公开(公告)号：US20060263928A1

公开(公告)日：2006-11-23

申请号：US10555291

申请日：2004-02-17

Applicant: Osama Musa ,  Rushi Zhang

Inventor： Osama Musa ,  Rushi Zhang

IPC: H01L21/00 ,  H01L23/02

CPC classification number: C07D263/10 ,  C07D263/14 ,  C07D413/12 ,  C08G61/00 ,  C08G61/02 ,  C08G73/02 ,  H01L21/563 ,  H01L23/293 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29364 ,  H01L2224/29369 ,  H01L2224/29386 ,  H01L2224/29388 ,  H01L2224/29393 ,  H01L2224/73203 ,  H01L2224/8385 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/04642 ,  H01L2924/0503 ,  H01L2924/05432 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

Abstract: An assembly of a semiconductor die attached to a substrate is made with a composition comprising compounds that contain an oxazoline functionality and an electron acceptor or an electron donor functionality. Electron donor functionalities include styrenic, cinnamyl, and vinyl ether groups. Electron acceptor functionalities include maleimide, acrylate, fumarate, and maleate groups. An exemplary compound has the structure: formula (I).

公开(公告)号：US20070072966A1

公开(公告)日：2007-03-29

申请号：US11235991

申请日：2005-09-26

Applicant: Osama Musa ,  Harry Kuder

Inventor： Osama Musa ,  Harry Kuder

IPC: C08K5/34

CPC classification number: C08K5/0091 ,  C09J11/06 ,  H01L24/29 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/00

Abstract: Die attach adhesive compositions exhibit improved adhesion and conductivity by the addition of a metal salt of 8-quinolinol or of an 8-quinolinol derivative as an adhesion and/or conductivity promoter. The metal salt of 8-quinolinol or of an 8-quinolinol derivative is formed by coordination with a metal selected from the group consisting of Cu, Be, Mg, Ca, Sr, Ba, Zn, Cd, Al, Ga, In, Tl, Yt, La, Pb, Sb, Bi, Cr, Mo, Mn, Fe, Co, Ni, Pd, Ce, and Pr. Examples of quinolinol derivative salts have the structures:

Abstract translation: 贴附粘合剂组合物通过加入8-羟基喹啉或8-羟基喹啉衍生物的金属盐作为粘合和/或电导率促进剂，表现出改进的粘附性和导电性。 通过与选自Cu，Be，Mg，Ca，Sr，Ba，Zn，Cd，Al，Ga，In，Tl的金属配位形成8-羟基喹啉或8-羟基喹啉衍生物的金属盐 ，Yt，La，Pb，Sb，Bi，Cr，Mo，Mn，Fe，Co，Ni，Pd，Ce和Pr。 喹啉醇衍生物盐的实例具有以下结构：

公开(公告)号：US20060025509A1

公开(公告)日：2006-02-02

申请号：US10902555

申请日：2004-07-29

Applicant: Ruzhi Zhang ,  Osama Musa ,  Mark Bonneau

Inventor： Ruzhi Zhang ,  Osama Musa ,  Mark Bonneau

IPC: C08K5/09

CPC classification number: C08L63/00 ,  C07D265/16 ,  C08G61/122 ,  C08G73/06 ,  C08L79/04 ,  H01L21/563 ,  H01L23/293 ,  H01L2224/73203 ,  H01L2924/01322 ,  H01L2924/10253 ,  C08L2666/20 ,  C08L2666/22 ,  H01L2924/00

Abstract: Benzoxazine compounds can be cured with epoxies and fluxing agents to afford thermoset materials with particular utility as no-flow underfilling encapsulants within the semiconductor packaging industry.

Abstract translation: 苯并恶嗪化合物可以用环氧树脂和助熔剂固化，以提供具有特殊用途的热固性材料，作为半导体封装工业中的无填充密封剂。

公开(公告)号：US20070277907A1

公开(公告)日：2007-12-06

申请号：US11828640

申请日：2007-07-26

Applicant: Osama Musa

Inventor： Osama Musa

IPC: B23K35/362

CPC classification number: B23K35/362

Abstract: A method of fluxing a solder or a metal substrate uses a fluxing composition that comprises a fluxing agent, in which the fluxing agent is a benzotriazole or a benzotriazole adduct. The adduct contains a benzotriazole segment and a segment with a curable and polymerizable functionality.

Abstract translation: 焊剂或金属基材的助熔剂的方法使用包含助熔剂的助熔剂组合物，其中助熔剂是苯并三唑或苯并三唑加合物。 加合物含有苯并三唑段和具有可固化和可聚合官能团的链段。

公开(公告)号：US20070095432A1

公开(公告)日：2007-05-03

申请号：US11265577

申请日：2005-11-02

Applicant: Osama Musa

Inventor： Osama Musa

IPC: B23K35/362

CPC classification number: B23K35/362

Abstract: A fluxing composition comprises a fluxing agent, in which the fluxing agent is a benzotriazole or a benzotriazole adduct. The adduct contains a benzotriazole segment and a segment with a curable and polymerizable functionality.

