公开(公告)号：US20180070438A1

公开(公告)日：2018-03-08

申请号：US15696270

申请日：2017-09-06

Applicant: Nitto Denko Corporation

Inventor： Daisuke YAMAUCHI ,  Hiroyuki TANABE

IPC: H05K1/02 ,  H05K1/05 ,  H05K1/11 ,  H05K3/46 ,  G11B5/48

CPC classification number: H05K1/0224 ,  G11B5/484 ,  G11B5/486 ,  H05K1/0228 ,  H05K1/056 ,  H05K1/09 ,  H05K1/115 ,  H05K3/4038 ,  H05K3/4644 ,  H05K2201/0154 ,  H05K2201/0195 ,  H05K2201/09227 ,  H05K2201/09254 ,  H05K2201/093 ,  H05K2201/10083

Abstract: In a suspension board, a first insulating layer is formed on a support substrate. A ground layer and a power wiring trace are formed on the first insulating layer. The ground layer has electric conductivity higher than that of the support substrate. A second insulating layer is formed on the first insulating layer to cover the ground layer and the power wiring trace. A write wiring trace is formed on the second insulating layer to overlap with the ground layer. In a stacking direction of the support substrate, the first insulating layer and the second insulating layer, a distance between the ground layer and the write wiring trace is larger than a distance between the power wiring trace and the write wiring trace.

公开(公告)号：US20170339786A1

公开(公告)日：2017-11-23

申请号：US15671549

申请日：2017-08-08

Applicant: NITTO DENKO CORPORATION

Inventor： Hiroyuki TANABE ,  Naohiro TERADA ,  Yuu SUGIMOTO ,  Daisuke YAMAUCHI

IPC: H05K1/05 ,  H05K1/11 ,  G11B5/48 ,  H05K3/40 ,  H05K3/44

CPC classification number: H05K1/05 ,  G11B5/4826 ,  G11B5/484 ,  G11B5/4853 ,  H05K1/0278 ,  H05K1/0393 ,  H05K1/11 ,  H05K1/18 ,  H05K1/181 ,  H05K3/4007 ,  H05K3/44 ,  H05K2201/10151 ,  H05K2201/10227

Abstract: A suspension board with circuit includes a metal supporting board, a base insulating layer disposed at one side in a thickness direction of the metal supporting board, and a conductor layer disposed at one side in the thickness direction of the base insulating layer and including a connecting terminal electrically connected to a slider. The base insulating layer has a terminal region, when projected in the thickness direction, overlapped with at least the connecting terminal and a circumferential region not overlapped with the terminal region and around the terminal region, and the thickness of the terminal region is thicker than that of the circumferential region.

公开(公告)号：US20130170076A1

公开(公告)日：2013-07-04

申请号：US13723842

申请日：2012-12-21

Applicant: NITTO DENKO CORPORATION

Inventor： Naotaka HIGUCHI ,  Hitoki KANAGAWA ,  Tetsuya OHSAWA ,  Daisuke YAMAUCHI

IPC: G11B21/02

CPC classification number: G11B21/02 ,  G11B5/4826 ,  G11B5/4853 ,  G11B5/5552 ,  G11B5/596

Abstract: A suspension board with circuit includes a mounting portion for mounting thereon a slider, a supporting portion for supporting one end portion of the mounting portion, a facing portion facing the mounting portion to be spaced apart therefrom, and a driving portion provided between the mounting portion and the facing portion. The driving portion includes a heater; and an expansive portion which is thermally expanded by heat generated from the heater.

Abstract translation: 具有电路的悬挂板包括用于安装滑动件的安装部分，用于支撑安装部分的一个端部的支撑部分，面对安装部分的与其间隔开的面对部分，以及设置在安装部分之间的驱动部分 和面对部分。 驱动部分包括加热器; 以及由加热器产生的热量热膨胀的膨胀部分。