摘要:
An apparatus and method for wrapping a palletized load are provided. The apparatus preferably includes a film dispenser for dispensing a film web, at least one guide rollers configured to engage the width of the film web, and at least one roping element. The at least one roping element may be a cable rolling roper configured to roll a portion of the film web into a rolled cable of film. The apparatus may also include means for providing relative rotation between the load and the dispenser to wrap a roped portion of the film web around a base of the load/top portion of a pallet supporting the load.
摘要:
Cleaning of an ion implantation system or components thereof, utilizing a reactive cleaning reagent enabling growth/etching of the filament in an ion source of the arc chamber, by appropriate control of temperature in the arc chamber to effect the desired filament growth or alternative filament etching. Also described is the use of reactive gases such as XeFx, WFx, AsFx, PFx and TaFx, wherein x has a stoichioimetrically appropriate value or range of values, for cleaning regions of ion implanters, or components of implanters, in in situ or ex situ cleaning arrangements, under ambient temperature, elevated temperature or plasma conditions. Among specific reactive cleaning agents, BrF3 is described as useful for cleaning ion implant systems or component(s) thereof, in in situ or ex situ cleaning arrangements. Also described is a method of cleaning the forelines of an ion implant system for at least partial removal of ionization-related deposit from said forelines, comprising contacting said forelines with a cleaning gas wherein said cleaning gas is chemically reactive with said deposit. Also described is a method of improving the performance and extending the lifetime of an ion implant system, comprising contacting the cathode with a gas mixture.
摘要:
An apparatus and method for wrapping a palletized load are provided. The apparatus preferably includes a film dispenser for dispensing a film web, at least one guide rollers configured to engage the width of the film web, and at least one roping element. The at least one roping element may be a cable rolling roper configured to roll a portion of the film web into a rolled cable of film. The apparatus may also include means for providing relative rotation between the load and the dispenser to wrap a roped portion of the film web around a base of the load/top portion of a pallet supporting the load.
摘要:
A heat sealing device for sealing layers of plastic film together is provided. In a preferred embodiment, the heat sealing device is incorporated into a stretch wrapping apparatus for wrapping a load. The heat sealing device includes a heater element, an air compressor or blower, and a sealing head in fluid communication with the heater element to distribute the heated air. The sealing head is preferably flexible and includes a plurality of convection ports configured to apply heated air to a portion of the packaging material without being completely covered by the packaging material. At least one insulated film contact portion is provided to distance the convection ports from the plastic film.
摘要:
A leading end of packaging material is attached to a retainer to hold the leading end of the packaging material as the retainer moves toward the load. The retainer is positioned adjacent the load and packaging material is dispensed from a packaging material dispenser, and relative rotation is provided between the dispenser and a load to wrap packaging material around the load. The packaging material is released from the retainer in response to force applied to the retainer to withdraw it from the wrapped load.
摘要:
A method and apparatus for cleaning residue from components of semiconductor processing systems used in the fabrication of microelectronic devices. To effectively remove residue, the components are contacted with a gas-phase reactive material for sufficient time and under sufficient conditions to at least partially remove the residue. When the residue and the material from which the components are constructed are different, the gas-phase reactive material is selectively reactive with the residue and minimally reactive with the materials from which the components of the ion implanter are constructed. When the residue and the material from which the components are constructed is the same, then the gas-phase reactive material may be reactive with both the residue and the component part. Particularly preferred gas-phase reactive materials utilized comprise gaseous compounds such as XeF2, XeF4, XeF6, NF3, IF5, IF7, SF6, C2F6, F2, CF4, KrF2, Cl2, HCl, ClF3, ClO2, N2F4, N2F2, N3F, NFH2, NH2F, HOBr, Br2, C3F8, C4F8, C5F8, CHF3, CH2F2, CH3F, COF2, HF, C2HF5, C2H2F4, C2H3F3, C2H4F2, C2H5F, C3F6, and organochlorides such as COCl2, CCl4, CHCl3, CH2Cl2 and CH3Cl.
摘要翻译:一种清洁残留物的方法和装置,用于制造微电子装置中使用的半导体处理系统的组件。 为了有效地除去残留物,将组分与气相反应性材料接触足够的时间和足够的条件以至少部分地除去残余物。 当残留物和构成组分的材料不同时,气相反应性材料与残余物选择性反应,并与构成离子注入机的组分的材料具有最低的反应性。 当残留物和构成组分的材料相同时,气相反应性材料可以与残留物和组分部分反应。 使用的特别优选的气相反应性材料包括气态化合物如XeF 2,XeF 4,XeF 6,NF 3,IF 5,IF 7,SF 6,C 2 F 6,F 2,CF 4,KrF 2,Cl 2,HCl,ClF 3,ClO 2,N 2 F 4,N 2 F 2,N 3 F, ,NH2F,HOBr,Br2,C3F8,C4F8,C5F8,CHF3,CH2F2,CH3F,COF2,HF,C2HF5,C2H2F4,C2H3F3,C2H4F2,C2H5F,C3F6和有机氯化物,如COCl2,CCl4,CHCl3,CH2Cl2和CH3Cl。
摘要:
Cleaning of an ion implantation system or components thereof, utilizing temperature and/or a reactive cleaning reagent enabling growth/etching of the cathode in an indirectly heated cathode for an ion implantation system by monitoring the cathode bias power and taking corrective action depending upon compared values to etch or regrow the cathode.
摘要:
Disclosed herein is a suspension system and adjustment mechanism for an integrated chip held in a clamping or similar assembly and a related method for same. The suspension system Includes a pressure plate member adapted to fit compatibly within the clamp assembly. A hinge assembly applies and releases pressure through the pressure plate member. The hinge assembly has a first open position where pressure is released and a second closed position where pressure is applied. A spring member between the pressure plate member and the hinge assembly has predetermined travel limits controlling the amount of pressure to be applied. In an exemplary embodiment of the invention disclosed herein the suspension system includes an adjustment mechanism which adjusts to the pressure to a fine degree. The adjustment mechanism includes a housing which applies and releases pressures in response to the turning of a control knob. The control knob is connected to a gear apparatus within the housing which responds to the movement of the control knob by moving the housing.
摘要:
Disclosed herein is an apparatus that relates to a device useful in integrated chip (IC) testing apparatus. More particularly, the device is an adjustable clamp assembly which allows a variety of different sized IC's to be used with a single piece of test equipment. The clamp assembly includes a frame, a base and a plurality of clamps. Each clamp is movably connected to the base to allow movement in the x-y directions and each of the clamps includes an z-direction adjustment mechanism. Additionally, the device according to this invention also includes an adapter having opposed adapters which are designed for compatible mating with a mechanized handlers. In an exemplary embodiment, the adapter has a suspension system designed for quiet mechanized handling of the IC while being held by the clamp assembly.
摘要:
A leading end of packaging material is attached to a retainer to hold the leading end of the packaging material as the retainer moves toward the load. The retainer is positioned adjacent the load and packaging material is dispensed from a packaging material dispenser, and relative rotation is provided between the dispenser and a load to wrap packaging material around the load. The packaging material is released from the retainer in response to force applied to the retainer to withdraw it from the wrapped load.