-
公开(公告)号：US20060138436A1
公开(公告)日：2006-06-29
申请号：US11147185
申请日：2005-06-08
申请人： Ming-Hung Chen , Shih-Yi Wen , Wu-Cheng Kuo , Bing-Ru Chen , Jui-Ping Weng , Hsiao-Wen Lee
发明人： Ming-Hung Chen , Shih-Yi Wen , Wu-Cheng Kuo , Bing-Ru Chen , Jui-Ping Weng , Hsiao-Wen Lee
CPC分类号： H01L33/486 , H01L33/60 , H01L33/62 , H01L33/641 , H01L2224/16225 , H01L2224/48227 , H01L2924/00011 , H01L2924/00014 , H01L2924/3011 , H01L2924/3025 , H01L2224/48091 , H01L2924/00 , H01L2224/0401
摘要： A light emitting diode (LED) package and process of making the same includes a silicon-on-insulator (SOI) substrate that is composed of two silicon based materials and an insulation layer interposed therebetween. The two silicon based materials of silicon-on-insulator substrate are etched to form a reflective cavity and an insulation trench, respectively, for dividing the silicon-on-insulator substrate into contact surfaces of positive and negative electrodes. A plurality of metal lines are then formed to electrically connect the two silicon based materials such that the LED chip can be mounted on the reflective cavity and electrically connected to the corresponding electrodes of the silicon-on-insulator substrate by the metal lines. Thus the properties of heat resistance and heat dispersal can be improved and the process can be simplified.
-
公开(公告)号：US06995368B2
公开(公告)日：2006-02-07
申请号：US10795407
申请日：2004-03-09
申请人： Shih-Yi Wen , Hsiao-Wen Lee , Jui-Ping Weng , Ming-Hung Chen
发明人： Shih-Yi Wen , Hsiao-Wen Lee , Jui-Ping Weng , Ming-Hung Chen
IPC分类号： G21K7/00
CPC分类号： G01Q10/045 , G01Q70/10 , Y10S977/872
摘要： A MEMS differential actuated nano probe includes four suspension beams arranged in parallel, a connecting base connecting to the suspension beams, a nano probe. Two of the suspension beams elongate due to thermal expansion to allow the deflection of the probe. By heating the suspension beams at different positions, the MEMS differential actuated nano probe can move in two directions with two degrees of freedom. The deflection of the MEMS differential actuated nano probe can be also achieved in piezoelectric or electrostatic way.
摘要翻译： MEMS差分致动纳米探针包括平行布置的四个悬架梁，连接到悬架梁的连接底座，纳米探针。 悬挂梁中的两个由于热膨胀而伸长以允许探针的偏转。 通过将悬架梁加热到不同位置，MEMS微分致动纳米探针可以在两个方向上以两个自由度移动。 MEMS差分致动纳米探针的偏转也可以以压电或静电方式实现。
-
公开(公告)号：US20060016986A1
公开(公告)日：2006-01-26
申请号：US11218425
申请日：2005-09-06
申请人： Shih-Yi Wen , Hsiao-Wen Lee , Jui-Ping Weng , Ming-Hung Chen
发明人： Shih-Yi Wen , Hsiao-Wen Lee , Jui-Ping Weng , Ming-Hung Chen
CPC分类号： G01Q10/045 , G01Q70/10 , Y10S977/872
摘要： A MEMS differential actuated nano probe includes four suspension beams arranged in parallel, a connecting base connecting to the suspension beams, a nano probe. Two of the suspension beams elongate due to thermal expansion to allow the deflection of the probe. By heating the suspension beams at different positions, the MEMS differential actuated nano probe can move in two directions with two degrees of freedom. The deflection of the MEMS differential actuated nano probe can be also achieved in piezoelectric or electrostatic way.
-
公开(公告)号：US06771158B2
公开(公告)日：2004-08-03
申请号：US10307367
申请日：2002-12-02
申请人： Hsiao-Wen Lee , Wen-I Wu , Shih-Yi Wen , Wu-Cheng Kuo , Jui-Ping Weng
发明人： Hsiao-Wen Lee , Wen-I Wu , Shih-Yi Wen , Wu-Cheng Kuo , Jui-Ping Weng
IPC分类号： H01P110
CPC分类号： B81B3/0051 , B81B2201/038 , B81B2201/045 , B81B2203/053 , G02B26/001 , G02B26/0808
摘要： A micro electromechanical differential actuator is comprised of a suspension arm structure and/or a bridge structure to make a two-degree-of-freedom and bi-directional motion. The actuator support base can make out-of-plane or in-plane vertical and horizontal motions. The invention is applicable in optical micro electromechanical devices such as optical switches, variable optical attenuators, optical tunable filters, modulators, tunable VCSEL's, grating modulators, micro displays, and RF switches.