Abstract translation: 助熔剂组合物包含助熔剂，其中助熔剂是苯并三唑或苯并三唑加合物。 加合物含有苯并三唑段和具有可固化和可聚合官能团的链段。

公开(公告)号：US20060272747A1

公开(公告)日：2006-12-07

申请号：US11144571

申请日：2005-06-03

Applicant: Renyi Wang ,  Zhen Liu ,  Lirong Bao ,  Trang Tran ,  Osama Musa

Inventor： Renyi Wang ,  Zhen Liu ,  Lirong Bao ,  Trang Tran ,  Osama Musa

IPC: B23K35/34

CPC classification number: H01L21/563 ,  B23K35/36 ,  B23K35/3612 ,  B23K35/3613 ,  B23K35/362 ,  H01L23/293 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/12044 ,  H05K3/3489 ,  H01L2924/00

Abstract: A fluxing composition comprises a fluxing agent in which the fluxing agent is a compound having (i) an aromatic ring, (ii) at least one —OH, —NHR (where R is hydrogen or lower alkyl), or —SH group (iii) an electron-withdrawing or electron-donating substituent on the aromatic ring, and (iv) no imino group.

Abstract translation: 助熔剂组合物包含助熔剂，其中助熔剂是具有（i）芳环，（ii）至少一个-OH，-NHR（其中R是氢或低级烷基）或-SH基团（iii）的化合物 ）芳环上的吸电子或给电子取代基，（iv）不含亚氨基。

公开(公告)号：US20060030672A1

公开(公告)日：2006-02-09

申请号：US11248490

申请日：2005-10-12

Applicant: Nikola Nikolic ,  Ruzhi Zhang ,  Osama Musa ,  Hwail Jin ,  Bing Wu

Inventor： Nikola Nikolic ,  Ruzhi Zhang ,  Osama Musa ,  Hwail Jin ,  Bing Wu

IPC: C08F267/10 ,  C08F32/00

CPC classification number: C08F267/10 ,  C08L25/00 ,  C08L33/00 ,  C08L55/00 ,  C09J5/10 ,  C09J11/06 ,  C09J2205/114 ,  C09J2425/00 ,  C09J2433/00 ,  C09J2455/00

Abstract: This invention is a film adhesive prepared from an adhesive composition comprising a polymer system, a film forming rubber compound, and curing agents for the polymeric system. The polymer system comprises a base polymer and electron donor and electron acceptor functionality.

公开(公告)号：US20050137340A1

公开(公告)日：2005-06-23

申请号：US11044374

申请日：2005-01-27

Applicant: Nikola Nikolic ,  Ruzhi Zhang ,  Osama Musa ,  Hwail Jin ,  Bing Wu ,  David Shenfield

Inventor： Nikola Nikolic ,  Ruzhi Zhang ,  Osama Musa ,  Hwail Jin ,  Bing Wu ,  David Shenfield

IPC: C09J7/00 ,  C08L25/00 ,  C08L33/00 ,  C08L55/00 ,  C09J5/10 ,  C09J11/06 ,  C09J109/02 ,  C09J125/08 ,  C09J133/00 ,  C09J133/20 ,  C09J157/00 ,  C09J201/00 ,  C09J201/02 ,  C08L1/00

CPC classification number: C08F267/10 ,  C08L25/00 ,  C08L33/00 ,  C08L55/00 ,  C09J5/10 ,  C09J11/06 ,  C09J2205/114 ,  C09J2425/00 ,  C09J2433/00 ,  C09J2455/00

Abstract: This invention is a film adhesive prepared from an adhesive composition comprising a polymer system, a film forming rubber compound, and curing agents for the polymeric system. The polymer system comprises a base polymer and electron donor and electron acceptor functionality.

Abstract translation: 本发明是由包含聚合物体系，成膜橡胶化合物和用于聚合物体系的固化剂的粘合剂组合物制备的薄膜粘合剂。 聚合物体系包括基础聚合物和电子给体和电子受体官能团。

公开(公告)号：US20070049665A1

公开(公告)日：2007-03-01

申请号：US11211920

申请日：2005-08-25

Applicant: Osama Musa ,  Harry Kuder

Inventor： Osama Musa ,  Harry Kuder

IPC: C08K5/34

CPC classification number: H01L24/83 ,  C08L33/00 ,  C08L63/00 ,  C08L79/08 ,  C09J11/06 ,  H01L24/29 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29364 ,  H01L2224/29369 ,  H01L2224/2937 ,  H01L2224/29386 ,  H01L2224/29388 ,  H01L2224/29393 ,  H01L2224/8385 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01059 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/0635 ,  H01L2924/00 ,  H01L2924/01028 ,  H01L2924/00014 ,  H01L2924/05432 ,  H01L2924/05442 ,  H01L2924/04642 ,  H01L2924/0503 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

Abstract: Die attach adhesive compositions comprise a quinolinol or a quinolinol derivative as an adhesion promoter. An exemplary quinolinol derivative has the structure:

Abstract translation: 贴附粘合剂组合物包含作为粘合促进剂的喹啉醇或羟基喹啉衍生物。 示例性的喹啉醇衍生物具有以下结构：

公开(公告)号：US20060025553A1

公开(公告)日：2006-02-02

申请号：US10901861

申请日：2004-07-29

Applicant: Osama Musa

Inventor： Osama Musa

IPC: C08G77/12 ,  C08G77/04 ,  C08L83/05

CPC classification number: C08G77/38 ,  C08L83/06

Abstract: A linear or cyclic siloxane compound contains pendant carbon to carbon double bonds, Si—H bonds, and pendant oxetane functionality. These compounds have two curing temperatures, one associated with a hydrosilation reaction between the carbon to carbon double bond and the Si—H entity, and the other associated with the ring opening of the oxetane.

Abstract translation: 线性或环状硅氧烷化合物含有碳 - 碳双键，Si-H键和氧杂环丁酮侧链官能团。 这些化合物具有两个固化温度，一个与碳与碳双键之间的硅氢化反应和Si-H实体相关，另一个与氧杂环丁烷的开环有关。