公开(公告)号：US20060102830A1

公开(公告)日：2006-05-18

申请号：US11271773

申请日：2005-11-14

Applicant: Boaz Brill ,  Moshe Finarov ,  David Scheiner

Inventor： Boaz Brill ,  Moshe Finarov ,  David Scheiner

IPC: H01J40/14 ,  G02F1/01 ,  G01N21/86

CPC classification number: G03F7/70633 ,  G01B11/14 ,  G01B11/27 ,  G01N21/4788 ,  G01N21/9501 ,  G01N21/956 ,  H01L22/12

Abstract: Alignment of layers during manufacture of a multi-layer sample is controlled by applying optical measurements to a measurement site in the sample. The measurement site includes two diffractive structures located one above the other in two different layers, respectively. The optical measurements comprise at least two measurements with different polarization states of incident light, each measurement including illuminating eh measurement site so as to illuminate one of the diffractive structures through the other. The diffraction properties of the measurement site are indicative of a lateral shift between eth diffractive structures. The diffraction properties detected are analyzed for the different polarization states of the incident light to determine an existing lateral shift between the layers.

公开(公告)号：US07019850B2

公开(公告)日：2006-03-28

申请号：US10259828

申请日：2002-09-30

Applicant: Moshe Finarov

Inventor： Moshe Finarov

IPC: G01B11/28

CPC classification number: G01N21/8422 ,  G01B11/0625 ,  G01N21/211 ,  G01N21/3563 ,  G01N21/9501

Abstract: A method and system are presented for optical measurements in multi-layer structures to determine the properties of at least some of the layers. The structure is patterned by removing layer materials within a measurement site of the structure from the top layer to the lowermost layer of interest. Optical measurements are sequentially applied to the layers, by illuminating a measurement area in the layer under measurements, when the layer material above said layer under measurements is removed, thereby obtaining measured data portions for the at least some of the layers, respectively. The properties of each of the at least some layers are calculated, by analyzing the measured data portion of the lowermost layer, and then sequentially interpreting the measured data portions of all the other layers towards the uppermost layer, while utilizing for each layer the calculation results of the one or more underlying layers.

公开(公告)号：US06764379B2

公开(公告)日：2004-07-20

申请号：US09729441

申请日：2000-12-04

Applicant: Moshe Finarov

Inventor： Moshe Finarov

IPC: B24B4912

CPC classification number: B05C11/1005 ,  B24B37/013 ,  B24B49/04 ,  B24B49/12

Abstract: A method and system are presented for monitoring a process sequentially applied to a stream of substantially identical articles by a processing tool, so as to terminate the operation of the processing tool upon detecting an end-point signal corresponding to a predetermined value of a desired parameter of the article being processed. The article is processed with the processing tool. Upon completing the processing in response to the end-point signal generated by an end-point detector continuously operating during the processing of the article, integrated monitoring is applied to the processed article to measure the value of the desired parameter. The measured value of the desired parameter is analyzed to determine a correction value thereof to be used for adjusting the end-point signal corresponding to the predetermined value of the desired parameter for terminating the processing of the next article in the stream.

Abstract translation: 提出了一种方法和系统，用于通过处理工具监视顺序地施加到基本上相同的物品流的处理，以便在检测到对应于期望参数的预定值的终点信号时终止处理工具的操作 的被处理物品。 文章用处理工具处理。 一旦响应由在物品处理过程中持续运行的端点检测器产生的终点信号完成处理，则将综合监控应用于经处理的物品以测量所需参数的值。 分析所需参数的测量值以确定其用于调整对应于期望参数的预定值的终点信号的修正值，以终止流中下一个物品的处理。

公开(公告)号：US06752689B2

公开(公告)日：2004-06-22

申请号：US09898467

申请日：2001-07-05

Applicant: Moshe Finarov

Inventor： Moshe Finarov

IPC: B24B100

CPC classification number: H01L21/6838 ,  B24B37/005 ,  B24B37/013 ,  B24B49/12 ,  H01L21/67253 ,  H01L22/12 ,  H01L22/20

Abstract: An optical system is disclosed for the inspection of wafers during polishing which also includes a measurement system for measuring the thickness of the wafers top layer. The optical system views the wafer through a window and includes a gripping system, which places the wafer in a predetermined viewing location while maintaining the patterned surface completely under water. The optical system also includes a pull-down unit for pulling the measurement system slightly below the horizontal prior to the measurement and returns the measuring system to the horizontal afterwards.

