公开(公告)号：US08399969B2

公开(公告)日：2013-03-19

申请号：US12844590

申请日：2010-07-27

申请人： Kuo-Ching Chang ,  Wu-Cheng Kuo ,  Tzu-Han Lin

发明人： Kuo-Ching Chang ,  Wu-Cheng Kuo ,  Tzu-Han Lin

IPC分类号： H01L23/495 ,  H01L21/00

CPC分类号： H01L24/33 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L33/62 ,  H01L2224/04042 ,  H01L2224/26175 ,  H01L2224/27013 ,  H01L2224/291 ,  H01L2224/29111 ,  H01L2224/32225 ,  H01L2224/32238 ,  H01L2224/32506 ,  H01L2224/335 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83805 ,  H01L2224/83815 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A chip package and a fabrication method thereof are provided. The chip package includes a substrate and a chip disposed over the substrate. A solder layer is disposed between the chip and the substrate. A conductive pad is disposed between the solder layer and the substrate, wherein the conductive pad includes a first portion disposed under the solder layer, a second portion disposed away from the first portion and a connective portion disposed between the first portion and the second portion. The connective portion has a width which is narrower than a width of the first portion along a first direction perpendicular to a second direction extending from the first portion to the connective portion.

摘要翻译： 提供了芯片封装及其制造方法。 芯片封装包括衬底和布置在衬底上的芯片。 焊料层设置在芯片和衬底之间。 导电焊盘设置在焊料层和衬底之间，其中导电焊盘包括布置在焊料层下方的第一部分，远离第一部分设置的第二部分和设置在第一部分和第二部分之间的连接部分。 连接部分的宽度比沿着从第一部分延伸到连接部分的第二方向垂直的第一方向的第一部分的宽度窄。

公开(公告)号：US08138509B2

公开(公告)日：2012-03-20

申请号：US12395086

申请日：2009-02-27

申请人： Tzy-Ying Lin ,  Chun-Chiang Yen ,  Wu-Cheng Kuo

发明人： Tzy-Ying Lin ,  Chun-Chiang Yen ,  Wu-Cheng Kuo

IPC分类号： H01L33/36

CPC分类号： H01L33/508 ,  H01L24/05 ,  H01L24/06 ,  H01L24/48 ,  H01L2224/04042 ,  H01L2224/05556 ,  H01L2224/05599 ,  H01L2224/48091 ,  H01L2224/48463 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01055 ,  H01L2924/01058 ,  H01L2924/01064 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2224/45099 ,  H01L2924/00

摘要： Light emitting devices conformally covered by a luminescent material layer are presented. A light emitting device includes a semiconductor light emitting die attached to a substrate. At least one bond pad is disposed on the semiconductor light emitting die. A luminescent material layer conformally covers the semiconductor light emitting die, wherein the luminescent material layer has at least one opening corresponding to and exposing the at least one bond pad. At least one wirebond is electrically connected to the at least one bond pad and a contact pad on the substrate.

摘要翻译： 呈现由发光材料层共形覆盖的发光器件。 发光器件包括附接到衬底的半导体发光芯片。 至少一个接合焊盘设置在半导体发光管芯上。 发光材料层共形地覆盖半导体发光管芯，其中发光材料层具有至少一个对应于并暴露至少一个焊盘的开口。 至少一个引线键电连接到所述至少一个接合焊盘和所述衬底上的接触焊盘。

公开(公告)号：US08029160B2

公开(公告)日：2011-10-04

申请号：US11562949

申请日：2006-11-22

申请人： Wu-Cheng Kuo ,  Ya-Hui Chiang ,  Bing-Ru Chen ,  Hung-Lieh Hu ,  Kuo-Hsiang Chen

发明人： Wu-Cheng Kuo ,  Ya-Hui Chiang ,  Bing-Ru Chen ,  Hung-Lieh Hu ,  Kuo-Hsiang Chen

IPC分类号： F21V5/04 ,  F21V7/04

CPC分类号： F21V13/04 ,  F21S41/00

摘要： An illumination device includes a light source positioned on an illumination axis, a lens assembly having at least two biconvex lenses disposed on the illumination axis, and a reflector having a reflecting surface enclosing the lens assembly. The light source emits a first group of light beams which directly impinge of the lens assembly, and a second group of light beams which directly impinge on the reflector. The second group of light beams being reflected by the reflecting surface such that they surround the first group of light beams after being refracted by the lens assembly, without such second group of light beams impinging on the lens assembly.

