Abstract:
These compounds contain an oxetane functionality and a styrenic functionality. The oxetane functionality is homopolymerizable in reactions that undergo cationic or anionic ring opening, and the styrenic is polymerizable with compounds such as electron acceptor compounds. The dual functionality allows for dual cure processing. The compounds will have the structure in which R1 is a methyl or ethyl group; R2 and R3 are H or a methyl or ethyl group; R4 is a direct bond or a divalent hydrocarbon; X and Y are independently a direct bond or an ether, ester, amide, or carbamate group, provided both X and Y are not a direct bond; Q is a divalent hydrocarbon (which may contain heteroatoms of N, O, or S); and G is —OR1, —SR1, or —N(R2)(R3), in which R1, R2 and R3 are as described above.
Abstract:
Isocyanurate compounds or resins have the structure (I) in which Y is an hydroxyl group —OH or a maleimide group Formula (II) provided that at least one maleimide group is present, and Q is any divalent organic moiety, aliphatic or aromatic.
Abstract:
A linear or cyclic siloxane compound contains pendant carbon to carbon double bonds, Si—H bonds, and pendant oxetane functionality. These compounds have two curing temperatures, one associated with a hydrosilation reaction between the carbon to carbon double bond and the Si—H entity, and the other associated with the ring opening of the oxetane.
Abstract:
A conductive resin composition containing a curable resin, such as an adhesive resin, and a conductive metal filler, has improved conductivity through the addition of a metal salt of a carboxylic acid to the composition.
Abstract:
An assembly of a semiconductor die attached to a substrate is made with a composition comprising compounds that contain an oxazoline functionality and an electron acceptor or an electron donor functionality. Electron donor functionalities include styrenic, cinnamyl, and vinyl ether groups. Electron acceptor functionalities include maleimide, acrylate, fumarate, and maleate groups. An exemplary compound has the structure: formula (I).
Abstract:
Compositions containing oxetane compounds having ester, amide, urea, carbamate, carbonate, or carbonyl functionality one carbon atom removed from the oxetane ring cure at high temperatures are suitable for use as underfill materials within a semiconductor package, particularly in applications using lead free solder electrical interconnections. A suitable oxetane compound has the structure:
Abstract:
A polymer is prepared from monomers containing at least one carbon to carbon double bond and at least one siloxane moiety and from monomers containing at least one carbon to carbon double bond and at least one moiety that imparts reactivity to the resulting polymer. Siloxane moieties impart permeability; reactivity is obtained from monomers containing epoxy, oxetane, oxazoline, benzoxazine, or episulfide functionality. Additional properties can be added to the polymer by the inclusion in the initial polymerization mix of monomers that impart low glass transition temperature, high glass transition temperature, and adhesion. The level of each functionality can be controlled by the practitioner by varying the amount of monomer containing that functionality added to the initial polymerization. These materials can be B-staged.
Abstract:
Adhesive compositions exhibit improved adhesion and conductivity by the addition of a metal salt of 8-quinolinol or of an 8-quinolinol derivative as a corrosion inhibitor. The metal salt of 8-quinolinol or of an 8-quinolinol derivative is formed by coordination with a metal selected from the group consisting of Cu, Be, Mg, Ca, Sr, Ba, Zn, Cd, Al, Ga, In, TI, Yt, La, Pb, Sb, Bi, Cr, Mo, Mn, Fe, Co, Ni, Pd, Ce, and Pr. Examples of quinolinol derivative salts have the structures:
Abstract:
Electron donor compounds, suitable for use as adhesives or as components in adhesives, contain a carbon to carbon double bond attached to an aromatic ring and conjugated with the unsaturation in the aromatic ring.