摘要:
Cleaning of an ion implantation system or components thereof, utilizing a reactive cleaning reagent enabling growth/etching of the filament in an ion source of the arc chamber, by appropriate control of temperature in the arc chamber to effect the desired filament growth or alternative filament etching. Also described is the use of reactive gases such as XeFx, WFx, AsFx, PFx and TaFx, wherein x has a stoichioimetrically appropriate value or range of values, for cleaning regions of ion implanters, or components of implanters, in in situ or ex situ cleaning arrangements, under ambient temperature, elevated temperature or plasma conditions. Among specific reactive cleaning agents, BrF3 is described as useful for cleaning ion implant systems or component(s) thereof, in in situ or ex situ cleaning arrangements. Also described is a method of cleaning the forelines of an ion implant system for at least partial removal of ionization-related deposit from said forelines, comprising contacting said forelines with a cleaning gas wherein said cleaning gas is chemically reactive with said deposit. Also described is a method of improving the performance and extending the lifetime of an ion implant system, comprising contacting the cathode with a gas mixture.
摘要:
Cleaning of an ion implantation system or components thereof, utilizing temperature and/or a reactive cleaning reagent enabling growth/etching of the cathode in an indirectly heated cathode for an ion implantation system by monitoring the cathode bias power and taking corrective action depending upon compared values to etch or regrow the cathode.
摘要:
Cleaning of an ion implantation system or components thereof, utilizing temperature and/or a reactive cleaning reagent enabling growth/etching of the cathode in an indirectly heated cathode for an ion implantation system by monitoring the cathode bias power and taking corrective action depending upon compared values to etch or regrow the cathode.
摘要:
A method and apparatus for cleaning residue from components of semiconductor processing systems used in the fabrication of microelectronic devices. To effectively remove residue, the components are contacted with a gas-phase reactive material for sufficient time and under sufficient conditions to at least partially remove the residue. When the residue and the material from which the components are constructed are different, the gas-phase reactive material is selectively reactive with the residue and minimally reactive with the materials from which the components of the ion implanter are constructed. When the residue and the material from which the components are constructed is the same, then the gas-phase reactive material may be reactive with both the residue and the component part. Particularly preferred gas-phase reactive materials utilized comprise gaseous compounds such as XeF2, XeF4, XeF6, NF3, IF5, IF7, SF6, C2F6, F2, CF4, KrF2, Cl2, HCl, ClF3, ClO2, N2F4, N2F2, N3F, NFH2, NH2F, HOBr, Br2, C3F8, C4F8, C5F8, CHF3, CH2F2, CH3F, COF2, HF, C2HF5, C2H2F4, C2H3F3, C2H4F2, C2H5F, C3F6, and organochlorides such as COCl2, CCl4, CHCl3, CH2Cl2 and CH3Cl.
摘要翻译:一种清洁残留物的方法和装置,用于制造微电子装置中使用的半导体处理系统的组件。 为了有效地除去残留物,将组分与气相反应性材料接触足够的时间和足够的条件以至少部分地除去残余物。 当残留物和构成组分的材料不同时,气相反应性材料与残余物选择性反应,并与构成离子注入机的组分的材料具有最低的反应性。 当残留物和构成组分的材料相同时,气相反应性材料可以与残留物和组分部分反应。 使用的特别优选的气相反应性材料包括气态化合物如XeF 2,XeF 4,XeF 6,NF 3,IF 5,IF 7,SF 6,C 2 F 6,F 2,CF 4,KrF 2,Cl 2,HCl,ClF 3,ClO 2,N 2 F 4,N 2 F 2,N 3 F, ,NH2F,HOBr,Br2,C3F8,C4F8,C5F8,CHF3,CH2F2,CH3F,COF2,HF,C2HF5,C2H2F4,C2H3F3,C2H4F2,C2H5F,C3F6和有机氯化物,如COCl2,CCl4,CHCl3,CH2Cl2和CH3Cl。
摘要:
A method and apparatus for cleaning residue from components of semiconductor processing systems used in the fabrication of microelectronic devices. To effectively remove residue, the components are contacted with a gas-phase reactive material for sufficient time and under sufficient conditions to at least partially remove the residue. When the residue and the material from which the components are constructed are different, the gas-phase reactive material is selectively reactive with the residue and minimally reactive with the materials from which the components of the ion implanter are constructed. When the residue and the material from which the components are constructed is the same, then the gas-phase reactive material may be reactive with both the residue and the component part. Particularly preferred gas-phase reactive materials utilized comprise gaseous compounds such as XeF2, XeF4, XeF6, NF3, IF5, IF7, SF6, C2F6, F2, CF4, KrF2, Cl2, HCl, ClF3, ClO2, N2F4, N2F2, N3F, NFH2, NH2F, HOBr, Br2, C3F8, C4F8, C5F8, CHF3, CH2F2, CH3F, COF2, HF, C2HF5, C2H2F4, C2H3F3, C2H4F2, C2H5F, C3F6, and organochlorides such as COCl2, CCl4, CHCl3, CH2Cl2 and CH3Cl.
