公开(公告)号：US20220139893A1

公开(公告)日：2022-05-05

申请号：US17573633

申请日：2022-01-12

Applicant: NICHIA CORPORATION

Inventor： Takashi ISHII ,  Dai WAKAMATSU ,  Hiroaki KAGEYAMA

IPC: H01L25/16 ,  H01L33/50 ,  H01L33/56 ,  H01L33/48 ,  H01L33/64

Abstract: A light emitting device including a plurality of element structures each including a submount, a light emitting element, and a light transmissive member, in this order. The light emitting device further includes a first cover member holding the element structures by covering lateral faces of each of the element structures.

公开(公告)号：US20210005590A1

公开(公告)日：2021-01-07

申请号：US16917903

申请日：2020-07-01

Applicant: NICHIA CORPORATION

Inventor： Takashi ISHII ,  Dai WAKAMATSU ,  Hiroaki KAGEYAMA

IPC: H01L25/16 ,  H01L33/50 ,  H01L33/56 ,  H01L33/64 ,  H01L33/48

Abstract: A method of manufacturing a light emitting device includes: providing a plurality of first element structures each including a submount, a light emitting element, and a light transmissive member, in this order; disposing the first element structures on a sheet member such that the submount in each of the first element structures faces the sheet member; and forming a first cover member on the sheet member so as to cover lateral faces of the first element structures.

公开(公告)号：US20180351043A1

公开(公告)日：2018-12-06

申请号：US16100104

申请日：2018-08-09

Applicant: Nichia Corporation

Inventor： Keiji EMURA ,  Yoshiki INOUE ,  Hiroaki KAGEYAMA

IPC: H01L33/38

CPC classification number: H01L33/382 ,  H01L33/387 ,  H01L33/504

Abstract: Provided are a light emitting element and a light emitting device with improved light emission intensity distribution. A light emitting element includes a light-transmissive substrate, an n-type semiconductor layer, a first p-type semiconductor layer, a first p-side electrode, a first n-side electrode, a second p-type semiconductor layer, a second p-side electrode, and a second n-side electrode. A light emitting device includes the light emitting element, and an external connection electrode provided at the light emitting element on a side opposite to the light-transmissive substrate. The external connection electrode includes an n-side external connection electrode connected to the first n-side electrode and the second n-side electrode, a first p-side external connection electrode connected to the first p-side electrode, and a second p-side external connection electrode connected to the second p-side electrode.

公开(公告)号：US20160351756A1

公开(公告)日：2016-12-01

申请号：US14726641

申请日：2015-06-01

Applicant: NICHIA CORPORATION

Inventor： Takuya NOICHI ,  Hiroaki KAGEYAMA

IPC: H01L33/50 ,  H01L33/56

CPC classification number: H01L33/38

Abstract: A light emitting device includes a base structure and a light emitting element. The light emitting element includes a first electrode and a second electrode. The first electrode includes a first electrode surface. The second electrode is separately provided from the first electrode. The second electrode includes a second electrode surface. The second electrode surface is spaced apart from the first electrode surface in a second direction different from a first direction. The second electrode surface includes a first part and a second part. The first part extends in a third direction different from each of the first direction and the second direction. The second part extends from the first part in the second direction. At least part of the second part has a curved profile extending from the first part when viewed in the first direction.

Abstract translation: 发光器件包括基底结构和发光元件。 发光元件包括第一电极和第二电极。 第一电极包括第一电极表面。 第二电极与第一电极分开设置。 第二电极包括第二电极表面。 第二电极表面在与第一方向不同的第二方向上与第一电极表面间隔开。 第二电极表面包括第一部分和第二部分。 第一部分沿与第一方向和第二方向不同的第三方向延伸。 第二部分从第二个方向的第一部分延伸出来。 当从第一方向观察时，第二部分的至少一部分具有从第一部分延伸的弯曲轮廓。

公开(公告)号：US20230207724A1

公开(公告)日：2023-06-29

申请号：US18068245

申请日：2022-12-19

Applicant: NICHIA CORPORATION

Inventor： Hiroaki KAGEYAMA

IPC: H01L33/00 ,  H01L25/075 ,  H01L33/46

CPC classification number: H01L33/0093 ,  H01L25/0753 ,  H01L33/46 ,  H01L24/13

Abstract: A method for manufacturing a light-emitting device includes: providing an intermediate body having a first ultraviolet transmitting layer, a first adhesive layer, a plurality of first light emitting elements, a second adhesive layer, and a second ultraviolet transmitting layer; disposing on the second ultraviolet transmitting layer of the intermediate body, an ultraviolet shielding layer in a region corresponding to a part of the first light-emitting elements; performing first ultraviolet irradiation of irradiating the intermediate body with ultraviolet from a direction facing the ultraviolet shielding layer; performing second ultraviolet irradiation of irradiating the intermediate body with ultraviolet from a direction facing the first ultraviolet transmitting layer; and separating the part of the first light-emitting elements from the first adhesive layer along with the second adhesive layer.

公开(公告)号：US20220029079A1

公开(公告)日：2022-01-27

申请号：US17378422

申请日：2021-07-16

Applicant: NICHIA CORPORATION

Inventor： Hiroaki KAGEYAMA

IPC: H01L33/64

Abstract: A light emitting element includes: a semiconductor layered structure; a first electrically insulating film covering surfaces of the semiconductor layered structure and defining a first opening in each of a first region and a second region of a first semiconductor layer, and defining a second opening in a portion above a second semiconductor layer; a first electrode electrically connected to the first semiconductor layer through each first opening; a second electrode electrically connected to the second semiconductor layer through the second opening; a first terminal located on the first electrode and electrically connected to the first electrode; a second terminal located on the second electrode and electrically connected to the second electrode; and a metal member located on a portion of the first electrically insulating film located over the second semiconductor layer and electrically insulated from the first terminal and the second terminal.

