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公开(公告)号：US20140182932A1
公开(公告)日：2014-07-03
申请号：US14115091
申请日：2012-04-17
申请人： Harald Cholewa , Christoph Degen , Bernhard Reul , Mitja Rateiczak , Andreas Schlarb , Lothar Lesmeister
发明人： Harald Cholewa , Christoph Degen , Bernhard Reul , Mitja Rateiczak , Andreas Schlarb , Lothar Lesmeister
IPC分类号： H01R4/02
CPC分类号： H01R4/02 , H01L2924/0002 , H05B3/84 , H05B2203/016 , H05K3/3463 , H05K3/3494 , H05K3/4015 , H05K2201/1028 , H05K2201/1031 , H05K2203/0465 , Y02P70/611 , H01L2924/0001
摘要： A disk having at least one electric connecting element is described. The disk has a substrate, an electrically conductive structure on a region of the substrate, a connecting element containing at least chromium-containing steel, and a layer of a soldering compound that electrically connects the connecting element to sub-regions of the electrically conductive structure.
摘要翻译： 描述具有至少一个电连接元件的盘。 盘具有基板，在基板的区域上的导电结构，至少含有含铬钢的连接元件和将连接元件电连接到导电结构的子区域的焊料化合物层 。
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公开(公告)号：US20140110166A1
公开(公告)日：2014-04-24
申请号：US14115844
申请日：2012-04-17
IPC分类号： H01R4/62
CPC分类号： H01R4/62 , H01R4/02 , H05B3/84 , H05B2203/016 , Y10T29/49128
摘要： A pane having at least one electrical connection element is described. The pane has a substrate, an electrically conductive structure on a region of the substrate, a layer of a solder material on a region of the electrically conductive structure, and at least two soldering points of a connection element on the solder material. The at least two soldering points define at least one contact surface between the connection element and the electrically conductive structure, and a shape of the at least one contact surface has at least one segment of an oval, an ellipse, or a circle with a central angle α of at least 90°.
摘要翻译： 描述具有至少一个电连接元件的窗格。 所述窗格具有基板，在所述基板的区域上的导电结构，所述导电结构的区域上的焊料层，以及所述焊料材料上的连接元件的至少两个焊接点。 所述至少两个焊接点限定所述连接元件和所述导电结构之间的至少一个接触表面，并且所述至少一个接触表面的形状具有椭圆形，椭圆形或具有中心的圆形的至少一个部分 角度α至少为90°。
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公开(公告)号：US20130319518A1
公开(公告)日：2013-12-05
申请号：US13878174
申请日：2011-10-24
申请人： Matthias Doech , Christoph Degen , Robert Gass , Thomas Happ , Franz Karg , Lothar Lesmeister , Jan Boris Philipp , Mitja Rateiczak , Jaap Van Der Burgt , Andreas Schlarb , Bernhard Reul
发明人： Matthias Doech , Christoph Degen , Robert Gass , Thomas Happ , Franz Karg , Lothar Lesmeister , Jan Boris Philipp , Mitja Rateiczak , Jaap Van Der Burgt , Andreas Schlarb , Bernhard Reul
IPC分类号： H01L31/0224
CPC分类号： H01L31/022441 , H01L31/02008 , H02S40/34 , Y02E10/50
摘要： A solar module having a connecting element is described. The solar module has a substrate, a back electrode layer, a photovoltaically active absorber layer, and a cover pane disposed one over the other, at least one prefabricated conductive film at least one connection housing.
摘要翻译： 描述具有连接元件的太阳能模块。 太阳能组件具有基板，背面电极层，光伏活性吸收层和一个彼此重叠设置的至少一个预制导电膜，至少一个连接壳体。
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公开(公告)号：US20120318566A1
公开(公告)日：2012-12-20
申请号：US13580741
申请日：2011-02-15
CPC分类号： H05B3/84 , B23K35/262 , B23K35/264 , B32B15/018 , C22C12/00 , C22C13/00 , C22C38/08 , C22C38/10 , H01R4/028 , H01R13/03 , H01R2201/02 , H01R2201/26 , H05B2203/016
摘要： The present invention relates to a disk with an electrical connection element, having a substrate with a first coefficient of thermal expansion, an electrically conductive structure on a region of the substrate, and a connection element with a second coefficient of thermal expansion.