Abstract translation: 公开了一种用于在抛光期间检查晶片的光学系统，其还包括用于测量晶片顶层厚度的测量系统。 光学系统通过窗口观察晶片，并且包括夹持系统，其将晶片放置在预定的观察位置，同时将图案化表面完全保持在水下。 光学系统还包括一个下拉单元，用于在测量之前将测量系统稍微拉到水平面以下，然后将测量系统返回到水平面。

公开(公告)号：US06720568B2

公开(公告)日：2004-04-13

申请号：US09942968

申请日：2001-08-31

Applicant: Moshe Finarov ,  Yoel Cohen

Inventor： Moshe Finarov ,  Yoel Cohen

IPC: G01N2188

CPC classification number: G01N21/956

Abstract: A method and system are presented for inspecting a structure containing a pattern in the form of a surface relief fabricated by a pattern-creating tool applied to the structure. Reference data is provided being indicative of photometric intensities of light components of different wavelengths returned from a structure having a pattern similar to the pattern of the structure under inspection. Spectrophotometric measurements are continuously applied to successive locations within the surface relief on the structure so as to form a measurement slice thereon. Measured data in the form of a spectrum indicative of photometric intensities of light components of different wavelengths returned from the successive locations within the slice is detected and analyzed to determine whether it correlates with the reference data in accordance with predetermined criteria results.

Abstract translation: 提出了一种方法和系统，用于检查包含由应用于结构的图案生成工具制成的表面浮雕形式的结构。 提供了参考数据，其指示从具有与被检查结构的图案类似的图案的结构返回的不同波长的光分量的光度强度。 分光光度测量连续地施加到结构上的表面浮雕内的连续位置，以便在其上形成测量切片。 检测并分析表示从切片内的连续位置返回的不同波长的光成分的光度强度的光谱的测量数据，以根据预定的标准结果来确定它是否与参考数据相关。

公开(公告)号：US06643017B2

公开(公告)日：2003-11-04

申请号：US10184953

申请日：2002-07-01

Applicant: Yoel Cohen ,  Moshe Finarov

Inventor： Yoel Cohen ,  Moshe Finarov

IPC: G01J328

CPC classification number: G03F7/70558

Abstract: A method and measuring tool are presented for automatic control of photoresist-based processing of a workpiece progressing through a processing tool arrangement. Spectrophotometric measurements are applied to the workpiece prior to being processed, spectral characteristics of the workpiece are measured, thereby obtaining measured data indicative of at least one parameter of the workpiece that defines an optimal value of at least processing time parameter of the processing tool to be used in the processing of said workpiece to obtain certain process results. This data is analyzed to determine data indicative of the optimal value of said at least processing time parameter, and thereby enable calculation of a correction value to be applied to said processing time parameter prior to applying the processing tool to the workpiece.

公开(公告)号：USRE38153E1

公开(公告)日：2003-06-24

申请号：US09557938

申请日：2000-04-24

Applicant: Moshe Finarov

Inventor： Moshe Finarov

IPC: G01B1106

CPC classification number: G01B11/065 ,  G01B11/06 ,  G02B26/0816 ,  G02B26/10 ,  G03F7/70358 ,  G03F7/704 ,  G03F7/70483

Abstract: A two dimensional beam deflector is disclosed which deflects beams from multiple optical assemblies. The input of beams of the multiple optical assemblies follow parallel optical paths until deflection to a wafer. An ellipsometer using a two-dimensional beam deflector is also disclosed.

Abstract translation: 公开了一种二维光束偏转器，其偏转来自多个光学组件的光束。 多个光学组件的光束的输入遵循平行光路，直到偏转到晶片。 还公开了使用二维光束偏转器的椭偏仪。

公开(公告)号：US06424417B1

公开(公告)日：2002-07-23

申请号：US09206282

申请日：1998-12-07

Applicant: Yoel Cohen ,  Moshe Finarov

Inventor： Yoel Cohen ,  Moshe Finarov

IPC: G01B1100

CPC classification number: G03F7/70558

Abstract: A method and a system are presented for automatic optical control of at least one working parameter of a processing tool to be applied to a working area of a workpiece for providing certain process results. The at least one working parameter of the processing tool affects at least one parameter of the workpiece under processing. The processing tool has a preset value of the at least one working parameter prior to the processing of the workpiece. A measuring tool is applied to the workpiece prior to its processing by the processing tool for measuring the at least one parameter of the workpiece and generating measured data representative thereof. The measured data is analyzed with respect to the preset value of the working parameter and to the process results, so as to determine whether the preset value should be corrected for providing the certain process results when applying the processing tool to said workpiece. Upon detecting that the preset value should be corrected, calculating a correction value.

