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    COOLING APPARATUS, HEAT RECEIVING SECTION AND BOILING SECTION USED THEREIN, AND METHOD OF MANUFACTURING THE SAME
    12.
    发明申请
    COOLING APPARATUS, HEAT RECEIVING SECTION AND BOILING SECTION USED THEREIN, AND METHOD OF MANUFACTURING THE SAME 有权
    冷却装置，加热部分及其使用的沸腾部分及其制造方法

    公开(公告)号：US20150241096A1

    公开(公告)日：2015-08-27

    申请号：US14427487

    申请日：2013-07-19

    Applicant: NEC Corporation

    Inventor： Arihiro Matsunaga ,  Minoru Yoshikawa ,  Hitoshi Sakamoto ,  Akira Shoujiguchi ,  Masaki Chiba ,  Kenichi Inaba

    IPC: F25B39/02 ,  B23P15/26

    CPC classification number: F25B39/028 ,  B23P15/26 ,  H01L23/427 ,  H01L2924/0002 ,  Y10T29/49359 ,  H01L2924/00

    Abstract: In order to maintain a high cooling capability even in a case where a heating element has a lower calorific value, a boiling section of a heat receiving section in a phase change cooling apparatus includes a comb-shaped structure and a porous layer provided on a bottom portion of the comb-shaped structure between fins of the comb-shaped structure. With such a boiling section, a liquid film of a liquid phase refrigerant is forcedly made thinner. Thus, the liquid phase refrigerant is changed in phase into a gaseous phase refrigerant even in a case of a small difference between the temperature of the gaseous phase refrigerant and the temperature of the heat receiving surface.

    Abstract translation: 为了即使在加热元件具有较低的发热量的情况下也能保持高的冷却能力，相变冷却装置中的受热部的沸腾部分包括梳状结构和设置在底部的多孔层 该梳形结构的一部分在梳形结构的翅片之间。 通过这样的沸腾部分，强制使液相制冷剂的液膜变薄。 因此，即使在气相制冷剂的温度与受热面的温度之间的差异较小的情况下，液相制冷剂也相位变化为气相制冷剂。

    COOLING DEVICE AND ELECTRONIC DEVICE USING THE SAME
    13.
    发明申请
    COOLING DEVICE AND ELECTRONIC DEVICE USING THE SAME 审中-公开

    公开(公告)号：US20140331709A1

    公开(公告)日：2014-11-13

    申请号：US14370190

    申请日：2012-12-12

    Applicant: NEC Corporation

    Inventor： Masaki Chiba ,  Minoru Yoshikawa ,  Hitoshi Sakamoto ,  Akira Shoujiguchi ,  Kenichi Inaba ,  Arihiro Matsunaga

    IPC: H05K7/20 ,  F25B39/00 ,  F25B39/04 ,  F28D15/02 ,  F25B39/02

    CPC classification number: H05K7/2029 ,  F25B39/00 ,  F25B39/02 ,  F25B39/04 ,  F28D15/02 ,  F28D15/0266 ,  F28F13/06 ,  F28F2250/08 ,  H01L23/367 ,  H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  H05K7/20309 ,  H05K7/20318 ,  H01L2924/00

    Abstract: When a cooling device employing an ebullient cooling system is mounted in a low-profile electronic device, not only is it impossible to obtain the sufficient cooling performance, but also the cooling efficiency of the entire electronic device decreases, therefore, a cooling device according to an exemplary aspect of the invention includes evaporating means for storing a refrigerant; condensing means for condensing and liquefying a vapor-phase refrigerant vaporized in the evaporation means and radiating heat; a pipe connecting the evaporating means to the condensing means; and flow regulating means for regulating a flow direction of air passing through the condensing means, wherein the evaporating means and the condensing means are located on roughly the same level in the vertical direction; the evaporating means includes an evaporation container and bulkhead means for separating the refrigerant disposed in the evaporation container; the height of the bulkhead means is larger than or equal to the height of a vapor-liquid interface of the refrigerant and is smaller than the height of the evaporation container; the pipe includes a vapor pipe through which vapor-phase refrigerant flows and a liquid pipe through which condensed and liquefied liquid-phase refrigerant flows; the condensing means includes first condensing means and second condensing means which differ in condensing-means height which is defined as the height in vertical direction of a condensation container composing the condensing means, and the condensing-means height of the first condensing means is configured to be larger than the condensing-means height of the second condensing means; the first condensing means includes a vapor pipe connection portion which is connected to the vapor pipe at the position above the condensing-means height of the second condensing means in vertical direction; and the flow regulating means is disposed in the upper part of the second condensing means.