摘要翻译： 本发明涉及具有电连接元件的盘，具有第一热膨胀系数的衬底，在衬底的区域上的导电结构以及具有第二热膨胀系数的连接元件。
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公开(公告)号：US20100319977A1
公开(公告)日：2010-12-23
申请号：US12744054
申请日：2008-12-05
申请人： Mitja Rateiczak , Bernhard Reul , Cornelia Retsch
发明人： Mitja Rateiczak , Bernhard Reul , Cornelia Retsch
CPC分类号： H05K3/32 , H01R4/02 , H05B3/84 , H05B2203/016 , H05K1/0306 , H05K3/3421 , H05K2201/0979 , H05K2201/1031 , H05K2201/10962 , Y02P70/611
摘要： In a solder connection element (1), which is intended in particular for soldering onto a brittle substrate such as a window pane, for connecting an electrical component, which solder connection element has a body (2) provided for connecting purposes and at least two solder feet (3) protruding therefrom, a respective elastically deformable connecting part which is suitable for accommodating differences in thermal expansion extending between the body and the solder feet, more than two solder feet (3) are provided according to the invention for soldering onto a surface, wherein differences in thermal expansion and effects of mechanical forces from the component to be connected can be accommodated in at least two coordinate directions parallel to the substrate surface by way of resilience of the solder feet (3) and/or the connecting parts relative to the body (2) and/or the solder connection element (1). The body (2) itself can also be configured so as to be resilient by way of incisions (6) and/or equipped with a plug-in lug (5).
摘要翻译： 在焊接连接元件（1）中，其特别地用于焊接到诸如窗玻璃的脆性基板上，用于连接电气部件，该焊料连接元件具有用于连接目的的主体（2）和至少两个 从其突出的焊脚（3），相应的可弹性变形的连接部分，其适于适应在主体和焊脚之间延伸的热膨胀差异，根据本发明提供了多于两个焊脚（3），用于焊接到 表面，其中热膨胀的差异和来自待连接部件的机械力的影响可以通过焊脚（3）和/或连接部件相对的弹性而平行于基板表面的至少两个坐标方向被适应 （2）和/或焊料连接元件（1）。 本体（2）本身也可以被配置为通过切口（6）和/或配备有插入式凸耳（5）而具有弹性。
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公开(公告)号：US10305239B2
公开(公告)日：2019-05-28
申请号：US14115839
申请日：2012-04-17
IPC分类号： H01R13/02 , H01R43/02 , H05B3/84 , H01R13/03 , B23K1/00 , B23K1/002 , B23K1/005 , B23K1/012 , B23K1/06 , B23K33/00 , H05K1/09 , H05K1/11 , H01R4/02 , B23K101/00 , B23K101/38 , B23K103/04 , B23K103/12 , H01R12/57 , H01R101/00
摘要： A pane provided with at least one electrical connection element is described. The pane has a substrate, an electroconductive structure on a region of the substrate, a layer of soldering mass on a region of the electroconductive structure, and a connection element on the solder mass. The connection element contains a first and a second base region, a first and a second transition region, and a bridge region between the first and the second transition region, a first and a second contact surface arranged on a lower side of the first and second base regions. The first and the second contact surfaces and surfaces of the first and the second transition regions, facing the substrate are connected to the electroconductive structure by the solder mass. An angle between a surface of the substrate and each tangential plane of the surfaces of the first and the second transition region, facing the substrate, is less than 90°.
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公开(公告)号：US09385437B2
公开(公告)日：2016-07-05
申请号：US13695426
申请日：2011-07-04
申请人： Harald Cholewa , Andreas Schlarb , Lothar Lesmeister , Mitja Rateiczak , Bernhard Reul , Lothar Schmidt
发明人： Harald Cholewa , Andreas Schlarb , Lothar Lesmeister , Mitja Rateiczak , Bernhard Reul , Lothar Schmidt
IPC分类号： H01R4/02 , H01R43/20 , B23K1/002 , B23K35/36 , H01R43/16 , B23K1/06 , H05B3/84 , B23K35/26 , H05K3/34
CPC分类号： H05K1/0306 , B23K1/002 , B23K1/06 , B23K35/262 , B23K35/264 , B23K35/36 , H01R4/02 , H01R4/023 , H01R43/16 , H01R43/20 , H05B3/84 , H05B2203/016 , H05B2203/017 , H05K1/09 , H05K1/11 , H05K3/341 , H05K2201/02 , H05K2201/068
摘要： A pane with an electrical connection element is described. The pane can have a glass substrate and an electrically conductive structure on the substrate. Solder material can be used to electrically connect a connection element to the electrically conductive structure.
摘要翻译： 描述具有电连接元件的窗格。 该玻璃板可以在基板上具有玻璃基板和导电结构。 焊料可用于将连接元件电连接到导电结构。
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公开(公告)号：US08816214B2
公开(公告)日：2014-08-26
申请号：US13575566
申请日：2011-02-15
IPC分类号： H05K1/03 , H05K1/09 , C22C38/08 , C22C13/00 , B23K35/26 , C22C12/00 , H05B3/84 , C22C38/10 , B32B15/01 , H01R13/03 , H01R4/02
CPC分类号： H05B3/84 , B23K35/262 , B23K35/264 , B32B15/018 , C22C12/00 , C22C13/00 , C22C38/08 , C22C38/10 , H01R4/028 , H01R13/03 , H01R2201/02 , H01R2201/26 , H05B2203/016
摘要： A pane with an electrical connection element is described, including a substrate made of glass with a first coefficient of thermal expansion, an electrically conductive structure with a layer thickness of 5 μm to 40 μm on a region of the substrate, a connection element with a second coefficient of thermal expansion, and a layer of a solder material that connects the connection element electrically to subregions of the electrically conductive structure.