-
公开(公告)号：US07521724B2
公开(公告)日：2009-04-21
申请号：US11147185
申请日：2005-06-08
申请人： Ming-Hung Chen , Shih-Yi Wen , Wu-Cheng Kuo , Bing-Ru Chen , Jui-Ping Weng , Hsiao-Wen Lee
发明人： Ming-Hung Chen , Shih-Yi Wen , Wu-Cheng Kuo , Bing-Ru Chen , Jui-Ping Weng , Hsiao-Wen Lee
CPC分类号： H01L33/486 , H01L33/60 , H01L33/62 , H01L33/641 , H01L2224/16225 , H01L2224/48227 , H01L2924/00011 , H01L2924/00014 , H01L2924/3011 , H01L2924/3025 , H01L2224/48091 , H01L2924/00 , H01L2224/0401
摘要： A light emitting diode (LED) package and process of making the same includes a silicon-on-insulator (SOI) substrate that is composed of two silicon based materials and an insulation layer interposed therebetween. The two silicon based materials of silicon-on-insulator substrate are etched to form a reflective cavity and an insulation trench, respectively, for dividing the silicon-on-insulator substrate into contact surfaces of positive and negative electrodes. A plurality of metal lines are then formed to electrically connect the two silicon based materials such that the LED chip can be mounted on the reflective cavity and electrically connected to the corresponding electrodes of the silicon-on-insulator substrate by the metal lines. Thus the properties of heat resistance and heat dispersal can be improved and the process can be simplified.
摘要翻译： 发光二极管（LED）封装及其制造方法包括由两个硅基材料和介于其间的绝缘层组成的绝缘体上硅（SOI）衬底。 蚀刻绝缘体上硅衬底的两种硅基材料，以分别形成反射腔和绝缘沟槽，以将绝缘体上硅衬底分成阳极和负电极的接触表面。 然后形成多个金属线以电连接两个硅基材料，使得LED芯片可以安装在反射腔上并且通过金属线电连接到绝缘体上硅衬底的相应电极。 因此，可以提高耐热性和热分散性，并且可以简化工艺。
-
公开(公告)号：US20080169480A1
公开(公告)日：2008-07-17
申请号：US11652060
申请日：2007-01-11
申请人： Jui-Ping Weng , Hsiao-Wen Lee
发明人： Jui-Ping Weng , Hsiao-Wen Lee
IPC分类号： H01L33/00
CPC分类号： H01L33/641 , H01L24/97 , H01L33/486 , H01L33/507 , H01L33/58 , H01L2224/48091 , H01L2924/12044 , H01L2924/00014 , H01L2924/00
摘要： An optoelectronic device package. The optoelectronic device package includes a substrate, a reflector formed on a first plane of the substrate, a cover bonded to the reflector to form a closed space, a plurality of microlenses formed on a first plane of the cover, a phosphor film formed on a second plane of the cover within the closed space, a thermal-conductive film formed on a second plane of the substrate, an electrode formed on the sidewall and the second plane of the substrate uncovered by the thermal-conductive film, and an optoelectronic device formed on the first plane of the substrate within the closed space. The invention also provides a method of packaging the optoelectronic device.
摘要翻译： 光电器件封装。 所述光电器件封装包括衬底，形成在所述衬底的第一平面上的反射器，结合到所述反射器以形成闭合空间的盖，形成在所述盖的第一平面上的多个微透镜，形成在所述衬底上的荧光膜 封闭空间内的盖的第二平面，形成在基板的第二平面上的导热膜，形成在未被导热膜覆盖的侧壁和基板的第二平面上的电极和形成的光电子器件 在封闭空间内的衬底的第一平面上。 本发明还提供一种封装光电器件的方法。
-
公开(公告)号：US20050082474A1
公开(公告)日：2005-04-21
申请号：US10795407
申请日：2004-03-09
申请人： Shih-Yi Wen , Hsiao-Wen Lee , Jui-Ping Weng , Ming-Hung Chen
发明人： Shih-Yi Wen , Hsiao-Wen Lee , Jui-Ping Weng , Ming-Hung Chen
CPC分类号： G01Q10/045 , G01Q70/10 , Y10S977/872
摘要： A MEMS differential actuated nano probe includes four suspension beams arranged in parallel, a connecting base connecting to the suspension beams, a nano probe. Two of the suspension beams elongate due to thermal expansion to allow the deflection of the probe. By heating the suspension beams at different positions, the MEMS differential actuated nano probe can move in two directions with two degrees of freedom. The deflection of the MEMS differential actuated nano probe can be also achieved in piezoelectric or electrostatic way.
