公开(公告)号：US11063192B2

公开(公告)日：2021-07-13

申请号：US15220681

申请日：2016-07-27

Applicant: NICHIA CORPORATION

Inventor： Hiroto Tamaki ,  Yoshiki Sato ,  Yoichi Bando

IPC: H01L33/52 ,  H01L33/50 ,  H01L33/46 ,  H01L33/60 ,  H01L33/56

Abstract: A light emitting device is provided. The light emitting device includes a light emitting element, a wavelength converting member, a light transmissive member, an adhesive member, and a light reflective member. The wavelength converting member has an upper surface and lateral surfaces, contains a fluorescent substance, and is placed on the light emitting element. The light transmissive member covers the upper surface of the wavelength converting member. The adhesive member is interposed between the light emitting element and the wavelength converting member, and covers the lateral surfaces of the wavelength converting member. The light reflective member covers the lateral surfaces of the wavelength converting member via the adhesive member.

公开(公告)号：US11056627B2

公开(公告)日：2021-07-06

申请号：US16784387

申请日：2020-02-07

Applicant: NICHIA CORPORATION

Inventor： Suguru Beppu ,  Yoichi Bando ,  Hiroto Tamaki ,  Takuya Nakabayashi

IPC: H01L33/60 ,  H01L33/50 ,  H01L21/3213

Abstract: A light emitting device includes: a light emitting element; a wavelength conversion member disposed on or above an upper surface of the light emitting element; a light-transmissive member disposed on an upper surface of the wavelength conversion member; and a light reflective member disposed on each side surface of the light emitting element, the wavelength conversion member, and the light-transmissive member, wherein an upper surface of the light reflective member is coplanar with an upper surface of the light-transmissive member, and wherein each of the upper surface of the light reflective member and the upper surface of the light-transmissive member is a cut surface.

公开(公告)号：US09947846B2

公开(公告)日：2018-04-17

申请号：US15280535

申请日：2016-09-29

Applicant: NICHIA CORPORATION

Inventor： Yoichi Bando

IPC: H01L33/50 ,  H01L33/60 ,  H01L33/38 ,  H01L33/62

CPC classification number: H01L33/60 ,  H01L33/38 ,  H01L33/50 ,  H01L33/507 ,  H01L33/56 ,  H01L33/62 ,  H01L2933/0041 ,  H01L2933/0058

Abstract: A method of manufacturing a light emitting device includes providing a reflecting sheet having a first surface and a second surface and defining through-holes; placing a wavelength-converting sheet on a first surface side of the reflecting sheet to cover openings of the through-holes at the first surface side; disposing a light-transmissive adhesive in the through-holes; disposing a light emitting element in each of the through-holes so that a light emitting surface of the light emitting element faces the wavelength converting sheet; fixing the light emitting element in the through-hole via the adhesive; and covering the second surface of the reflecting sheet and an outer surface of the adhesive with a reflecting material.

公开(公告)号：US09666774B2

公开(公告)日：2017-05-30

申请号：US14866317

申请日：2015-09-25

Applicant: Nichia Corporation

Inventor： Suguru Beppu ,  Yoichi Bando ,  Hiroto Tamaki ,  Takuya Nakabayashi

IPC: H01L33/60 ,  H01L33/50

CPC classification number: H01L33/60 ,  H01L33/50 ,  H01L2224/73253 ,  H01L2933/0033 ,  H01L2933/0041 ,  H01L2933/0058

Abstract: A light emitting device includes a semiconductor light emitting element; and a light reflective member having a multilayer structure and covering the side faces of the semiconductor light emitting element. The light reflective member includes: a first layer disposed on an inner, semiconductor light emitting element side, the first layer comprising a light-transmissive resin containing a light reflective substance, and a second layer disposed in contact with an outer side of the first layer, the second layer comprising a light-transmissive resin containing the light reflective substance at a lower content than that of the first layer.