中形成多个图像感测元件。 通过第一基板形成导电通孔，其具有在第一侧被第一基板暴露的第一表面和在第二侧被第一基板暴露的第二表面。 导电焊盘在第一侧覆盖导电通孔并且电连接图像感测元件。 导电层位于第二侧的导电通孔上，并与导电焊盘电连接。 在导电层的一部分上形成导电凸块。 第二衬底在第一侧与第一衬底结合。

公开(公告)号：US07994598B2

公开(公告)日：2011-08-09

申请号：US12897176

申请日：2010-10-04

申请人： Jui-Ping Weng ,  Tzu-Han Lin

发明人： Jui-Ping Weng ,  Tzu-Han Lin

IPC分类号： H01L31/0232

CPC分类号： H01L27/14627 ,  H01L27/1462 ,  H01L27/14623 ,  H01L27/14685 ,  H04N5/2252 ,  H04N5/2257

摘要： An electronic assembly for an image sensor device is disclosed. The electronic assembly comprises a package module and a lens set mounted thereon. The package module comprises a device substrate comprising at least one grounding plug therein, in which the grounding plug is insulated from the device substrate and an array of optoelectronic devices therein. A transparent substrate comprises a dam portion attached to the device substrate to form a cavity between the device and transparent substrates. A micro-lens array is disposed within the cavity. A conductive layer is electrically connected to the grounding plug and covers the sidewalls of the lens set and the package module and the upper surface of the lens set. A method for fabricating the electronic assembly is also disclosed.

摘要翻译： 公开了一种用于图像传感器装置的电子组件。 电子组件包括安装在其上的封装模块和透镜组。 封装模块包括其中包括至少一个接地插头的器件衬底，其中接地插头与器件衬底绝缘，并且其中的光电器件阵列。 透明基板包括附接到装置基板的坝部，以在装置和透明基板之间形成空腔。 微透镜阵列设置在腔内。 导电层电连接到接地插头并且覆盖透镜组和封装模块的侧壁和透镜组的上表面。 还公开了一种用于制造电子组件的方法。

公开(公告)号：US07932529B2

公开(公告)日：2011-04-26

申请号：US12200171

申请日：2008-08-28

申请人： Tzu-Han Lin ,  Jui-Ping Weng ,  Tzy-Ying Lin ,  Kuo-Jung Fu

发明人： Tzu-Han Lin ,  Jui-Ping Weng ,  Tzy-Ying Lin ,  Kuo-Jung Fu

IPC分类号： H01L33/00 ,  H01L21/00

CPC分类号： H01L33/507 ,  H01L33/44 ,  H01L33/486 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/10253 ,  H01L2933/0091 ,  H01L2924/00014 ,  H01L2924/00

摘要： A semiconductor device is disclosed. The semiconductor device comprises a light-emitting diode chip disposed in a cavity of a semiconductor substrate. At least two isolated outer wiring layers are disposed on the bottom surface of the semiconductor substrate and are electrically connected to the light-emitting diode chip, serving as input terminals. A lens module is adhered to the top surface of the semiconductor substrate to cap the cavity, in which the lens module comprises a molded lens and a transparent conductive layer coated with a fluorescent material under the molded lens. A method for fabricating the semiconductor devices is also disclosed.

摘要翻译： 公开了一种半导体器件。 半导体器件包括设置在半导体衬底的空腔中的发光二极管芯片。 至少两个隔离的外部布线层设置在半导体衬底的底表面上，并且与用作输入端子的发光二极管芯片电连接。 透镜模块粘附到半导体衬底的顶表面以盖住空腔，其中透镜模块包括模制透镜和在模制透镜下方涂覆有荧光材料的透明导电层。 还公开了一种用于制造半导体器件的方法。

公开(公告)号：US07928458B2

公开(公告)日：2011-04-19

申请号：US12173565

申请日：2008-07-15

申请人： Tzu-Han Lin ,  Jui-Ping Weng ,  Shin-Chang Shiung

发明人： Tzu-Han Lin ,  Jui-Ping Weng ,  Shin-Chang Shiung

IPC分类号： H01L33/00

CPC分类号： H01L33/507 ,  H01L33/46 ,  H01L33/486 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2924/10253 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014

摘要： A semiconductor device is disclosed. The semiconductor device comprises a light-emitting diode chip disposed in a cavity of a semiconductor substrate. At least two isolated outer wiring layers are disposed on the bottom surface of the semiconductor substrate and are electrically connected to the light-emitting diode chip, serving as input terminals. A lens module is adhered to the top surface of the semiconductor substrate to cap the cavity, in which the lens module comprises a molded lens and a molded fluorescent layer thereunder and the molded fluorescent layer faces the light-emitting diode chip. A method for fabricating the semiconductor devices is also disclosed.

摘要翻译： 公开了一种半导体器件。 半导体器件包括设置在半导体衬底的空腔中的发光二极管芯片。 至少两个隔离的外部布线层设置在半导体衬底的底表面上，并且与用作输入端子的发光二极管芯片电连接。 透镜模块粘附到半导体衬底的顶表面以盖住空腔，其中透镜模块包括模制透镜和其下的模制荧光层，并且模制的荧光层面向发光二极管芯片。 还公开了一种用于制造半导体器件的方法。

公开(公告)号：US20090001495A1

公开(公告)日：2009-01-01

申请号：US11822011

申请日：2007-06-29

申请人： Jui-Ping Weng ,  Jang-Cheng Hsieh ,  Tzu-Han Lin ,  Pai-Chun Peter Zung

发明人： Jui-Ping Weng ,  Jang-Cheng Hsieh ,  Tzu-Han Lin ,  Pai-Chun Peter Zung

IPC分类号： H01L31/00 ,  H01L21/00

CPC分类号： H01L27/14618 ,  H01L27/14683 ,  H01L2224/10

摘要： The invention provides an image sensor package and method for fabricating the same. The image sensor package comprises a first substrate comprising a sensor device thereon and a hole therein. A bonding pad comprising a first opening is formed on an upper surface of the first substrate. A second substrate comprising a spacer element with a second opening therein is disposed on the first substrate. A conductive plug is formed in the hole and passes through the first and second openings to the second substrate to electrically contact with the bonding pad. A conductive layer is formed on a lower surface of the first substrate and electrically connects to the conductive plug. A solder ball is formed on the conductive layer and electrically connects to the bonding pad by the conductive plug. The image sensor package further comprises a second substrate bonding to the first substrate. The image sensor package is relatively less thick, thus, the dimensions thereof are relatively reduced.