摘要翻译： 照明装置包括位于照明轴上的光源，具有设置在照明轴上的至少两个双凸透镜的透镜组件以及包围透镜组件的反射表面的反射器。 光源发射直接撞击透镜组件的第一组光束和直接撞击反射器的第二组光束。 第二组光束被反射表面反射，使得它们在被透镜组件折射之后包围第一组光束，而没有入射在透镜组件上的第二组光束。

公开(公告)号：US20060138436A1

公开(公告)日：2006-06-29

申请号：US11147185

申请日：2005-06-08

申请人： Ming-Hung Chen ,  Shih-Yi Wen ,  Wu-Cheng Kuo ,  Bing-Ru Chen ,  Jui-Ping Weng ,  Hsiao-Wen Lee

发明人： Ming-Hung Chen ,  Shih-Yi Wen ,  Wu-Cheng Kuo ,  Bing-Ru Chen ,  Jui-Ping Weng ,  Hsiao-Wen Lee

IPC分类号： H01L33/00 ,  H01L21/00

CPC分类号： H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L33/641 ,  H01L2224/16225 ,  H01L2224/48227 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2224/48091 ,  H01L2924/00 ,  H01L2224/0401

摘要： A light emitting diode (LED) package and process of making the same includes a silicon-on-insulator (SOI) substrate that is composed of two silicon based materials and an insulation layer interposed therebetween. The two silicon based materials of silicon-on-insulator substrate are etched to form a reflective cavity and an insulation trench, respectively, for dividing the silicon-on-insulator substrate into contact surfaces of positive and negative electrodes. A plurality of metal lines are then formed to electrically connect the two silicon based materials such that the LED chip can be mounted on the reflective cavity and electrically connected to the corresponding electrodes of the silicon-on-insulator substrate by the metal lines. Thus the properties of heat resistance and heat dispersal can be improved and the process can be simplified.

公开(公告)号：US06771158B2

公开(公告)日：2004-08-03

申请号：US10307367

申请日：2002-12-02

申请人： Hsiao-Wen Lee ,  Wen-I Wu ,  Shih-Yi Wen ,  Wu-Cheng Kuo ,  Jui-Ping Weng

发明人： Hsiao-Wen Lee ,  Wen-I Wu ,  Shih-Yi Wen ,  Wu-Cheng Kuo ,  Jui-Ping Weng

IPC分类号： H01P110

CPC分类号： B81B3/0051 ,  B81B2201/038 ,  B81B2201/045 ,  B81B2203/053 ,  G02B26/001 ,  G02B26/0808

摘要： A micro electromechanical differential actuator is comprised of a suspension arm structure and/or a bridge structure to make a two-degree-of-freedom and bi-directional motion. The actuator support base can make out-of-plane or in-plane vertical and horizontal motions. The invention is applicable in optical micro electromechanical devices such as optical switches, variable optical attenuators, optical tunable filters, modulators, tunable VCSEL's, grating modulators, micro displays, and RF switches.

公开(公告)号：US08735913B2

公开(公告)日：2014-05-27

申请号：US13078541

申请日：2011-04-01

申请人： Wu-Cheng Kuo

发明人： Wu-Cheng Kuo

IPC分类号： H01L33/00

CPC分类号： H01L33/62 ,  H01L25/0756 ,  H01L2224/73265 ,  H01L2224/48091 ,  H01L2924/00014

摘要： The invention provides a light emitting semiconductor structure, which includes a substrate; a first LED chip formed on the substrate; an adhesion layer formed on the first LED chip; and a second light emitting diode chip formed on the adhesion layer, wherein the second LED chip has a first conductive wire which is electrically connected to the substrate.

摘要翻译： 本发明提供一种发光半导体结构，其包括基板; 形成在基板上的第一LED芯片; 形成在第一LED芯片上的粘附层; 以及形成在所述粘合层上的第二发光二极管芯片，其中所述第二LED芯片具有电连接到所述基板的第一导线。

公开(公告)号：US20120248473A1

公开(公告)日：2012-10-04

申请号：US13078541

申请日：2011-04-01

申请人： Wu-Cheng KUO

发明人： Wu-Cheng KUO

IPC分类号： H01L33/08

CPC分类号： H01L33/62 ,  H01L25/0756 ,  H01L2224/73265 ,  H01L2224/48091 ,  H01L2924/00014

摘要： The invention provides a light emitting semiconductor structure, which includes a substrate; a first LED chip formed on the substrate; an adhesion layer formed on the first LED chip; and a second light emitting diode chip formed on the adhesion layer, wherein the second LED chip has a first conductive wire which is electrically connected to the substrate.