    ELECTRONIC SUBSTRATE HOUSING EQUIPMENT AND ELECTRIC APPARATUS
    14.
    发明申请
    ELECTRONIC SUBSTRATE HOUSING EQUIPMENT AND ELECTRIC APPARATUS 审中-公开
    电子基板外壳设备和电气设备

    公开(公告)号：US20140321056A1

    公开(公告)日：2014-10-30

    申请号：US14361930

    申请日：2012-11-16

    Applicant: NEC Corporation

    Inventor： Minoru Yoshikawa ,  Hitoshi Sakamoto ,  Masaki Chiba ,  Kenichi Inaba ,  Arihiro Matsunaga

    IPC: H05K7/20

    CPC classification number: H05K7/20354 ,  H05K7/20154 ,  H05K7/20727 ,  H05K7/20818

    Abstract: An electronic substrate 200A mounts a heater element 220. A chassis 300A houses an electronic substrate 200 in an airtight manner. A cooling unit 400 cools the electronic substrate 200. The cooling unit 400 includes a heat receiving part 410 and a heat radiation part 420. The heat receiving part 410 receives heat from the electronic substrate 200. The heat radiation part 420 is connected with the heat receiving part 410, and radiates heat from the electronic substrate 200 which has received by the heat receiving part 410. Further, the heat receiving part 410 is provided in the chassis 300A in an airtight manner, and the heat radiation part 420 is provided outside the chassis 300. As a result, efficient cooling is possible, and moreover, maintenance replacement work can be performed for each piece of electronic substrate housing equipment individually.

    Abstract translation: 电子基板200A安装加热元件220.底座300A以气密的方式容纳电子基板200。 冷却单元400冷却电子基板200.冷却单元400包括热接收部分410和散热部分420.热接收部分410从电子基板200接收热量。散热部分420与热量 接收部分410，并且从由热接收部分410接收的电子基板200辐射热量。此外，热接收部分410以气密的方式设置在机架300A中，并且散热部分420设置在 结果，可以有效地进行冷却，此外，可以分别对每个电子基板收纳设备执行维护更换工作。

    Electronic device and cooling system
    15.
    发明授权
    Electronic device and cooling system 有权

    公开(公告)号：US09820407B2

    公开(公告)日：2017-11-14

    申请号：US14768917

    申请日：2014-02-19

    Applicant: NEC Corporation

    Inventor： Hitoshi Sakamoto ,  Minoru Yoshikawa ,  Akira Shoujiguchi ,  Masaki Chiba ,  Kenichi Inaba ,  Arihiro Matsunaga

    IPC: H05K7/20 ,  G06F1/20

    CPC classification number: H05K7/20145 ,  G06F1/20 ,  H05K7/20154 ,  H05K7/202 ,  H05K7/205

    Abstract: An electronic board 200 has a heat generating component 220 mounted on it. An enclosure 300 houses the electronic board 200. A heat transport unit 400 is coupled to the enclosure 300 and transports heat generated by the heat generating component 220 to the outside. A heat receiving unit 510 is provided in a heat transport unit 400, 400A. The heat receiving unit 510 receives heat generated by the heat generating component 220. A heat dissipating unit 530 is provided in the heat transport unit 400 in such a manner that a portion of the heat dissipating unit 530 is exposed to outside air, and is coupled to the heat receiving unit 510. The heat dissipating unit 530 dissipates heat received by the heat receiving unit 510 to the outside. A guide duct unit 340 is formed into a tube interconnecting the heat generating component 220 and the heat receiving unit 510 in order to release heat of the heat generating component 220 to the heat receiving unit 510. This enables the heat generating component on the electronic board to be efficiently cooled with a small and simple configuration.

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