Abstract translation: 提出了一种方法和系统，用于对要施加到工件的工作区域的加工工具的至少一个工作参数进行自动光学控制，以提供某些处理结果。 加工工具的至少一个工作参数影响待处理的工件的至少一个参数。 处理工具在处理工件之前具有至少一个工作参数的预设值。 在通过加工工具处理之前将测量工具施加到工件，用于测量工件的至少一个参数并产生代表其的测量数据。 根据工作参数的预设值和过程结果对测量数据进行分析，以便在将加工工具应用于所述工件时确定是否应修正预设值以提供某些处理结果。 在检测到应该校正预设值时，计算校正值。

公开(公告)号：US06407809B1

公开(公告)日：2002-06-18

申请号：US09501230

申请日：2000-02-10

Applicant: Moshe Finarov ,  Natalie Levinsohn ,  Shay Ghilai

Inventor： Moshe Finarov ,  Natalie Levinsohn ,  Shay Ghilai

IPC: G01N2100

CPC classification number: G01N21/956 ,  G01N21/94 ,  G01N21/9501 ,  G01N2021/8825 ,  G01N2201/0635

Abstract: An optical inspection system is presented, aimed at detecting defects on a substantially flat workpiece having an axis of symmetry. The workpiece is supported on a stage so as to be in an inspection plane, the stage being mounted for rotation in a plane parallel to the inspection plane. A scanning apparatus is accommodated above the workpiece, and comprises an illumination assembly, a plurality of optical assemblies, and a plurality of area sensors. The illumination assembly produces a plurality of incident radiation components for illuminating a strip on the workpiece extending parallel to the axis symmetry between two opposite sides thereof. The optical assemblies are aligned along the axis of symmetry in a spaced-apart parallel relationship, and are mounted for reciprocating movement within a plane parallel to an inspection area that covers substantially a half of the workpiece. The area sensors are arranged in a predetermined manner, each area sensor being associated with a corresponding one of the optical assemblies for receiving a component of returned radiation and generating data representative thereof. The half of the workpiece is strip-by-strip inspected, then the stage with the workpiece is rotated by 180° and the other half of the workpiece is strip-by-strip inspected.

Abstract translation: 提出了一种光学检查系统，目的在于检测具有对称轴的基本平坦的工件上的缺陷。 工件被支撑在台面上以便在检查平面中，该台被安装成在与检查平面平行的平面中旋转。 扫描装置容纳在工件上方，并且包括照明组件，多个光学组件和多个区域传感器。 照明组件产生多个入射辐射部件，用于照射平行于其两个相对侧之间的轴对称的工件上的条带。 光学组件沿着对称轴线以间隔开的平行关系对准，并且被安装用于在平行于覆盖工件的大致一半的检查区域的平面内往复运动。 区域传感器以预定的方式布置，每个区域传感器与相应的一个光学组件相关联，用于接收返回的辐射的分量并产生代表其的数据。 工件的一半被逐条检查，然后工件的台面旋转180°，另一半工件被逐条检查。

公开(公告)号：US06368181B1

公开(公告)日：2002-04-09

申请号：US09498926

申请日：2000-02-04

Applicant: Eran Dvir ,  Moshe Finarov ,  Eli Haimovich ,  Beniamin Shulman

Inventor： Eran Dvir ,  Moshe Finarov ,  Eli Haimovich ,  Beniamin Shulman

IPC: B24B4900

CPC classification number: H01L21/6838 ,  B24B37/005 ,  B24B37/013 ,  B24B49/12 ,  H01L21/67253 ,  H01L22/12 ,  H01L22/20

Abstract: An optical system is disclosed for the inspection of wafers during polishing which also includes a measurement system for measuring the thickness of the wafer's top layer. The optical system views the wafer through a window and includes a gripping system, which places the wafer in a predetermined viewing location while maintaining the patterned surface completely under water. The optical system also includes a pull-down unit for pulling the measurement system slightly below the horizontal prior to the measurement and returns the measuring system to the horizontal afterwards.

Abstract translation: 公开了一种用于在抛光期间检查晶片的光学系统，其还包括用于测量晶片顶层厚度的测量系统。 光学系统通过窗口观察晶片，并且包括夹持系统，其将晶片放置在预定的观察位置，同时将图案化表面完全保持在水下。 光学系统还包括一个下拉单元，用于在测量之前将测量系统稍微拉到水平面以下，然后将测量系统返回到水平面。