摘要翻译:一种清洁残留物的方法和装置,用于制造微电子装置中使用的半导体处理系统的组件。 为了有效地除去残留物,将组分与气相反应性材料接触足够的时间和足够的条件以至少部分地除去残余物。 当残留物和构成组分的材料不同时,气相反应性材料与残余物选择性反应,并与构成离子注入机的组分的材料具有最低的反应性。 当残留物和构成组分的材料相同时,气相反应性材料可以与残留物和组分部分反应。 使用的特别优选的气相反应性材料包括气态化合物如XeF 2,XeF 4,XeF 6,NF 3,IF 5,IF 7,SF 6,C 2 F 6,F 2,CF 4,KrF 2,Cl 2,HCl,ClF 3,ClO 2,N 2 F 4,N 2 F 2,N 3 F, ,NH2F,HOBr,Br2,C3F8,C4F8,C5F8,CHF3,CH2F2,CH3F,COF2,HF,C2HF5,C2H2F4,C2H3F3,C2H4F2,C2H5F,C3F6和有机氯化物,如COCl2,CCl4,CHCl3,CH2Cl2和CH3Cl。
摘要:
Disclosed herein is a suspension system and adjustment mechanism for an integrated chip held in a clamping or similar assembly and a related method for same. The suspension system Includes a pressure plate member adapted to fit compatibly within the clamp assembly. A hinge assembly applies and releases pressure through the pressure plate member. The hinge assembly has a first open position where pressure is released and a second closed position where pressure is applied. A spring member between the pressure plate member and the hinge assembly has predetermined travel limits controlling the amount of pressure to be applied. In an exemplary embodiment of the invention disclosed herein the suspension system includes an adjustment mechanism which adjusts to the pressure to a fine degree. The adjustment mechanism includes a housing which applies and releases pressures in response to the turning of a control knob. The control knob is connected to a gear apparatus within the housing which responds to the movement of the control knob by moving the housing.
摘要:
The present invention provides a method and apparatus for dispensing a predetermined fixed amount of pre-stretched packaging material based upon load girth. A non-rotating ring carries a belt driven by a motor. A packaging material dispenser is mounted on a rotating ring, and the rotating ring may include a pulley that connects to the band, such that the rotating ring is driven by the drive belt. Based upon the girth of the load to be wrapped, an amount of pre-stretched packaging material to be dispensed for each revolution made by the rotating ring is determined. Good wrapping performance in terms of load containment (wrap force) and optimum packaging material use is obtained by dispensing a length of pre-stretched packaging material that is between approximately 90% and approximately 120% of load girth. Once the amount of packaging material to be dispensed per revolution is determined, a ratio of rotating ring drive to final pre-stretch surface speed (i.e., number of pre-stretch roller revolution/rotating ring rotation) can be set and mechanically controlled. Thus, for each revolution of the rotating ring and dispenser, a predetermined fixed amount of packaging material is dispensed and wrapped around the load. In an alternative embodiment, the ratio is electronically controlled.
摘要:
An apparatus and method for wrapping a palletized load are provided. The apparatus preferably includes a film dispenser for dispensing a film web, at least one guide rollers configured to engage the width of the film web, and at least one roping element. The at least one roping element may be a cable rolling roper configured to roll a portion of the film web into a rolled cable of film. The apparatus may also include means for providing relative rotation between the load and the dispenser to wrap a roped portion of the film web around a base of the load/top portion of a pallet supporting the load.
摘要:
A film dispenser for a stretch wrapping apparatus is provided. The film dispenser includes a pre-stretch assembly having a top portion mounted to and extending downwardly from a drive plate of a roll carriage frame. The pre-stretch assembly includes two pre-stretch rollers having first ends connected to the roll carriage frame and second ends connected to one another. The pre-stretch rollers may be coated. The pre-stretch assembly further includes a cantilevered idle roller mounted to the drive plate and positioned between the pre-stretch rollers. A film path is defined by the space between the pre-stretch rollers and the idle roller. The film path is easily accessible via the bottom end of the pre-stretch assembly.
摘要:
Apparatuses and related methods of use are provided for the accumulation and wrapping of palletized loads with packaging material. In an exemplary embodiment of the present disclosure, the apparatus includes a low profile conveyor having non-powered conveying elements. In another embodiment, the apparatus is a stretch wrapping system for wrapping palletized loads. The stretch wrapping system may include a dispenser, a means for providing relative rotation between the dispenser and the load to be wrapped, a low profile conveyor, and a powered pusher assembly for moving the loads.