摘要翻译： MEMS差分致动纳米探针包括平行布置的四个悬架梁，连接到悬架梁的连接底座，纳米探针。 悬挂梁中的两个由于热膨胀而伸长以允许探针的偏转。 通过将悬架梁加热到不同位置，MEMS微分致动纳米探针可以在两个方向上以两个自由度移动。 MEMS差分致动纳米探针的偏转也可以以压电或静电方式实现。
-
公开(公告)号：US20050286110A1
公开(公告)日：2005-12-29
申请号：US10929074
申请日：2004-08-27
申请人： Shih-Yi Wen , Hsiao-Wen Lee , Jui-Ping Weng , Wu-Cheng Kuo , Chen-Yu Weng , Yu-Han Chieh
发明人： Shih-Yi Wen , Hsiao-Wen Lee , Jui-Ping Weng , Wu-Cheng Kuo , Chen-Yu Weng , Yu-Han Chieh
CPC分类号： G02B6/3572 , G02B6/3516 , G02B6/3518 , G02B6/3566 , G02B6/3576 , G02B6/3584 , G02B26/085
摘要： A self-assembly structure of micro electromechanical optical switch utilizes residual stresses of three curved beams. The first curved beam pushes the base plate away from the substrate. The second curved beam lifts up the mirror slightly. Then, the third curved beam rotates the mirror vertical to the base plate and achieves self-assembly. In another embodiment, magnetic force and magnetic-activated elements are used.
摘要翻译： 微机电光开关的自组装结构利用三个弯曲梁的残余应力。 第一弯曲梁将基板推离基板。 第二弯曲梁稍微升起镜子。 然后，第三弯曲梁将镜子垂直于基板旋转并实现自组装。 在另一个实施例中，使用磁力和磁激元件。
-
公开(公告)号：US06950224B1
公开(公告)日：2005-09-27
申请号：US10922265
申请日：2004-08-18
申请人： Bing-Ru Chen , Wu-Cheng Kuo , Ming-Hung Chen , Jui-Ping Weng , Yeh-I Su , Hsiao-Wen Lee
发明人： Bing-Ru Chen , Wu-Cheng Kuo , Ming-Hung Chen , Jui-Ping Weng , Yeh-I Su , Hsiao-Wen Lee
CPC分类号： G02B26/0841
摘要： An electrostatic movable micro mirror chip includes an upper mirror plate and a lower electrode plate positioned and jointed together via pairs of fitting solder and positioning grooves. It improves the optical quality of the mirror chip by a lower joining temperature. The fitting and jointing achieves easy positioning and interconnection. The fabrication time and cost is less. The mirror in the mirror chip is plated with metallic coating on both sides so as to balance the stress and improve its flatness.
摘要翻译： 静电可移动微镜芯片包括上镜面板和下电极板，通过一对装配焊料和定位槽定位和接合在一起。 它通过较低的接合温度提高了镜片的光学质量。 装配和接合实现了容易的定位和互连。 制造时间和成本较低。 镜片中的镜子在两面镀金属涂层，以平衡应力并提高其平整度。
-
公开(公告)号：US20080191334A1
公开(公告)日：2008-08-14
申请号：US11705133
申请日：2007-02-12
申请人： Hsiao-Wen Lee , Jui-Ping Weng
发明人： Hsiao-Wen Lee , Jui-Ping Weng
IPC分类号： H01L23/02
CPC分类号： H01L27/14618 , H01L27/14683 , H01L2224/0554 , H01L2224/05548 , H01L2224/05573 , H01L2224/13 , H01L2924/00014 , H01L2924/16235 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： Glass dam structures for imaging device chip scale package. An optoelectronic device chip scale package comprises a substrate configured as a support structure for the chip scale package. A semiconductor die with die circuitry is attached to the substrate. A glass encapsulant is disposed on the substrate encapsulating the semiconductor die, wherein the glass encapsulant has a dam structure around an opening. A seal layer is disposed between the substrate and the dam structure bonding the two together.
摘要翻译： 用于成像装置芯片级封装的玻璃坝结构。 光电子器件芯片级封装包括被配置为用于芯片级封装的支撑结构的衬底。 具有管芯电路的半导体管芯连接到衬底。 玻璃密封剂设置在封装半导体管芯的衬底上，其中玻璃密封剂在开口周围具有坝结构。 密封层设置在基板和将两者结合在一起的坝结构之间。
-
-
-
-
-
-
-
-
-
搜索结果
70 条记录 (耗时 0.02 秒)