公开(公告)号：US20210091051A1

公开(公告)日：2021-03-25

申请号：US17024704

申请日：2020-09-18

Applicant: NICHIA CORPORATION

Inventor： Takashi ISHII ,  Dai WAKAMATSU ,  Hiroaki KAGEYAMA

IPC: H01L25/075 ,  H01L33/62 ,  H01L33/60 ,  H01L25/16

Abstract: A method of manufacturing a light-emitting device that includes providing a plurality of element structures, each of which includes a submount substrate, a light-emitting element, and a light-transmissive member in this order. The method further includes disposing the plurality of element structures such that the light-transmissive members face a sheet member, and forming a covering member on the sheet member to cover at least a portion of each of lateral surfaces of the submount substrate of each of the element structures.

公开(公告)号：US20210066387A1

公开(公告)日：2021-03-04

申请号：US17002377

申请日：2020-08-25

Applicant: NICHIA CORPORATION

Inventor： Hiroaki KAGEYAMA

IPC: H01L27/15 ,  H01L25/18

Abstract: A light-emitting device includes: a circuit board; and a light-emitting element mounted on the circuit board, the light-emitting element including: a substrate provided on the circuit board, the substrate having a first side along a first direction and a second side along the first direction, wherein a second direction from the first side toward the second side being is orthogonal to the first direction; n semiconductor stacked bodies (n being a natural number of 2 or more) provided on the substrate, the n semiconductor stacked bodies comprising a first semiconductor stacked body and a second semiconductor stacked body that are electrically insulated from each other; and n+1 interconnect layers.

公开(公告)号：US20170018694A1

公开(公告)日：2017-01-19

申请号：US15210302

申请日：2016-07-14

Applicant: NICHIA CORPORATION

Inventor： Keiji EMURA ,  Yoshiki INOUE ,  Hiroaki KAGEYAMA

IPC: H01L33/58 ,  H01L33/24 ,  H01L33/60 ,  H01L33/50 ,  H01L33/38 ,  H01L33/40

CPC classification number: H01L33/382 ,  H01L33/387 ,  H01L33/504

Abstract: Provided are a light emitting element and a light emitting device with improved light emission intensity distribution. A light emitting element includes a light-transmissive substrate, an n-type semiconductor layer, a first p-type semiconductor layer, a first p-side electrode, a first n-side electrode, a second p-type semiconductor layer, a second p-side electrode, and a second n-side electrode. A light emitting device includes the light emitting element, and an external connection electrode provided at the light emitting element on a side opposite to the light-transmissive substrate. The external connection electrode includes an n-side external connection electrode connected to the first n-side electrode and the second n-side electrode, a first p-side external connection electrode connected to the first p-side electrode, and a second p-side external connection electrode connected to the second p-side electrode.

Abstract translation: 提供了一种具有改善的发光强度分布的发光元件和发光器件。 发光元件包括透光性基板，n型半导体层，第一p型半导体层，第一p侧电极，第一n侧电极，第二p型半导体层，第二p型半导体层 p侧电极和第二n侧电极。 发光装置包括发光元件和设置在发光元件的与透光性基板相反的一侧的外部连接电极。 外部连接电极包括连接到第一n侧电极和第二n侧电极的n侧外部连接电极，连接到第一p侧电极的第一p侧外部连接电极和第二p侧电极， 连接到第二p侧电极的侧面外部连接电极。

公开(公告)号：US20160343926A1

公开(公告)日：2016-11-24

申请号：US15160526

申请日：2016-05-20

Applicant: NICHIA CORPORATION

Inventor： Hiroaki KAGEYAMA

IPC: H01L33/62 ,  H01L33/06 ,  H01L33/38

CPC classification number: H01L33/38

Abstract: A light-emitting element includes a semiconductor layered body comprising: an n-type semiconductor layer, and p-type semiconductor layer; an insulating film disposed on the semiconductor layered body and defining at least one p-side opening above the p-type semiconductor layer and a plurality of n-side openings exposing the n-type semiconductor layer; an n-side electrode disposed on the insulating film and comprising a plurality of first n-contact portions each electrically connected to the n-type semiconductor layer through one of the plurality of n-side openings; a p-side electrode electrically connected to the p-type semiconductor layer through the at least one p-side opening; a p-side post electrode disposed on the p-side electrode; and an n-side post electrode disposed on the n-side electrode. A total area of one or more first n-contact portions located on the second side is smaller than a total area of one or more first n-contact portion located on the first side.

Abstract translation: 发光元件包括：半导体层叠体，包括：n型半导体层和p型半导体层; 绝缘膜，设置在半导体层叠体上并限定p型半导体层上方的至少一个p侧开口和暴露n型半导体层的多个n侧开口; n侧电极，设置在所述绝缘膜上，并且包括多个第一n接触部分，每个第n个n接触部分通过所述多个n侧开口之一电连接到所述n型半导体层; 通过所述至少一个p侧开口与p型半导体层电连接的p侧电极; 设置在p侧电极上的p侧电极; 以及设置在n侧电极上的n侧电极。 位于第二侧的一个或多个第一n接触部分的总面积小于位于第一侧上的一个或多个第一n接触部分的总面积。