摘要翻译： 描述了具有电连接元件的窗格，包括由第一热膨胀系数的玻璃制成的基板，在基板的区域上具有5μm至40μm的层厚度的导电结构，具有 第二热膨胀系数，以及将连接元件电连接到导电结构的子区域的焊料材料层。
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公开(公告)号：US20140170913A1
公开(公告)日：2014-06-19
申请号：US14115839
申请日：2012-04-17
CPC分类号： H01R43/0235 , B23K1/0004 , B23K1/002 , B23K1/0056 , B23K1/012 , B23K1/06 , B23K33/00 , B23K2101/006 , B23K2101/38 , B23K2103/05 , B23K2103/12 , H01R4/02 , H01R4/023 , H01R4/029 , H01R12/57 , H01R13/03 , H01R43/0207 , H01R43/0242 , H01R2101/00 , H05B3/84 , H05B2203/016 , H05K1/09 , H05K1/11 , Y10T29/49213
摘要： A pane provided with at least one electrical connection element is described. The pane has a substrate, an electroconductive structure on a region of the substrate, a layer of soldering mass on a region of the electroconductive structure, and a connection element on the solder mass. The connection element contains a first and a second base region, a first and a second transition region, and a bridge region between the first and the second transition region, a first and a second contact surface arranged on a lower side of the first and second base regions. The first and the second contact surfaces and surfaces of the first and the second transition regions, facing the substrate are connected to the electroconductive structure by the solder mass. An angle between a surface of the substrate and each tangential plane of the surfaces of the first and the second transition region, facing the substrate, is less than 90°.
摘要翻译： 描述了具有至少一个电连接元件的窗格。 该玻璃板具有衬底，在衬底的区域上的导电结构，在导电结构的区域上的焊料层，以及焊料块上的连接元件。 连接元件包括第一和第二基极区域，第一和第二过渡区域以及第一和第二过渡区域之间的桥接区域，布置在第一和第二过渡区域的下侧的第一和第二接触表面 基地区。 面向衬底的第一和第二过渡区域的第一和第二接触表面和表面通过焊料块连接到导电结构。 基板的表面与面向基板的第一和第二过渡区域的表面的每个切向平面之间的角度小于90°。
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公开(公告)号：US20130043066A1
公开(公告)日：2013-02-21
申请号：US13695426
申请日：2011-07-04
申请人： Harald Cholewa , Andreas Schlarb , Lothar Lesmeister , Mitja Rateiczak , Bernhard Reul , Lothar Schmidt
发明人： Harald Cholewa , Andreas Schlarb , Lothar Lesmeister , Mitja Rateiczak , Bernhard Reul , Lothar Schmidt
CPC分类号： H05K1/0306 , B23K1/002 , B23K1/06 , B23K35/262 , B23K35/264 , B23K35/36 , H01R4/02 , H01R4/023 , H01R43/16 , H01R43/20 , H05B3/84 , H05B2203/016 , H05B2203/017 , H05K1/09 , H05K1/11 , H05K3/341 , H05K2201/02 , H05K2201/068
摘要： The present invention relates to a pane with an electrical connection element, comprising: a substrate made of glass (1), an electrically conductive structure (2) with a layer thickness of 5 μm to 40 μm on a region of the substrate (1), a connection element (3), and a layer of a solder material (4), which electrically connects the connection element (3) to a portion (12) of the electrically conductive structure (2), wherein the connection element (3) contains at least an iron-nickel alloy or an iron-nickel-cobalt alloy, the connection element (3) is connected to the portion (12) of the electrically conductive structure (2) via a contact surface (11) over its entire surface, and the contact surface (11) has no corners.
摘要翻译： 本发明涉及具有电连接元件的窗格，包括：由玻璃（1）制成的基板，在基板（1）的区域上具有5μm至40μm层厚度的导电结构（2） ，连接元件（3）和将所述连接元件（3）电连接到所述导电结构（2）的部分（12）的焊料材料层（4），其中所述连接元件（3） 至少含有铁 - 镍合金或铁 - 镍 - 钴合金，所述连接元件（3）通过其整个表面上的接触表面（11）连接到所述导电结构（2）的所述部分（12） ，并且接触面（11）没有角部。
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