摘要翻译： 本发明提供一种发光半导体结构，其包括基板; 形成在基板上的第一LED芯片; 形成在第一LED芯片上的粘附层; 以及形成在所述粘合层上的第二发光二极管芯片，其中所述第二LED芯片具有电连接到所述基板的第一导线。

公开(公告)号：US20100127288A1

公开(公告)日：2010-05-27

申请号：US12323094

申请日：2008-11-25

申请人： Wu-Cheng KUO ,  Tzu-Han Lin

发明人： Wu-Cheng KUO ,  Tzu-Han Lin

IPC分类号： H01L33/00

CPC分类号： H01L33/483 ,  H01L33/54 ,  H01L2224/48091 ,  H01L2224/49107 ,  H01L2933/005 ,  H01L2924/00014

摘要： An LED device including a support structure with at least one LED die mounted thereon, a recess formed in a part of the support structure from a side of the LED die, and a lens formed over the support structure to encapsulate the LED die and the recess, thereby forming a protrusion in the support structure is disclosed.

摘要翻译： 一种LED装置，包括具有安装在其上的至少一个LED管芯的支撑结构，从所述LED管芯的一侧形成在所述支撑结构的一部分中的凹部，以及形成在所述支撑结构上的透镜，以封装所述LED管芯和所述凹部 从而在支撑结构中形成突起。

公开(公告)号：US07521724B2

公开(公告)日：2009-04-21

申请号：US11147185

申请日：2005-06-08

申请人： Ming-Hung Chen ,  Shih-Yi Wen ,  Wu-Cheng Kuo ,  Bing-Ru Chen ,  Jui-Ping Weng ,  Hsiao-Wen Lee

发明人： Ming-Hung Chen ,  Shih-Yi Wen ,  Wu-Cheng Kuo ,  Bing-Ru Chen ,  Jui-Ping Weng ,  Hsiao-Wen Lee

IPC分类号： H01L29/06 ,  H01L31/00 ,  H01L29/26 ,  H01L33/00 ,  H01L31/12 ,  H01L21/00 ,  H01L21/76

CPC分类号： H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L33/641 ,  H01L2224/16225 ,  H01L2224/48227 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2224/48091 ,  H01L2924/00 ,  H01L2224/0401

摘要： A light emitting diode (LED) package and process of making the same includes a silicon-on-insulator (SOI) substrate that is composed of two silicon based materials and an insulation layer interposed therebetween. The two silicon based materials of silicon-on-insulator substrate are etched to form a reflective cavity and an insulation trench, respectively, for dividing the silicon-on-insulator substrate into contact surfaces of positive and negative electrodes. A plurality of metal lines are then formed to electrically connect the two silicon based materials such that the LED chip can be mounted on the reflective cavity and electrically connected to the corresponding electrodes of the silicon-on-insulator substrate by the metal lines. Thus the properties of heat resistance and heat dispersal can be improved and the process can be simplified.

摘要翻译： 发光二极管（LED）封装及其制造方法包括由两个硅基材料和介于其间的绝缘层组成的绝缘体上硅（SOI）衬底。 蚀刻绝缘体上硅衬底的两种硅基材料，以分别形成反射腔和绝缘沟槽，以将绝缘体上硅衬底分成阳极和负电极的接触表面。 然后形成多个金属线以电连接两个硅基材料，使得LED芯片可以安装在反射腔上并且通过金属线电连接到绝缘体上硅衬底的相应电极。 因此，可以提高耐热性和热分散性，并且可以简化工艺。

公开(公告)号：US08502257B2

公开(公告)日：2013-08-06

申请号：US12613003

申请日：2009-11-05

申请人： Kuo-Ching Chang ,  Wu-Cheng Kuo ,  Tzu-Han Lin

发明人： Kuo-Ching Chang ,  Wu-Cheng Kuo ,  Tzu-Han Lin

IPC分类号： H01L27/15 ,  H01L29/267 ,  H01L31/12 ,  H01L33/00 ,  H01L31/0203

CPC分类号： H01L33/62 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/83 ,  H01L24/85 ,  H01L33/486 ,  H01L2224/05554 ,  H01L2224/29111 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49113 ,  H01L2224/73265 ,  H01L2224/83815 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/15153 ,  H01L2924/157 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00015 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A light-emitting diode package is provided. The light-emitting diode package comprises a substrate and a first metal layer disposed over the substrate. A solder layer is disposed on the first metal layer and a light-emitting diode chip is disposed on the solder layer, wherein the light-emitting diode chip comprises a conductive substrate and a multilayered epitaxial structure formed on the conductive substrate, and wherein the conductive substrate is adjacent to the solder layer.

摘要翻译： 提供了一种发光二极管封装。 发光二极管封装包括衬底和设置在衬底上的第一金属层。 焊料层设置在第一金属层上，并且发光二极管芯片设置在焊料层上，其中发光二极管芯片包括形成在导电衬底上的导电衬底和多层外延结构，并且其中导电 衬底与焊料层相邻。