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公开(公告)号:US20180070438A1
公开(公告)日:2018-03-08
申请号:US15696270
申请日:2017-09-06
Applicant: Nitto Denko Corporation
Inventor: Daisuke YAMAUCHI , Hiroyuki TANABE
CPC classification number: H05K1/0224 , G11B5/484 , G11B5/486 , H05K1/0228 , H05K1/056 , H05K1/09 , H05K1/115 , H05K3/4038 , H05K3/4644 , H05K2201/0154 , H05K2201/0195 , H05K2201/09227 , H05K2201/09254 , H05K2201/093 , H05K2201/10083
Abstract: In a suspension board, a first insulating layer is formed on a support substrate. A ground layer and a power wiring trace are formed on the first insulating layer. The ground layer has electric conductivity higher than that of the support substrate. A second insulating layer is formed on the first insulating layer to cover the ground layer and the power wiring trace. A write wiring trace is formed on the second insulating layer to overlap with the ground layer. In a stacking direction of the support substrate, the first insulating layer and the second insulating layer, a distance between the ground layer and the write wiring trace is larger than a distance between the power wiring trace and the write wiring trace.
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公开(公告)号:US20170339786A1
公开(公告)日:2017-11-23
申请号:US15671549
申请日:2017-08-08
Applicant: NITTO DENKO CORPORATION
Inventor: Hiroyuki TANABE , Naohiro TERADA , Yuu SUGIMOTO , Daisuke YAMAUCHI
CPC classification number: H05K1/05 , G11B5/4826 , G11B5/484 , G11B5/4853 , H05K1/0278 , H05K1/0393 , H05K1/11 , H05K1/18 , H05K1/181 , H05K3/4007 , H05K3/44 , H05K2201/10151 , H05K2201/10227
Abstract: A suspension board with circuit includes a metal supporting board, a base insulating layer disposed at one side in a thickness direction of the metal supporting board, and a conductor layer disposed at one side in the thickness direction of the base insulating layer and including a connecting terminal electrically connected to a slider. The base insulating layer has a terminal region, when projected in the thickness direction, overlapped with at least the connecting terminal and a circumferential region not overlapped with the terminal region and around the terminal region, and the thickness of the terminal region is thicker than that of the circumferential region.
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公开(公告)号:US20130170076A1
公开(公告)日:2013-07-04
申请号:US13723842
申请日:2012-12-21
Applicant: NITTO DENKO CORPORATION
Inventor: Naotaka HIGUCHI , Hitoki KANAGAWA , Tetsuya OHSAWA , Daisuke YAMAUCHI
IPC: G11B21/02
CPC classification number: G11B21/02 , G11B5/4826 , G11B5/4853 , G11B5/5552 , G11B5/596
Abstract: A suspension board with circuit includes a mounting portion for mounting thereon a slider, a supporting portion for supporting one end portion of the mounting portion, a facing portion facing the mounting portion to be spaced apart therefrom, and a driving portion provided between the mounting portion and the facing portion. The driving portion includes a heater; and an expansive portion which is thermally expanded by heat generated from the heater.
Abstract translation: 具有电路的悬挂板包括用于安装滑动件的安装部分,用于支撑安装部分的一个端部的支撑部分,面对安装部分的与其间隔开的面对部分,以及设置在安装部分之间的驱动部分 和面对部分。 驱动部分包括加热器; 以及由加热器产生的热量热膨胀的膨胀部分。
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