公开(公告)号：US20200243710A1

公开(公告)日：2020-07-30

申请号：US16774565

申请日：2020-01-28

Applicant: NICHIA CORPORATION

Inventor： Hiroyuki TANAKA ,  Yasuo KATO ,  Kazuya MATSUDA

IPC: H01L33/00 ,  H01L25/075

Abstract: A method of manufacturing light emitting devices, the method including: providing a first structure, the providing a first structure including: providing a lead frame, the providing a lead frame including: providing a metal plate having a plurality of pairs of first and second metal parts, each of the first and second metal parts including at least one first region and at least one second region; using an electrodeposition technique, disposing a mask of a resist film on the at least one first region; disposing a first plating containing silver or silver alloy on the at least one second region; and removing the resist film; molding a resin molded body in one piece with the lead frame with parts of a lower surface of the lead frame being exposed, in which, the first structure includes an upper surface defining a plurality of recesses each having an upward-facing surface, at least parts of the first plating being located at the upward-facing surface of each of the plurality of recesses; providing a second structure, the providing a second structure including: disposing at least one light-emitting element on the first plating located at the upward-facing surface of each of the plurality of recesses; and disposing a sealing member covering the at least one light-emitting element in each of the plurality of recesses; and separating the second structure into a plurality of individual light emitting devices.

公开(公告)号：US20200212274A1

公开(公告)日：2020-07-02

申请号：US16720681

申请日：2019-12-19

Applicant: NICHIA CORPORATION

Inventor： Kazuya MATSUDA ,  Yasuo KATO ,  Hiroyuki TANAKA

IPC: H01L33/56 ,  H01L33/62 ,  H01L33/46 ,  H01L33/48

Abstract: A resin package defining a recess includes a first lead having an element-mounting region, a second lead having a wire-connecting region, and a resin body including first to third resin portions. The third resin portion surrounds the element-mounting region. Each of the first and second leads includes a first plating and a second plating covering at least a portion of the first plating. The wire-connecting region is located outward of the third resin portion. The element-mounting region is located on an outermost surface of the second plating. In a top view, the wire-connecting region is located laterally inward of a portion of the second plating of the second lead that has an outermost surface located higher than that of the first plating of the second lead.

公开(公告)号：US20200176649A1

公开(公告)日：2020-06-04

申请号：US16698324

申请日：2019-11-27

Applicant: NICHIA CORPORATION

Inventor： Hiroyuki TANAKA ,  Yasuo KATO ,  Kazuya MATSUDA

IPC: H01L33/56 ,  H01L33/62 ,  H01L33/54

Abstract: A method of manufacturing a light emitting device, including: providing a first structure including: providing a lead frame which includes providing a metal plate including a plurality of pairs of first and second metal parts, each metal part including an upper surface, a lower surface, and an end surface, the end surface of the first metal part and the end surface of the second metal part of each pair are opposite to each other, and a first region including the end surface, and disposing a mask of a resist film on the first region using an electrodeposition technique, disposing a first plated layer containing gold or gold alloy on a second region including the upper surface other than the first region on at least one of the upper surface, the lower surface, and the end surface of each of the first and second metal parts using a plating technique, and removing the resist film, providing a resin molded body molded integrally with the lead frame with parts of a lower surface of the lead frame being exposed, in which the first structure includes an upper surface defining a plurality of recesses each having an upward-facing surface, the first plated layer on the upper surface of the metal part is located at the upward-facing surface of each of the plurality of recesses; providing a second structure, the providing a second structure including; disposing at least one light-emitting element on the upward-facing surface each of the plurality of recesses, disposing a sealing member covering the at least one light-emitting element in each of the plurality of recesses; and separating the second structure into a plurality of discrete light emitting devices.

公开(公告)号：US20180226544A1

公开(公告)日：2018-08-09

申请号：US15886726

申请日：2018-02-01

Applicant: NICHIA CORPORATION

Inventor： Mitsuhiro ISONO ,  Kensuke MAEHARA ,  Kazuya MATSUDA ,  Takaaki KATO

IPC: H01L33/48 ,  H01L33/54 ,  H01L33/62 ,  H01L33/60 ,  H01L33/50 ,  H01L33/56

CPC classification number: H01L33/486 ,  H01L33/46 ,  H01L33/504 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48247 ,  H01L2224/49113 ,  H01L2933/0033 ,  H01L2933/0041 ,  H01L2933/0058

Abstract: A light emitting device includes: a resin package including: a first lead including: at least one notch extending from an upper surface of the first lead to a lower surface of the first lead, a first groove formed in the upper surface of the first lead, and at least one second groove connecting the first groove with the at least one notch, and a second lead, and a resin body including: a first resin portion, a second resin portion, a part of the second resin portion being disposed in the first groove, a third resin portion disposed between the first lead and the second lead, and a first resin connecting portion connecting the first resin portion with the second resin portion, at least a part of the first resin connecting portion being disposed in the at least one second groove; a light emitting element; and a light reflecting member.